SK hynix, the current High Bandwidth Memory (HBM) market leader, announced on August 6th that it has signed a non-binding preliminary memorandum of terms with the U.S. Department of Commerce to receive up to USD 450 million in proposed direct funding and access to proposed loans of USD 500 million a...

Per a report from Reuters, Intel is said to be receiving the second new High-NA EUV equipment from ASML, costing EUR 350 million (~USD 383 million). According to Intel's earnings call on August 1, CEO Pat Gelsinger stated that Intel began receiving the first large equipment in December, and the i...

With the chip war between the two great powers heating up, the U.S. is reportedly mulling new measures to limit China’s access to AI memory. As the restrictions might be imposed as early as late August, rumor has it that Chinese tech giants like Huawei and Baidu, along with other startups, are sto...

Despite recent issues with NVIDIA's GB200 shipments, the market remains optimistic about long-term AI demand, and CoWoS capacity continues to be in short supply. According to a report from MoneyDJ, TSMC will assign orders of the initial stage of chip stacking in CoWoS packaging, Chip on Wafer (Co...

According to a report from Nikkei on August 5, RS Technologies, a global giant in recycled wafers, has announced that due to increased orders, it will expand the monthly production capacity of its Japanese and Taiwanese plants to 580,000 wafers by 2024. Despite the Japanese plant operating at ful...