According to a report from TechNews, citing Korean media outlet The Bell, sources on December 26 indicate that Qualcomm’s “Snapdragon 8 Elite 2,” scheduled for release in the second half of 2025, will be produced using TSMC’s third-generation 3nm (N3P) process. Samsung reportedly had competed for this contract but ultimately lost out.
The Bell highlights that Samsung Electronics is struggling to secure major clients for its semiconductor foundry business. These challenges have persisted for several years, as Qualcomm has shown interest in diversifying its foundry suppliers, but no agreements have been reached.
Samsung was once Qualcomm’s largest AP manufacturer, monopolizing production until the Snapdragon 8 Gen 1 in late 2021, as The Bell points out. However, yield issues arose, and TSMC took over production starting with the improved Snapdragon 8+ Gen 1. Most recently, Qualcomm’s Snapdragon 8 Elite, released this year, was manufactured using TSMC’s second-generation 3nm (N3E) process.
Meanwhile, The Bell points out that Qualcomm APs are becoming increasingly dominant in Samsung’s flagship smartphones. Reportedly, the upcoming Galaxy S25 series will exclusively feature Snapdragon 8 Elite chips, presenting a challenge for Samsung’s Foundry Division, System LSI Division (chip design), and MX Division (mobile devices).
Though Samsung reportedly failed to secure the order for Qualcomm’s “Snapdragon 8 Elite 2,” the report notes that Qualcomm has entrusted Samsung with developing prototype chips for the “Snapdragon 8 Elite 3.” This chip will utilize Samsung’s 2nm process and is regarded as a pivotal project for the company’s foundry business.
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(Photo credit: TSMC)