The Japanese Ministry of Economy, Trade, and Industry’s 2024 White Paper on International Economy and Trade reveals that in its examination of imported goods sources, over half of the import value for 1,406 product categories (accounting for over 30% of the total) comes from China. This figure is 1.5 times higher than that of the United States, which relies on China for only 567 product categories. Thus, Japanese media Nikkei’s report has highlighted that this data underscores Japan’s significant dependence on China within its supply chain.

According to Nikkei, Japan’s trade statistics for 2022 covered approximately 4,300 types of goods. The report indicates that nearly 40% of these products are highly dependent on a single import source, with China being the predominant supplier.

Specific data further hints that Japan’s highly dependent imports from China include laptops, air conditioners, organic chemicals, and rare-earth metals. Additionally, over 90% of Japan’s imported household appliances originate from China. Moreover, China serves as Japan’s primary supplier of phosphorus, a key raw material for fertilizer production.

The data also indicates that Japan imports 252 and 151 types of goods that are “highly dependent” on the United States and South Korea, respectively, ranking these countries second and third in terms of Japan’s import dependency. In contrast, other G7 members exhibit lower levels of dependency on single import sources compared to Japan.

Per Nikkei’s report, essential minerals, semiconductors, and fertilizers have been designated as critical goods by the Japanese government. The data in the latest White Paper indicates that Japan’s supply chain is significantly dependent on China, highlighting the importance of diversifying procurement sources and conducting risk assessments. Japan has already started implementing measures to reduce reliance on China in cooperation with the United States and Europe.

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(Photo credit: Lenovo)

According to a report from Commercial Times, Apple is said to have informed its suppliers and partners that it is confident in boosting sales of the upcoming iPhone 16, set to be released in the second half of this year, through the addition of AI features. Reportedly, the goal is to increase iPhone 16 shipments by approximately 10% compared to the iPhone 15, reaching 90 million units in the second half of this year.

Apple showcased its advancements in AI at the annual Worldwide Developers Conference (WWDC) in June, including the introduction of the generative AI large model Apple Intelligence, AI upgrades for Siri, and collaboration with OpenAI. Apple is expected to launch Apple Intelligence in the U.S. market this fall, with full functionality projected to be available in the spring of next year.

Per sources cited by Bloomberg, Apple did not perform well in the second half of last year, particularly facing challenges in its third-largest market, China. Huawei’s Mate 60 Pro, equipped with a domestically manufactured 7nm processor, has gained favor among local consumers.

The same report from Bloomberg indicated that after a turbulent 2023, Apple is relying on AI services to boost demand for its new products. Data cited by Bloomberg shows that in the second half of last year, iPhone 15 shipments were approximately 81 million units.

Furthermore, for the first quarter this year, TrendForce reported that Apple also faced a decline in sales in the Chinese market, resulting in a drop in annual production to 47.9 million units. This decline prompted several adjustments within the component supply chain, although production plans for processor chips remained unchanged. TrendForce posits that the second quarter falls within a product iteration gap for Apple, and production is expected to decrease by approximately 10%. 

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• Q1 Smartphone Production Increases Due to Low Base Last Year, Expected to Decline 5–10% in Q2, Says TrendForce
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(Photo credit: Apple)

On July 8, Xiaomi Chairman Lei Jun announced on Weibo that the new generation Xiaomi smartphone smart factory in Changping, Beijing, has officially started operations. According to a report from Economic Daily News, the factory has a total investment of CNY 2.4 billion (roughly USD 330 million) and a construction area of 81,000 square meters, with an annual production capacity of 10 million flagship smartphones. Lei Jun also revealed that the upcoming Xiaomi MIX Fold 4/Flip foldable phones, set to be released this month, will be manufactured at this facility.

This year, Xiaomi has completed two smart factories: the Changping smartphone factory and the Yizhuang automobile factory.

In fact, information about Xiaomi’s new folding phone, the MIX Fold 4, has recently been leaked on Chinese internet platforms. Digital bloggers previously revealed that this phone is powered by Qualcomm’s Snapdragon 8 Gen 3 chip.

Reportedly,  this factory is said to be Xiaomi’s first large-scale self-owned smartphone factory. Its launch marks a crucial milestone in Xiaomi’s smart manufacturing journey.

According to the report, the factory boasts a 96.8% self-developed packaging equipment rate, 100% self-developed factory software rate, and holds over 500 patents. It focuses on producing flagship smartphones and operates 24/7, with a daily production capacity of up to 30,000 smartphones.

For the smartphone production in the first quarter of 2024, TrendForce reports that the global top six manufacturers by production market share were Samsung, Apple, Xiaomi, OPPO, Transsion, and Vivo. Together, these companies accounted for nearly 80% of the market share.

Xiaomi (including Xiaomi, Redmi, and Poco) has moved past last year’s high inventory issues, achieving a total production of 41.1 million units in the first quarter and ranking third globally in market share.

Xiaomi Group Partner and President Lu Weibing revealed that the Changping factory is Xiaomi’s first truly smart factory. Key verifications for the Xiaomi 14 Gulf Blue Limited Edition and the craftsmanship of the Xiaomi 14 Ultra were all carried out here.

On the other hand, per another report from Securities Times, Xiaomi’s automobile factory in Yizhuang, Beijing, started dual-shift production in June, with monthly deliveries exceeding 10,000 vehicles.

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(Photo credit: Xiaomi)

According to a report from Wccftech, Huawei’s Kirin 9100 processor is scheduled to be unveiled later this year, rumored to be manufactured using SMIC’s 5nm process. Its performance is reported to surpass that of the Qualcomm Snapdragon 8 Gen 2, and it will be featured in the entire Mate 70 series of smartphones.

The same report cited industry sources, suggesting that SMIC has successfully produced 5nm chips using DUV lithography instead of EUV, which is typically required for 5nm production. The high cost and low yield of DUV make it a challenging feat for most manufacturers. Fortunately, this breakthrough could help Huawei narrow the performance gap in its processors.

Reportedly, the Kirin 9100 is rumored to outperform the Snapdragon 8 Gen 2 overall and offer interface smoothness comparable to the Snapdragon 8 Gen 3. Huawei’s software optimization is anticipated to contribute significantly, as the company plans to launch HarmonyOS NEXT this year, completely moving away from the Google Android framework.

The report notd that switching to HarmonyOS NEXT has advantages, including memory usage that is three times more efficient than Android, and stringent resource consumption management. The new system can also be installed on older Huawei smartphones with previous-generation Kirin processors. Thanks to the 5nm process, the Kirin 9100 will also have improved energy efficiency. However, the actual performance will need to be verified once Huawei releases more detailed information.

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(Photo credit: Huawei)

MediaTek and Qualcomm’s new wave of 5G flagship smartphone chip competition will begin in the fourth quarter. MediaTek is launching the “Dimensity 9400” to directly compete with Qualcomm’s “Snapdragon 8 Gen 4.” According to a report from Economic Daily News, both major manufacturers are using TSMC’s 3nm process to produce their new chips, which have recently entered the production phase.

Alongside this, NVIDIA, AMD, and Apple are also actively seeking TSMC’s 3nm capacity, resulting in TSMC securing another order and seeing a surge in its advanced process business.

It is understood that the queue for TSMC’s 3nm process capacity has extended all the way to 2026. To ensure the smooth launch of the Dimensity 9400, MediaTek has already started production at TSMC to secure sufficient supply capacity. The 3nm process is currently the most advanced node technology. Previously, TSMC mentioned that its 3nm process capacity will triple this year, but it still remains in short supply.

At the beginning of this year, MediaTek CEO Rick Tsai announced that the Dimensity 9400 would be unveiled in the fourth quarter. He stated that its performance would far exceed that of the current flagship chip, the Dimensity 9300, and that it would represent another significant peak in their technology.

MediaTek’s current flagship Dimensity 9300/9300+ chips are built using TSMC’s 4nm process. Reportedly, it is expected that with the support of TSMC’s 3nm process, the performance of the Dimensity 9400 will be further enhanced, making it a powerful tool for MediaTek to capture the market.

Although Qualcomm has not yet announced the launch schedule and details of its next-generation flagship chip, the Snapdragon 8 Gen 4, the same report believed that this chip will also be produced using TSMC’s 3nm process and will be launched in the fourth quarter, with upgraded performance.

Ming-Chi Kuo, renowned Apple analyst, previously reported that the Snapdragon 8 Gen 4 will be produced using TSMC’s N3E process, and its price may be 25% to 30% higher than the current Snapdragon 8 Gen 3, with each chip priced at $220 to $240.

In the second half of the year, numerous AI products will be launched in the consumer market. Per industry sources cited in an earlier report from Commercial Times, besides Qualcomm’s Snapdragon 8 Gen 4 and MediaTek’s Dimensity 9400,  Apple’s A18 and M4 series are also said to be built using TSMC’s N3 family. Moreover, Google’s Tensor G5 may compete in the market as well.

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(Photo credit: Qualcomm)