[News] SK Hynix Disclosed Details Regarding HBM4e, Reportedly Integrating Computing and Caching Functionalities

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As the demand for AI chips keeps booming, memory giants have been aggressive in their HBM roadmaps. SK hynix, with its leading market position in HBM3e, has now revealed more details regarding HBM4e. According to reports by Wccftech and ET News, SK hynix plans to further distinguish itself by introducing an HBM variant capable of supporting multiple functionalities including computing, caching, and network memory.

While this concept is still in the early stages, SK hynix has begun acquiring semiconductor design IPs to support its objectives, the aforementioned reports noted.

According to ET News, the memory giant intends to establish the groundwork for a versatile HBM with its forthcoming HBM4 architecture. The company reportedly plans to integrate a memory controller onboard, paving the way for new computing capabilities with its 7th-generation HBM4e memory.

By employing SK hynix’s technique, the package will become a unified unit. This will not only ensure faster transfer speeds due to significantly reduced structural gaps but also lead to higher power efficiencies, according to the reports.

Previously in April, SK hynix announced that it has been collaborating with TSMC to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4 slated to be mass produced from 2026, in the initiative.

As more details relating to HBM4 have been revealed now, the memory heavyweight seems to extend its leading market position in HBM3 by addressing the semiconductor aspect of the HBM structure, Wccftech said.

According to TrendForce’s analysis earlier, as of early 2024, the current landscape of the HBM market is primarily focused on HBM3. NVIDIA’s upcoming B100 or H200 models will incorporate advanced HBM3e, signaling the next step in memory technology. The current HBM3 supply for NVIDIA’s H100 solution is primarily met by SK hynix, leading to a supply shortfall in meeting burgeoning AI market demands.

In late May, SK hynix has disclosed yield details regarding HBM3e for the first time. According to a report from the Financial Times, the memory giant has successfully reduced the time needed for mass production of HBM3e chips by 50%, while close to achieving the target yield of 80%.

Read more

• [News] SK Hynix Revealed Progress for HBM3e, Achieving Nearly 80% Yield
• [News] SK Hynix Partners with TSMC to Strengthen HBM Technological Leadership

(Photo credit: SK hynix)