[News] TSMC Rumored to Begin FOPLP Production with Smaller Substrates, with Mini Lines Prepared by 2026

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Amid the booming demand for advanced packaging used in AI chips, TSMC Chairman C.C. Wei confirmed in the July earnings call that the company has been working on a mini production line for FOPLP (Fan-Out Panel Level Packaging), with achievements expected within three years.

Now here’s the latest update: The Taiwanese foundry giant has reportedly set an initial specification for the FOPLP substrate size, as it prefers the 300x300mm size instead of the rumored 515x510mm, as per Taiwanese media outlet MoneyDJ.

Equipment suppliers are said to be working closely on the development of the technology, with the mini line expected to be set up by 2026 at the earliest and ramping up gradually in 2027, the MoneyDJ report indicates.

According to industry sources cited by MoneyDJ, TSMC initially favored a rectangular substrate size of 515mmx510mm. However, it chose to adopt the 300mx300mm eventually because of the “Cost of Ownership” (COO) factor and the maximum reticle size that can be supported.

As larger substrate sizes not only exacerbate issues with warping but also lead to higher risks of damage during transportation and packaging process transitions, TSMC is said to start with the 300x300mm size, the MoneyDJ report notes, adding that it may look to increase the PLP packaging substrate size as technologies progress in the future.

TSMC introduced the FOWLP (Fan-Out Wafer Level Packaging) technology named InFO (Integrated Fan-Out) in 2016, first used in the iPhone 7’s A10 processor. Subsequently, the demand for FOPLP solutions is on the rise, as customers are attracted to more cost-effective solutions. The rising global demand for AI chips, which continues to pressure advanced packaging capacity, is also fueling the need for FOPLP.

In addition to TSMC, Intel and Samsung have also been advancing in this area. Samsung currently offers advanced packaging services such as I-Cube 2.5D packaging, X-Cube 3D IC packaging, and 2D FOPKG packaging. For applications requiring low-power memory integration, such as mobile phones or wearable devices, Samsung already provides platforms like fan-out panel-level packaging and fan-out wafer-level packaging.

Intel, on the other hand, is planning to launch the industry’s first glass substrate solution for next-generation advanced packaging, with mass production scheduled between 2026 and 2030.

Read more

• [News] Packaging and Equipment Firms Accelerate FOPLP Deployment: Spotlight on 7 Taiwanese Companies
• [News] TSMC and Samsung: Close Combat on FOPLP, with Different Panel Materials for Packaging

(Photo credit: TSMC)