Market reports suggest Nvidia's new product release cycle has shortened from two to a year, sparking intense competition among major memory companies in the realm of next-gen High Bandwidth Memory (HBM) technology. Samsung, SK Hynix, and Micron are fervently competing, with SK Hynix currently holdin...

The investment momentum of China's Big Fund Phase II shows no signs of slowing down, with its latest investment directed at Shanghai Huali Microelectronics Co., Ltd. (HLMC), a subsidiary of Huahong Group. According to Sina Finance's report, this substantial investment of up to USD 1 billion will ...

Memory prices continue to rise, with the world's top five memory chip manufacturers, including Western Digital (WDC), notifying their distributors and consumer customers on December 5th that they will shorten the quoting period for their two major products – HDD and NAND Flash memory. Instead, the...

Samsung, the Korean tech giant, has unveiled SAINT technology to counter TSMC's advanced CoWoS packaging, aiming to benefit from the surging AI market. Market reports reveal that Samsung is strategically procuring a substantial amount of 2.5D packaging equipment, indicating a keen awareness of the s...

As reported earlier, the global provider of outsourced semiconductor packaging and test services, Amkor, has been set to establish its presence in Arizona, USA, providing advanced packaging services for Apple chips manufactured by TSMC. According to reports from South Korean media, the alliance f...