[News] Apple Reportedly Teams Up with Broadcom to Develop AI Chip Using TSMC’s N3P Process

Commercial Times, citing a report from The Information, indicated that Apple is currently collaborating with Broadcom to develop its first server chip specifically designed for artificial intelligence (AI) computing, hoping to reduce its reliance on Nvidia. Reportedly, the chip will use TSMC’s N3P process.

The Information reported on the 11th that Apple has recently been actively cooperating with other tech companies to jointly develop AI chips, intending to reduce its dependence on chip giant Nvidia to avoid the long-term impact of market supply shortages and high prices on its business.

The Information, citing sources, revealed that Apple is currently working with Broadcom on a new chip codenamed “Baltra,” which is expected to enter mass production in 2026 and will be manufactured using TSMC’s N3P process to ensure the stability and efficiency of server deployment.

In 2023, Apple announced a new multi-billion-dollar agreement with Broadcom to develop 5G radio frequency chips in the United States.

As reported by Reuters, Apple announced at its annual developer conference in June that it plans to leverage its own server chips to power AI features across its product lineup.

The same Reuters report highlighted Apple’s recent success in developing custom chips for its devices. This includes the M-series of processors, which have replaced Intel chips in Mac computers.

(Photo credit: Apple)