According to the latest report by TheElec, though Samsung has been using thermal compression (TC) bonding until its 12-stack HBM, the company now confirms its belief that hybrid bonding is necessary for manufacturing 16-stack HBM. Regarding its future HBM roadmap, Samsung reportedly plans to prod...

According to a report from South China Morning Post, Wang Tao, Executive Director, Chairman of the ICT Infrastructure Managing Board at Huawei, recently stated at the World Semiconductor Conference and Nanjing International Semiconductor Expo that Huawei's advanced Ascend 910B AI chip achieves an ef...

The ongoing tightening of US restrictions on China's access to advanced chips and production equipment may have significant impact on China's semiconductor development progress. According to a report from Liberty Times, a top executive at Huawei, a Chinese tech giant, admitted that China's ambitious...

MediaTek is making further strides in AI applications, focusing on the integration of smartphones and AR/MR devices. According to a report from the Economic Daily News, they look to capitalize on the significant business opportunities presented by 3D imaging combined with generative AI for immersive...

The continuous increase in silicon content driven by AI servers, high-performance computing (HPC) applications, and the AI integration of high-end smartphones has led to a surge in demand for semiconductors. According to a report from the Economic Daily News, major companies such as Apple, Qualcomm,...