Following NVIDIA's launch of the new computing platform GB200, as per a report from Commerical Times, Taiwanese supply chain players including Quanta, Pegatron, Wiwynn, Wistron, Gigabyte, and Foxconn’s subsidiary Ingrasys have showcased their solutions and related cooling technologies based on the...

DRAM Spot Market: The spot market has not changed noticeably from the previous week and still lacks significant demand momentum. Therefore, spot prices of DDR4 and DDR5 chips have maintained a mostly flat to slightly downward trend. Module houses also hold a conservative demand outlook, so they h...

As TSMC and Intel slow down their plans for building fabs in the United States, the supply chain, according to a report from Nikkei Asia, is also said to delay in following suit, with semiconductor material suppliers like Topco Scientific, LCY Chemical, and Chang Chun Group among those named. Per...

Driven by the AI chip wave, "advanced packaging" emerges as the hottest technology in the semiconductor industry. Its significance extends beyond computational power demands, as the escalating cost of semiconductor processes and the limits of Moore's Law make the "integration capability" of advanced...

The semiconductor industry enters the era of integration. Various foundries are focusing on advanced packaging technologies, but the terminology surrounding advanced packaging can be daunting. This article aims to explain these terms in the simplest way possible. According to a report from TechNe...