TSMC’s first fab in Kumamoto, Japan, is set to commence mass production by the end of 2024. According to a report from Commercial Times, citing Nikkei, the initial orders are expected to be supplied to Sony Group and Denso Corporation.
According to Yuichi Horita, President of Japan Advanced Semiconductor Manufacturing (JASM), TSMC’s first fab in Kumamoto has entered the final stages of preparation for mass production, adding that the production line will deliver the same quality as those in Taiwan, the reports note.
The Commercial Times report suggests that the new facility, with a planned monthly capacity of 55,000 wafers, will first supply logic chips to Sony and Denso, featuring 22/28nm and 12/16nm processes.
Notably, TSMC’s second fab in Kumamoto is scheduled to begin mass production by the end of 2027, extending its process capabilities to 6/7nm. As per Commercial Times, the plant’s layout is under planning currently, with the construction expected to start in the first quarter of 2025. Together, the two plants (Kumamoto Plant 1 and Plant 2) are projected to achieve a combined monthly capacity of over 100,000 wafers, the report adds.
As per the reports, to ensure the smooth mass production of the two plants in Kumamoto, JASM has hired over 3,400 employees locally. JASM, according to the reports, will also work to strengthen the local semiconductor supply chain, aiming for 60% of components to be sourced domestically by 2030.
Yuichi Horita reportedly told Nikkei that for now, over 45% of the components in the Kumamoto fab has been sourced locally, while the proportion is expected to reach 50% by 2026.
As for the timetable of TSMC’s third fab in Japan, a previous report from Kyoto news noted that the projected timeline may be after 2030, citing Taiwanese Minister of Economic Affairs J.W. Kuo.
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(Photo credit: TSMC)