TSMC's advanced CoWoS packaging capacity is in severe shortage, and just as the new plant in the Chiayi Park of Southern Taiwan Science Park began construction for expansion, according to a report from Economic Daily News citing sources, it has stated that TSMC intends to build another advanced pack...

Recently, it was reported that to meet the increasing demand for memory chips driven by the artificial intelligence (AI) boom, both Samsung Electronics and Micron set about ramping up their memory chip production capacity. Samsung plans to restart construction of the new Pyeongtaek plant (P5) infras...

TSMC is said to be entering the fan-out panel-level packaging (FO-PLP) sector, according to a previous report from Nikkei. Now, a report from Business Korea noted that Samsung is making significant strides in the PLP field, as the tech giant acquired the PLP business from Samsung Electro-Mechanics a...

The U.S. Department of Commerce announced on June 24 the expansion of SelectTalentUSA, a joint initiative with the Departments of Labor and Education. The program, designed to provide technical assistance to foreign businesses in delivering recruitment and training programs for their U.S. workforce,...

Orders for thermal compression (TC) bonders from South Korean semiconductor equipment manufacturers are experiencing a surge, fueled by Samsung Electronics and SK Hynix ramping up their high-bandwidth memory (HBM) production. TC bonders play a pivotal role in HBM production by employing thermal comp...