Recently, U.S.-based memory giant Micron Technology announced the groundbreaking of a new HBM (High Bandwidth Memory) advanced packaging facility in Singapore. This facility will be the first of its kind in Singapore and is scheduled to begin operations in 2026. Starting in 2027, Micron’s advan...

According to a report from ijiwei, citing Bloomberg, previously in 2022 STMicroelectronics and GlobalFoundries announced a EUR 5.7 billion investment plan to construct a wafer fabrication plant in France. However, this joint venture project has since stalled. Meanwhile, ijiwei notes that while cons...

According to a report from MoneyDJ, citing Nikkei, global leading semiconductor companies have reduced their investment due to weak demand and overcapacity in semiconductors for electric vehicles (EVs) and smartphones despite the robust demand for AI-related semiconductors. Notably, this marks the...

A couple of days ago, U.S. Commerce Secretary Raimondo stated that TSMC has started the production of advanced 4nm chips in Arizona, as per Reuters. Now the information seems to get confirmed, as a latest Nikkei report notes that Apple is nearing the final stages of verifying its first "made in Amer...

According to Reuters, citing The Information, NVIDIA’s major customers, cloud service providers (CSPs) such as Microsoft, Amazon, Alphabet's Google, and Meta Platforms are reportedly scaling back orders of the company’s latest “Blackwell” racks due to overheating problems. Initial shipme...