According to a report from Economic Daily News, TSMC's advanced packaging platform SoIC is said to have secured another heavyweight customer, with Apple expected to adopt the technology in 2025. If confirmed, Apple will join AMD as a major client expanding its use of TSMC's SoIC . TSMC has categ...

As semiconductor manufacturing enters the Angstrom Era, there have been significant adjustments in architecture and circuit design. To free up more surface area on chips, moving power delivery to the backside has become a mainstream consensus, making the Backside Power Delivery Network (BSPDN) the...

According to TrendForce's latest memory spot price trend report, the spot price of DRAM has finally seen a slight raise as supply for DDR4 and DDR5 tightens. Samsung has allocated more of its 1alpha nm production capacity to the manufacturing of HBM products, which leads to DDR5’s price increase. ...

While NVIDIA is likely to face accusations from the French antitrust regulators, the Non-NVIDIA Alliance like the UALink (Ultra Accelerator Link) Alliance and the UXL Foundation are reportedly launching a counterattack, significantly increasing their efforts in developing specialized ASICs. Accor...

According to a report from Commercial Times, Arthur Chiao, Chairman of Winbond, stated that this upward market cycle for the memory sector has arrived on time. Reportedly, customers are not worried about shortages, and all products made by Winbond will sell well all year round, boosting the momentum...