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[News] Advanced Packaging: The Intensifying Strategic Game
With the rapid advancement of technologies such as artificial intelligence, high-performance computing, 5G, and autonomous driving, the semiconductor industry is undergoing unprecedented transformations. In this wave of technological innovation, packaging technology, often seen as the “unsung hero” of the semiconductor industry, is quietly driving electronic products toward higher performance, smaller sizes, and lower power consumption.
What key advanced packaging technologies are quietly changing the game?
Packaging technology, though seemingly inconspicuous, is the “unsung hero” of the semiconductor industry. From early simple packaging methods to today’s complex multi-dimensional integration, the evolution of packaging technology has closely followed the progress of semiconductor technology, continuously pushing electronic products toward stronger performance, smaller size, and lower power consumption.
The evolution of packaging technology has followed a path from DIP (Dual In-line Package) → QFP (Quad Flat Package) → BGA (Ball Grid Array) → POP (Package on Package) / SiP (System in Package) → WLP (Wafer-Level Packaging). As integrated circuits shrink further, the performance bottlenecks of traditional packaging methods—such as signal transmission speed, heat dissipation, and power management—are becoming evident. As a result, “3D packaging” and “System-in-Package (SiP)” technologies have emerged, stacking multiple chips and functional modules to increase integration while solving space constraints.
Historically, semiconductor packaging has evolved from wired to wireless connections, from chip-level packaging to wafer-level packaging, and from 2D to 3D packaging. The technologies can be categorized into wire bonding, flip-chip, wafer-level packaging, 2.5D packaging, and 3D packaging.
In recent years, advanced packaging has entered the stage of heterogeneous integration. By combining chips with different functionalities and requirements using precise processes, the industry is forming highly efficient and powerful systems. Key drivers of this trend include 2.5D/3D packaging, Chiplet technology, and FOWLP, addressing issues such as performance, power consumption, and integration.
2.5D/3D Packaging: Beyond Simple Stacking
2.5D and 3D packaging are among the hottest technologies today. Traditional 2D packaging involves placing chips flat on a substrate, while 2.5D and 3D packaging stack chips vertically, significantly enhancing integration and computational performance.
In 2.5D packaging, chips are connected via a silicon interposer, enabling efficient data exchange between chips and significantly improving bandwidth. This technology is widely used in data centers, high-performance computing, and GPUs. AMD’s Fiji GPU and Intel’s Ponte Vecchio GPU are examples of products employing 2.5D packaging.
3D packaging takes this a step further by stacking multiple chips vertically and connecting them using micro-bumps and Through-Silicon Vias (TSVs). By integrating multiple functional modules, 3D packaging dramatically boosts performance and integration. Examples include Intel’s True 3D packaging technology and Micron’s High Bandwidth Memory (HBM).
Chiplet: The Future of Heterogeneous Integration
Chiplet technology is another major breakthrough in packaging. By combining different chip modules (Chiplets) into a cohesive system, Chiplet technology enhances performance while reducing the complexity and cost of individual chip development.
A key feature of Chiplet technology is its use of high-speed interfaces—such as CXL, PCIe, and Infinity Fabric—to connect Chiplets, enabling high bandwidth and low-latency communication. AMD extensively uses Chiplet architecture in its Ryzen and EPYC processors, while Intel’s Foveros and EMIB technologies also incorporate Chiplet designs.
Industry experts believe Chiplet technology enables the flexible combination of chips with varying process nodes and functionalities, achieving “tailor-made” solutions suitable for high-performance computing, AI, and 5G base stations. This greatly enhances system flexibility and performance based on specific application needs.
FOWLP: Extreme Miniaturization
Fan-Out Wafer-Level Packaging (FOWLP) is an advanced packaging technology conducted at the wafer level, enabling smaller, more powerful packages. The term “Fan-Out” refers to interconnections spreading outward from the center of the chip. Compared to traditional BGA packaging, FOWLP integrates chips and substrates, implementing more functionalities through advanced processes. This technology is widely applied in mobile devices and wearable electronics. Examples include TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) and Fan-Out technologies.
FOWLP improves packaging density, reduces costs, and offers superior heat dissipation, making it ideal for mobile devices, consumer electronics, and low-power, high-efficiency applications.
The Competitive Landscape: Momentum in Advanced Packaging
The rise of AI has driven growth in HBM and advanced packaging technologies. This has led to fierce competition among companies. Industry giants like TSMC, Samsung, and Intel continue to lead the advanced packaging field, while companies such as JCET, HT-TECH, and Tongfu Microelectronics are also accelerating their efforts to gain a competitive edge.
Overall, from corporate strategies to technological breakthroughs, advanced packaging is reshaping the semiconductor industry’s landscape. Whether for automotive electronics, AI, 5G, or high-performance computing, technologies such as 2.5D/3D packaging, Chiplet, and FOWLP are designed to meet demands for higher performance, lower power consumption, and smaller size.
Notably, the industry is evolving toward higher performance, greater integration, and more complex structures, with intensified competition in areas such as automotive-grade chip packaging, high-end storage, AI chip packaging, and 3D integration. These trends reflect shifting market demands and signal an accelerated pace of innovation in the semiconductor industry.
(Photo credit: AMD)
