[News] 13 Advanced Packaging Facilities to Expand Capacity Significantly by 2025

---

---

On January 16, Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding, officially inaugurated its new advanced packaging facility at the Tanzi Science Park. SPIL also announced that three additional advanced packaging facilities are set to expand production capacity by 2025.

In addition, ASE’s three advanced packaging plants in Penang, Malaysia, and Kaohsiung, Taiwan, along with TSMC’s four advanced packaging facilities in Taiwan and two major projects by HT Tech and WYsemi in China, bring the total number of advanced packaging facilities to 13. These facilities are expected to achieve significant capacity progress in 2025, with many projects set to ramp up production.

Siliconware Precision Industries (SPIL)

SPIL’s advanced packaging plant at the Tanzi Science Park was officially inaugurated on January 16. The facility has entered a phase of accelerated production to meet customer demand and aims to achieve time-to-market goals efficiently. The plant will advance the development and application of cutting-edge packaging technologies such as CoWoS.

SPIL is actively expanding its manufacturing capabilities. Besides the Tanzi facility, the Erlin plant in Changhua is undergoing expansion, and the Huwei plant in Yunlin is set to begin equipment installation this year. The Houli plant is still in the planning stages and awaits shareholder approval at a meeting scheduled for February 19, 2025. The Douliu plant remains in the preparatory phase, with no publicly disclosed investment scale information.

ASE Technology Holding

On January 19, 2024, ASE announced that its Malaysian subsidiary had invested MYR 69.696 million to acquire land use rights in the GBS Technology Park in Penang, Malaysia. Industry insiders believe this investment is focused on advanced packaging capacity expansion, with construction and expansion underway.

On January 16, 2024, ASE held an inauguration ceremony for its Penang Plant 4 and a new visitor center. Penang Plant 4 is dedicated to copper clip bonding and image sensor packaging lines and will also support advanced packaging products.

In August 2024, ASE announced that its subsidiary ASE Semiconductor had approved an investment of TWD 5.263 billion to purchase K18 facilities from Macroblock Construction. These facilities will primarily house wafer bumping and flip-chip packaging production lines.

On October 9, 2024, ASE Semiconductor held a groundbreaking ceremony for its K28 plant in Kaohsiung. The plant is expected to be completed in 2026 and will focus on expanding CoWoS advanced packaging and testing capacity.

TSMC

TSMC is actively expanding its advanced packaging facilities to strengthen its leadership position. Projects include the AP8 plant at the Southern Taiwan Science Park, the AP6B facility in Zhunan, the packaging plant at the Chiayi Science Park, and the AP5B facility in Taichung, all expected to achieve new milestones in 2025.

Chinese Manufacturers

Several advanced packaging projects in China are also noteworthy:

TF Microelectronics: On September 20, 2024, TF Microelectronics held a groundbreaking ceremony for its advanced packaging base in Nantong. With a total investment of CNY 7.5 billion, the project focuses on multi-layer stacking, flip-chip, wafer-level, and panel-level packaging, with full production scheduled for April 2029.

HT-Tech: A subsidiary, Jiangsu Pangu Semiconductor, plans a total investment of CNY 3 billion in its advanced packaging project, with partial production expected in 2025.

SJSEMI: With a total investment of CNY 10.09 billion, SJSEMI’s 3D multi-chip integration packaging project is expected to achieve a monthly capacity of 80,000 metal bump products and 16,000 3D multi-chip integrated packaging products.

JCET: The wafer-level microsystem integration high-end manufacturing project, a major project in Jiangsu Province for 2024, has a total investment of CNY 10 billion. Once Phase 1 is completed, it will produce 6 billion high-end advanced packaging chips annually.

WYsemi: WYsemi is building a 3D wafer stacking advanced packaging production line in two phases, with Phase 1 involving an investment of CNY 2.37 billion. Initially scheduled for completion by the end of 2024, it will establish the first domestic 12-inch wafer-level advanced packaging line.

FHEC: In January 2025, the company announced plans to issue convertible bonds to raise no more than CNY 1.2 billion for multi-dimensional heterogeneous advanced packaging technology R&D and industrialization projects. Once fully operational, the facility will have an annual production capacity of 90,000 units of Fan-out and 2.5D/3D heterogeneous advanced packaging products.

(Photo credit: ASE)