According to a Wccftech report, citing Bloomberg, Huawei’s efforts to develop more advanced chips for AI have faced significant setbacks due to U.S. sanctions, making it unable to match the performance of even older NVIDIA products. The report notes that the sanctions have blocked Taiwan's TSMC...

Apple is anticipated to release its lightest and thinnest smartphone, the iPhone 17 Air, next year, featuring the A19 chip, according to MacRumors. Industry sources cited by Economic Daily News reveal that TSMC will likely remain Apple’s exclusive supplier for high-end processors. TSMC’s 3nm pro...

Is the thinner iPhone in history on the road? Apple Insider suggests that Apple’s new iPhone 17 lineup may debut a redesigned model with a remarkable thickness of just 6mm. Industry analysts cited by another report from the Economic Daily News are optimistic that TSMC will remain the sole processo...

On November 13, at Semicon Europe 2024 in Munich, Germany, China's silicon carbide (SiC) substrate manufacturer, SICC, announced the launch of the industry's first 300mm (12-inch) silicon carbide substrate. This marks a significant step into the era of ultra-large silicon carbide substrates. SICC...

According to a report from Wccftech, Super Micro Computer has taken steps to avoid a potential delisting from the Nasdaq exchange. The company has submitted a compliance plan and appointed BDO USA as its new auditor to meet Nasdaq’s disclosure requirements. The report notes that Supermicro has ...