[News] Intel Reportedly Taps SuperFluid Cooling for NVIDIA’s Next-Gen Servers, Boosting Taiwanese Suppliers

With NVIDIA launching GTC 2025 and the anticipated debut of GB300, liquid cooling is back in the spotlight. Intel is also ramping up its efforts in the sector, reportedly partnering with Taiwanese suppliers to co-develop its proprietary SuperFluid cooling technology, according to Economic Daily News.

Notably, the report suggests that Team Blue’s SuperFuild, first introduced in 2023, aims to tap into the promising cooling market for NVIDIA’s next-generation AI servers.

The report indicates that Intel’s solution has been verified to handle the thermal challenges of AI chips consuming 1,500W per chip, making it well-suited for NVIDIA’s upcoming GB300, which is expected to reach 1,400W.

What is SuperFluid?

According to the report, Intel’s SuperFluid has now enhanced the cooling capability of cold plates and can be applied to non-conductive dielectric fluids, eliminating the risk of leaks associated with traditional liquid cooling.

Another report from mashdigi highlights that Intel’s SuperFluid cooling draws inspiration from Mitsubishi Heavy Industries’ bubble-based method for reducing water resistance. Likewise, SuperFluid technology is said to generate bubbles in the coolant, enhancing flow speed and heat dissipation.

Expands Cooling Partnerships in Taiwan

While Taiwanese suppliers provide key components like UQD (Universal Quick Disconnect) for NVIDIA’s AI servers, Intel is also strengthening ties with local firms on cooling solutions. According to Economic Daily News, Intel recently hosted the “2025 SuperFluid Advanced Cooling Technology Conference” in Taiwan, attracting over 500 industry professionals.

Among them, Taiwanese component makers Microloops and Yen Sun Technology stole the spotlight, showcasing products integrated with Intel’s SuperFluid technology. Both companies supply compatible components and develop related applications for the solution, as per the report.

As noted by TrendForce, NVIDIA plans to launch the GB300 system after 2Q25, which is expected to deliver even greater compute density, therefore driving the demand for liquid cooling further.

TrendForce anticipates that GB300’s total system power consumption will increase to 135-140 kW from GB200 NV72’s 125-130kW per rack, with cooling solutions continuing to rely primarily on a Liquid-to-Air approach to ensure efficient heat dissipation.

Read more

• [News] NVIDIA to Unveil GB300 at GTC, with Shipment Reportedly to Begin in May, Driving Cooling Demands
• [News] NVIDIA’s CoWoS Orders Reportedly Face Decline Concerns as Hopper Ends, Market Awaits GB300 Boost

(Photo credit: Intel)