Recently, several 6-inch production lines have made significant advancements, focusing on third-generation semiconductor materials like silicon carbide (SiC) and gallium oxide (Ga2O3). NEXIC Successfully Completes First Wafer Batch in Its Fab On September 21, NEXIC announced that it had succes...

According to The Hindu, India, under a transformative partnership with the U.S., is set to establish its first national security semiconductor fabrication plant. This facility will produce chips for military hardware in both nations, as well as for critical telecommunications and electronics network...

MediaTek announced on its official Weibo account that its next-generation flagship chip will be unveiled on October 9. According to TechNews, MediaTek's upcoming next-generation chip is the annual flagship smartphone processor, the Dimensity 9400. Based on the expected release date, it will be un...

A few weeks ago, Intel is said to be seeking assistance from the U.S. government, as CEO Pat Gelsinger reportedly turned to Commerce Secretary Gina Raimondo to emphasize the significance of U.S. chip manufacturing. Now here’s the latest development: according to a report by Bloomberg, the U.S. Hou...

In mid-August, TSMC had signed a contract with panel manufacturer Innolux to purchase its plant and facilities located in southern Taiwan, eyeing to further expand its advanced packaging capacity. According to a report by China Times, the fab, designated as the AP8 facility, is expected to start pro...