Semiconductors


2024-06-11

[News] Intel Reportedly Utilizes Sharp’s LCD Panel Factory for Semiconductor Backend Process

Converting LCD panel factories into semiconductor bases seems to emerge as one of the latest trends in the semiconductor industry. According to a report by Nikkei News, Intel plans to utilize Sharp's LCD panel factory in Japan, and collaborate with Japanese companies to develop semiconductor product...

2024-06-07

[News] VIS, NXP to Build a 12-Inch Fab, Indicating Singapore’s Semiconductor Industry Concentration Further Enhances

Due to the impact of international situations and uncontrollable factors, the global semiconductor supply chain is undergoing a shift. According to a report from WeChat account DRAMeXchange, the Southeast Asian region, with its advantages in labor and development conditions, has become the preferred...

2024-06-07

[News] Qualcomm Reportedly Targets Data Centers as Its Next Step, Expecting Products to Adopt Nuvia

Last year, Qualcomm entered the PC market, sparking an AI PC frenzy in collaboration with Microsoft Copilot+. According to Qualcomm CEO Cristiano Amon, beyond mobile devices, PCs, and automotive applications, Qualcomm is now focusing on data centers. In the long term, these products will eventually ...

2024-06-07

[News] SEMI Statistics Show Global Semiconductor Equipment Sales Shrink in Q1; Taiwan Experiences Sharp Decline, China Doubles

The latest data released by the International Semiconductor Industry Association (SEMI) has shown that due to the sharp decline in the Taiwanese and North American markets, global semiconductor equipment billings contracted 2% year-over-year to US$26.4 billion in the first quarter of 2024. Accord...

2024-06-07

[News] The HBM4 Battle Begins! Memory Stacking Challenges Remain, Hybrid Bonding as the Key Breakthrough

According to a report from TechNews, South Korean memory giant SK Hynix is participating in COMPUTEX 2024 for the first time, showcasing the latest HBM3e memory and MR-MUF technology (Mass Re-flow Molded Underfill), and revealing that hybrid bonding will play a crucial role in chip stacking. MR-M...

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