The iPhone SE series is Apple’s budget-friendly option, traditionally sourcing screens exclusively from the Chinese manufacturer BOE. However, a report from Korean media outlet The Elec indicated that Apple is expected to use LG Display (LGD) as the second supplier for the OLED screens of next year’s iPhone SE 4, while BOE remains the primary supplier for the iPhone SE 4 screens.

The iPhone SE series typically uses parts from older models but is unique in pairing them with the latest processors, ensuring superior performance compared to competitors in the same price range. Notably, Apple releases the iPhone SE series in emerging markets like India.

Per the same report from The Elec, the iPhone SE 4 is expected to use the OLED display from the iPhone 13, making it easier for display manufacturers to produce.

Apple has historically supported BOE as an iPhone OLED screen supplier to reduce the influence of South Korean companies like Samsung Display and LGD. However, BOE is said to have faced difficulties in securing large iPhone orders due to challenges in meeting Apple’s perforated screen technology requirements, as seen with the iPhone 15.

Moreover, BOE is reportedly encountering challenges in producing OLED screens for the iPhone 16 as well, resulting in lower output compared to its Korean competitors.

Earlier in May this year, both LG Display and Samsung Display secured orders for OLED panels for Apple’s iPhone 16 Pro, according to a previous report from “The Elec.” Subsequently, LG Display also has acquired orders for iPhone 16 Pro Max panels, which could be the first time ever for LG Display to be ahead of Samsung display.

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• [News] Novatek’s Supply Advantage Fades, as Korean Competitor Reportedly Secures iPhone 16 Order
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(Photo credit: Apple)

Recently, it was reported that Huawei filed a patent infringement lawsuit against MediaTek in a Chinese local court. According to a report from TechNews, in response, MediaTek and its subsidiaries, HFI Innovation and MTK Wireless, have initiated countermeasures by filing a lawsuit against Huawei in a UK court, accusing Huawei of patent infringement.

MediaTek has stated that the case against Huawei is now in the judicial process and has declined to comment further. On the other hand, Huawei has not publicly responded to the matter.

A report from Chinese media outlet YiCai further cited sources, revealing that the dispute between MediaTek and Huawei over patent fees has been continuing for two to three years, yet the two parties are still unable to reach an agreement due to pricing issues.

On July 18, a report from Nikkei indicated that Huawei had filed a patent infringement lawsuit against MediaTek in a Chinese local court, drawing industry attention. On July 19, MediaTek issued an announcement stating that the lawsuit has no significant impact on the company, that it has entered the judicial process, and that the company will not comment further.

Industry sources cited by TechNews further suggest that Huawei’s lawsuit against MediaTek for patent infringement likely involves 5G (and possibly 4G, 3G, etc.) cellular network mobile communication technology. Reportedly, the reason for the lawsuit is that Huawei proposed a corresponding fee to MediaTek based on terminal patent licensing prices, but MediaTek considered the price too high, leading to the impasse.

Notably, both Huawei and MediaTek hold a large number of related patents. As of the end of 2022, Huawei possessed over 120,000 validly authorized patents worldwide. According to another report from YiCai, it owns 20% of the world’s 5G and Wi-Fi 6 patents, 10% of 4G patents, and 15% of NB-IoT and LTE-M patents.

As for MediaTek, it held over 13,000 patents globally by the end of 2022, with 1,200 patents granted in that year alone. These figures only include granted patents, excluding pending applications. Additionally, MediaTek ranks first among Taiwanese companies in the number of global patents for 5G, Wi-Fi, and HEVC/VVC technologies.

Industry sources cited by the Commercial Times also note that in recent years, China’s technological capabilities have significantly improved, and companies have been actively applying for patents domestically and internationally. With the support of the Chinese government, they have also started to frequently engage in patent litigation. Last year, Chinese courts received 5,062 technical intellectual property and monopoly cases.

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(Photo credit: MediaTek)

According to a report from UDN, China’s largest semiconductor packaging and testing company, JCET, has completed the planning and verification work for the first phase of the “JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project.”

The project will soon be completed and put into production. Once operational, it will have an annual production capacity of 6 billion high-end advanced packaging chips, providing one-stop services from collaborative packaging design to chip production for 5G, artificial intelligence, and other applications.

As per WeChat account DRAMeXchange citing sources, the project is a major industrial initiative in Jiangsu Province, China, with a total investment of CNY 10 billion. Upon completion of the first phase, the project will have an annual production capacity of 6 billion high-end advanced packaging chips.

The project will focus on leading-edge high-performance packaging technologies, such as 2.5D/3D high-density wafer-level packaging. JCET Microelectronics commenced construction of its new plant in the eastern part of Jiangyin City on July 29, 2022, with the project expected to be completed and put into production between June and July 2024.

At the groundbreaking ceremony in 2022, JCET CEO Zheng Li stated that this project will represent the highest production technology level and largest single-investment smart manufacturing project in China’s integrated circuit packaging and testing and chip manufacturing industry. Thus, it will support end applications such as 5G, artificial intelligence, the Internet of Things, and automotive electronics, covering key strategic customers worldwide.

This project, per Li, will further enhance JCET’s global market competitiveness in the chip manufacturing sector, aiming to achieve a higher industrial position in the global integrated circuit industry.

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(Photo credit: JCET Group)

Chinese tech giant Huawei, which plans to launch its Mate 70 Series in the fourth quarter, is reportedly to feature the latest Kirin 9100 processor in these models. Though there were rumors indicating that the chip will be manufactured with SMIC’s 5nm node, according to a report by Wccftech, the next Kirin SoC for the Mate 70 Series will still be limited to SMIC’s 7nm process.

Kirin 9100’s predecessors, the Kirin 9000S and the Kirin 9010, have been mass-produced using SMIC’s 7nm (N+2) technology, the report notes. As market speculations previously indicated that Huawei might use 5nm in its next Kirin SoC, there seems to be a twist in Huawei’s plans.

According to Wccftech, the next Kirin SoC for the Mate 70 series will likely be mass-produced using SMIC’s N+3 process, which offers higher density compared to the N+2 variant. The move means that instead of transitioning to SMIC’s 5nm, Huawei’s latest Kirin SoC may choose to stay with 7nm.

It is worth noting that even under the U.S. export control, SMIC is said to successfully produce 5nm chips using DUV lithography instead of EUV, which is typically required for 5nm production. However, as the high cost and low yield of DUV make it a challenging feat for most manufacturers, Huawei’s decision may be practical.

As previously reported by the Financial Times, industry sources have indicated that SMIC’s prices for 5nm and 7nm processes are 40% to 50% higher than TSMC’s, while the yield less than one-third of TSMC’s. Later, it was estimated that SMIC’s 5nm chip prices would be up to 50 percent more expensive than TSMC’s on the same lithography, meaning that Huawei would face a tough time selling its Mate 70 series to consumers with a decent margin if it attempts to absorb a majority of those component costs.

Therefore, Wccftech now states that the Kirin 9100 might be fabricated using the 7nm process. By employing the N+3 node, it could achieve a higher density than the Kirin 9010 and the Kirin 9000S, which are manufactured by the N+2 node. This improvement means that the Kirin 9100 will have a higher transistor count, leading to better performance per watt and improved power efficiency.

Alongside the new chipset for the Mate 70 family, Huawei is rumored to be testing the same N+3 technology for its ARM-based hardware, the report notes.

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• [News] Huawei Reportedly to Launch Kirin 9100 with Superior Performance to Snapdragon 8 Gen 2
• [News] SMIC Reportedly to Manufacture 5nm Chips for Huawei Without EUV Machinery

(Photo credit: Hisilison)

Earlier on July 10^th, in the Galaxy Unpack 2024 event in Paris, Samsung introduced its AI smartphone Galaxy Z Fold6 and Galaxy Z Flip6, along with the “Google Gemini” app installed in the models. However, according to the reports by Reuters and Business Korea, these two tech giants may be facing the investigation of the European Union (EU) antitrust regulators, on whether the collaboration might impede market access for other AI developers or limit competition.

It has been a while since the two tech heavyweight started to team up on AI. Samsung’s first AI phone, Galaxy S24, released earlier this year, has featured its self-developed AI, Gauss, as well as Google’s Gemini Nano.

The EU has ramped up its market monitoring efforts following the implementation of the Digital Markets Act (DMA) in March, focusing on major global tech companies. The DMA identifies seven companies—Google, Amazon, Apple, Meta, Microsoft, Booking and ByteDance —as ‘gatekeepers’ and imposes specific regulations on them to ensure fair competition in the digital market, Business Korea noted.

Now the spotlight has been shifted to the AI sector. According to Reuters, EU antitrust regulators are inquiring whether Google’s multi-year generative AI deal with Samsung hampers rival chatbots on Samsung smartphones. The report noted that last month, the European Commission announced it would send requests for information to understand the impact of the deal, which involves Samsung embedding Google’s Gemini Nano in its Galaxy S24 series smartphones.

According to the Reuters report, regulators are investigating if the pre-installation of Gemini Nano limits the functionality of other chatbots and applications on Samsung smartphones. The EU also asked companies whether they had attempted to enter into pre-installation agreements with Samsung for their chatbots and, if so, requested explanations for any failures. Respondents are required to complete the urvey by this week.

If anti-competitive practices are confirmed, an antitrust investigation against Google and Samsung could be initiated, Reuters stated.

According to Business Korea, after the Galaxy Unpacked 2024 event, TM Roh, President of Samsung Electronics (Head of MX Business Division), addressed regulatory risks during a press conference, saying the company is having various discussions internally and externally regarding EU regulations.

Roh also emphasized Samsung’s commitment to data security, stating that sensitive information is processed on-device (without connecting to external servers), making it inaccessible even to the company,” and highlighted the company’s approach to giving consumers the choice of using AI functions on-device or via the cloud.

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• [News] NVIDIA Faces Potential Antitrust Charges in France, U.S. and EU Close Behind
• [News] Samsung Rumored to Mass-Produce HBM4 with 4nm Process

(Photo credit: Samsung)