[News] Japan’s Rapidus to Receive First EUV in mid-December, with ASML Planning Service Center Nearby

---

---

According to a report from MoneyDJ, citing Nikkei, the EUV lithography equipment ordered by Rapidus is expected to arrive at New Chitose Airport in mid-December. The machine will be transported using multiple large cargo planes. This will mark the first introduction of EUV lithography equipment in Japan, a significant milestone for the country’s semiconductor industry.

The Japanese foundry Rapidus is constructing its facility in Chitose City, Hokkaido, with the goal of mass-producing 2nm chips by 2027. EUV lithography equipment, essential for producing the most advanced chips and costing several tens of billions of yen per machine, plays a critical role in this plan, as the report notes.

The report highlights that Rapidus intends to install multiple EUV machines in the future. To support these operations, ASML, the Dutch equipment manufacturer, will establish a service center in Chitose City.

As of October, construction progress for the Rapidus factory in Hokkaido had reached 63%, remaining on schedule, as mentioned by the report. In November, approximately 4,400 workers are currently involved in the project, and the facility is set to house over 200 machines, including EUV equipment.

Construction of Rapidus’ first factory in Hokkaido, named “IIM-1,” began in September 2023. The company plans to commence pilot production of 2nm chips in April 2025, with mass production expected to start in 2027.

In the long term, Rapidus has ambitious plans to expand its operations. According to the report citing Rapidus President Atsuyoshi Koike, if mass production of 2nm chips proceeds smoothly, the company intends to construct a second fab focused on producing 1.4nm chips.

Regarding clients for the 2 nm process, Koike mentioned during an October 3 press conference in Chitose City that, in addition to already disclosed companies, Rapidus is negotiating with 40 other firms, with potential announcements expected next year, as the report indicates.

Notably, on November 13, NVIDIA CEO Jensen Huang hinted at the possibility of outsourcing AI chip production to Rapidus. As reported by another report from Nikkei, Huang emphasized the importance of diversifying NVIDIA’s supply chain amid escalating U.S.-China tensions.

The report indicates that NVIDIA currently relies heavily on the Taiwanese semiconductor giant TSMC, underscoring the need for greater supplier diversity. Huang expressed optimism about Japan’s potential in semiconductor manufacturing, suggesting that a partnership with Rapidus could be a promising opportunity for future collaboration.

Read more

• [News] Rapidus Plans Second Plant for 1.4nm Process if 2nm Mass Production Proceeds Smoothly
• [News] Japan to Back Chip Industry with $65 bln Support Plan

(Photo credit: Rapidus)