[News] NVIDIA’s Jensen Huang: Samsung’s HBM3E Likely to Power Blackwell Ultra

As NVIDIA rolls out its next-gen GB300 AI chip, memory giants are racing to secure HBM3E supply deals. While SK hynix has reportedly secured a 12H HBM3E contract for the chip, NVIDIA CEO Jensen Huang expressed optimism that Samsung’s HBM3E could be used in Blackwell Ultra, according to Yonhap news and Munhwa news.

Citing Huang, the reports note that NVIDIA looks forward to Samsung’s participation in the product, set for launch in the second half of 2025, highlighting its ability to integrate base dies with ASICs and memory.

The information aligns with an earlier Alpha Economy report, which suggests that Samsung is likely to secure qualification from NVIDIA between late May and early June. The company has recently earned high marks in the post-processing review of its redesigned HBM, as per the report.

Not long ago, at CES 2025, Huang stated that Samsung’s HBM3E was undergoing testing and was expected to succeed but noted that a new design was needed.

Anyhow, Samsung still has to work hard to narrow the gap with its archrivals. SK hynix, as NVIDIA’s primary HBM supplier, is already providing 8-layer and 12-layer HBM3E chips to NVIDIA.

Yesterday, SK hynix announced that it has shipped the world’s first 12-layer HBM4 samples to major customers, eyeing for NVIDIA’s next-gen flagship product, Rubin.

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(Photo credit: NVIDIA)