[News] TSMC Chairman C.C. Wei: U.S. Capacity Fully Booked Through 2026, Sparking $100B Investment

After announcing a $100 billion investment in the U.S., TSMC Chairman C.C. Wei held a press conference earlier today at Taiwan’s presidential office to explain the company’s decision behind the multi-billion-dollar commitment

He revealed that TSMC’s U.S. capacity is fully booked through 2025 and 2026, with demand continuing into 2027, prompting the move.

Wei emphasized that TSMC’s strategy has always been to build production lines based on customer demand, with the current high demand in the U.S. being the key factor driving this decision.

According to TSMC’s press release, this move underscores TSMC’s dedication to supporting its customers, including America’s leading AI and technology innovation companies such as Apple, NVIDIA, AMD, Broadcom, and Qualcomm.

Wei also mentioned other factors influencing the investment, such as costs, talent recruitment, and local utilities.

At the press conference a couple of days ago, President Trump called Wei the most important person in the room. Today, Taiwan’s President Lai Ching-te also recognized Wei as the key figure present.

TSMC’s $100 billion investment will fund five new semiconductor plants in the U.S., bringing its total U.S. investment to $165 billion. The funds will support five advanced fabs in the country, including three new fabs, two advanced packaging facilities, and a major R&D center.

TSMC’s first Arizona fab has begun mass production of 4nm chips in 4Q24, while the second fab is expected to be operational by 2028, utilizing more advanced nodes such as 3nm, 2nm, and A16 based on customer demand.

Read more

• [News] TSMC Scales up U.S. Investment with $100B More, Adding Five New Chip Facilities in Coming Years
• [News] TSMC’s U.S. Investment Could Lead to 15% Price Hike, with AMD and NVIDIA Cheering on the Expansion

(Photo credit: Taiwan’s Office of the President)