[News] Micron Kicks off Construction on HBM Advanced Packaging Facility in Singapore for HBM3E Products

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Following Micron’s sequential doubling of HBM sales in the previous quarter, the U.S. memory giant is making strides in overseas expansion amid the AI boom. According to Micron’s press release, it breaks ground on a new HBM packaging facility in Singapore on January 8. With an estimated investment of USD 7 billion, the site is expected to handle its latest HBM3E products, as per The Business Times.

Notably, Micron states that operations for the new facility are set to begin in 2026, with significant capacity expansion planned for 2027 to meet growing AI demand.

The facility, which is adjacent to Micron’s existing Woodlands operations, will be the first of its kind in Singapore, as noted by the report from The Business Times.

At the groundbreaking event, Micron CEO Sanjay Mehrotra shared that talks about the advanced HBM packaging facility had been ongoing for months. He praised the government’s swift efforts in making the project a reality, the report adds.

According to Micron, the investment in HBM advanced packaging will extend through the decade, initially creating about 1,400 jobs with plans to expand the site and grow the workforce to around 3,000. The new positions will focus on packaging development, assembly, and testing operations.

Prior to the HBM expansion in Singapore, Micron has been actively ramping up its capacity domestically. In December, 2024, Micron announced its plan to invest USD 2.17 billion to expand its semiconductor facility in Virginia, according to Governor of Virginia. The investment will modernize the facility to manufacture specialty DRAM memory for use in industrial, automotive, aerospace, and defense sectors.

In September, 2024, Micron officially introduced the 12-Hi HBM3e memory stacks. As per a previous report from Tom’s Hardware, Micron’s HBM4 is expected to enter mass production in 2026, followed by HBM4E in 2027-2028.

Read more

• [News] Micron Clouded by Weak Q2 Outlook; High-volume HBM3E 8H Ships to Second Major Customer this Month
• [News] Micron Plans HBM4 Mass Production in 2026, Customized HBM4E to Launch in 2027-2028

(Photo credit: Micron)