Semiconductors


2024-05-14

[Insights] Trendforce: Foundry Capacity Market Share of Advanced Process to Decline in Taiwan, Korea until 2027, While US on the Rise

TrendForce’s latest findings revealed that as of 2024, Taiwan is expected to lead the global semiconductor foundry capacity in advanced manufacturing processes (including 16/14nm and more advanced technologies) with a 66% market share, followed by Korea (11%), US (10%), and China (9%). However, th...

2024-05-13

[News] Arm to Develop AI Chip Next Spring and Start Mass Production in Autumn 2025

SoftBank Group's global IP leader, Arm, has reportedly announced the establishment of an AI chip division with the goal of developing AI chip prototypes by spring 2025. According to a report from DRAMeXchange, mass production will be handled by contract manufacturers, with initial production slated ...

2024-05-13

[News] Samsung Reportedly to Challenge Apple/TSMC with 3nm Exynos W1000

According to a report from Korean media The Korea Economic Daily, Samsung Electronics Co. is planning to apply its 3nm process chips to its Galaxy series smartphones and smartwatches, posing a challenge to rivals Apple and TSMC. The report cited industry sources on May 13th, stating that Samsung'...

2024-05-13

[News] Kumamoto Vying for TSMC’s Third Fab, Looking to Build Semiconductor Hub

Taiwan Semiconductor Manufacturing Company (TSMC) has planned to build two fabs in Kumamoto Prefecture, Japan. Kumamoto's newly appointed governor, Takashi Kimura, who took office in April, stated in an report from Bloomberg on May 11th that he would spare no effort to persuade TSMC to establish a ...

2024-05-13

[News] Samsung Considers to Manufacture NAND over 1000 Layers by Using Ferroelectric Materials

At its 2022 Tech Day, Samsung revealed the target to release advanced NAND chips with over 1000 layers by 2030. According to Wccftech, the South Korean memory giant now seems to get closer to the ambitious goal, as it plans to apply new ferroelectric" materials on the manufacturing of NAND. At th...

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