As NVIDIA is gradually ramping up AI servers based on the B200 and GB200 platforms, the U.S. chip giant is expected to unveil its next-gen GB300 AI server product line at the GTC conference in March, 2025. According to a report from the Economic Daily News, NVIDIA has preliminarily finalized the ord...

GlobalWafers Secures $406 Million Subsidy for Expanding Advanced 12-Inch Silicon Wafer Production On December 18, GlobalWafers, a leading semiconductor silicon wafer manufacturer, announced that its U.S. subsidiaries, GlobalWafers America (GWA) and MEMC LLC (MEMC), have received direct subsidies ...

China has taken steps to assert state ownership over its rare earth materials necessary for semiconductor production by enacting a regulation that came into effect on October 1st. Also, the country's Ministry of Commerce announced on December 3rd that the export of dual-use items involving gallium, ...

While making strides in the HBM capacity expansion at its Cheongju M15X fab, SK hynix may have locked in another major client in addition to NVIDIA. According to South Korean media outlet The Elec, the memory giant has reportedly landed a substantial order to provide HBM to Broadcom. Sources cite...

Amid the booming demand for advanced packaging used in AI chips, TSMC Chairman C.C. Wei confirmed in the July earnings call that the company has been working on a mini production line for FOPLP (Fan-Out Panel Level Packaging), with achievements expected within three years. Now here’s the latest...