[News] Global Developments in Advanced Packaging Projects

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Advanced packaging remains a hot topic, with multiple projects worldwide making significant progress.

TSMC Establishes First Advanced Packaging Zone

According to reports from Taiwanese media, TSMC has acquired 30 hectares of land in the Southern Taiwan Science Park to establish its first “Advanced Supply Chain Zone.” This zone will focus on advanced packaging to support the CoWoS/SoIC capacities of its upcoming AP7 (Chiayi) and AP8 (Tainan) fabs. TSMC is also organizing a development briefing for semiconductor supply chain companies and has invited dozens of long-term certified partners to participate.

USD 300 Million from U.S. CHIPS Act for Advanced Packaging Projects

Recent international reports indicate that the U.S. CHIPS Act will allocate USD 300 million to support advanced packaging projects in Georgia, California, and Arizona. These funds aim to drive the development of chiplet packaging technology and substrate manufacturing. Georgia’s Absolics, California’s Applied Materials, and Arizona State University will each receive up to USD100 million to advance their capabilities in substrates and packaging equipment.

HChiplet Launches Advanced Packaging Factory with a RMB 3 Billion Investment

On November 23, in Keqiao District, Shaoxing City, Zhejiang Province, China, HChiplet officially launched the first phase of its advanced packaging project. The total investment for the project is RMB 3 billion, covering 80 acres and planned in two phases. The first phase includes a production line with an annual capacity of 2 million large-sized AI chiplets, focusing on advanced GPU and CPU packaging. Upon full operation of the second phase, the project is expected to generate annual sales revenue of RMB 2 billion.

Qorvo Breaks Ground on Phase Two of RMB 3 Billion IC Packaging and Testing Project

On November 20, Qorvo held a groundbreaking ceremony for the second phase of its integrated circuit packaging and testing project in Dezhou, China. Located in the Tianqu Green Low-Carbon Semiconductor Industrial Park, the project will have a total investment of RMB 3 billion and a planned construction area of approximately 74,800 square meters. It is expected to be completed by the end of 2025.

According to official data, the project will introduce wafer-level and system-level advanced packaging production lines. Once fully operational, it is projected to achieve an annual output value of RMB 10 billion and significantly boost local foreign trade and the formation of a robust IC packaging and testing industry cluster.

Two Advanced Packaging Projects Signed at 2024 Haikou Investment Conference

On November 18, the 2024 China Haikou Industrial Investment Conference took place at the Hainan International Convention and Exhibition Center. Two advanced packaging projects were signed during the event:

– Ruichips’ Haikou Comprehensive Bonded Zone Packaging and Testing Base: The pre-process production line began operations on July 26, and work is underway to establish advanced packaging testing lines and smart manufacturing lines for large-scale applications.

– Hotchip’s Intelligent Manufacturing Project: Leveraging the park’s smart processing and manufacturing center, this project will build SiC chip advanced packaging lines and AMOLED module assembly lines.

Zhiship Signs $5.52 Billion Advanced Packaging Project

Recently, Zhiship signed a major contract in the Nantong High-Tech Zone in China, as part of a broader agreement involving nine key projects spanning semiconductors, next-generation photovoltaics, AI, and other industries. The total planned investment is RMB 5.52 billion.

Zhiship aims to provide integrated solutions for system-on-chip and module designs. The first phase of the project, with an investment of RMB 1 billion, will establish a production capacity worth RMB 2.5 billion to 3 billion annually.

Shanghai’s 12-Inch Advanced Packaging Project Completes Phase Two

Shanghai YIBU SEM recently completed the second phase of its advanced packaging and testing project, increasing its factory’s annual design capacity to 180,000 wafers.

The project, with a total investment of RMB 74.6 million, was developed in two phases. The first phase cost RMB 50 million and achieved an annual capacity of 60,000 12-inch wafers. The second phase, with an investment of RMB 14.6 million, added an additional capacity of 120,000 12-inch wafers annually.

(Photo credit: Ruichips)