[News] Samsung, SK Hynix and Micron Ramp Up HBM Production, Reportedly Doubling Output Next Year

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According to a report from Commercial Times, SK Hynix, Samsung, and Micron, the world’s top three memory manufacturers, are actively investing in high-bandwidth memory (HBM) capacity expansion plans. Industry sources cited by the same report estimate that by 2025, the additional production will reach approximately 276,000 units, bringing the total capacity to 540,000 units, an annual increase of 105%.

Regarding the latest developments in HBM, TrendForce indicates that HBM3e will become the market mainstream this year, with shipments concentrated in the second half of the year.

Currently, SK Hynix remains the primary supplier for HBM, along with Micron, both utilizing 1beta nm processes and already shipping to NVIDIA. Samsung, using a 1alpha nm process, is expected to complete qualification in the second quarter and begin deliveries mid-year.

Regarding major memory players’ expansion plans on HBM, Samsung is gradually upgrading its Pyeongtaek facilities (P1L, P2L, and P3L) in South Korea to be used for DDR5 and HBM. Meanwhile, the Hwaseong facilities (Line 13, 15, and 17) are being upgraded to the 1α process, retaining only a small portion of capacity at the 1y/1z process to meet the demands of specialized industries such as aerospace.

SK Hynix produces HBM at its M16 production line in Icheon, South Korea, and is upgrading its M14 production line to the 1α/1β process to supply DDR5 and HBM products. Additionally, after receiving clearance from the U.S. government, its Wuxi plant in China is actively upgrading from the 1y/1z process to the 1z/1α process for producing DDR4 and DDR5 products.

Micron’s HBM production is conducted at its Hiroshima plant in Japan, with capacity expected to increase to 25,000 units in the fourth quarter of this year. In the long term, Micron plans to introduce EUV processes (1γ, 1δ) and build a new cleanroom.

In the short term, Micron will utilize its production capacities at the Linkou and Taichung plants in Taiwan, increasing the proportion of 1β process. By the end of 2025, the total production for HBM is expected to reach around 60,000 units.

According to Commercial Times, the HBM production volume of the world’s top three manufacturers will maintain high growth for two consecutive years, with the global total wafer production volume expected to reach approximately 540,000 units per month by the end of 2025.

Read more

• [News] Samsung Establishes New HBM Team to Advance HBM3, HBM3e and HBM4 Development
• HBM3e Production Surge Expected to Make Up 35% of Advanced Process Wafer Input by End of 2024, Says TrendForce

(Photo credit: SK Hynix)