On May 20th, Intel announced that the release date for its next-generation processor, Lunar Lake, has been moved up, with official shipments expected in the third quarter. The NPU performance is set to reach 45 TOPS. However, per a report from Economic Daily News, the industry is puzzled by the fact that this chip is bundled with 16GB and 32GB memory, with Intel holding the specification control tightly. Reportedly, this move has disrupted the industry order, and PC manufacturers are said to be privately expressing their dissatisfaction.

It is expected that 20 brands will release 80 models featuring this processor. Combined shipments of Metro Lake and Lunar Lake this year are projected to reach 40 million units. Unlike the previous generation, Lunar Lake’s packaging design integrates LPDDR5x memory into a single package, emphasizing low power consumption.

On May 20th, Microsoft launched its next-generation AI PCs, equipped with a more powerful AI assistant, Copilot, and new features. It also established a new standard for AI PC architecture, “Copilot+ PC.” The initial products all feature Qualcomm’s “Snapdragon X Elite” processors designed with Arm architecture.

Qualcomm’s CPUs in the new PCs are equipped with a Neural Processing Engine (NPE) designed specifically for AI applications, boasting 45 TOPS. This, as per another report from the Economic Daily News, results in a 58% increase in speed and extended battery life compared to Apple’s latest top-tier MacBook, which uses the M3 chip. Additionally, they support Microsoft’s AI chatbot, Copilot.

Intel, on the other hand, made a rare announcement, revealing that its next-generation Lunar Lake will have a total performance exceeding 100 TOPS, with the NPU alone exceeding 45 TOPS—nearly three times that of the previous generation. Additionally, the CPU and GPU combined computing power will exceed 60 TOPS, making it the second qualified processor for Microsoft’s Copilot+ PC platform.

However, it is important to note that according to Intel’s plans, the new generation processors Ultra 5/7/9 will be bundled with memory and shipped together with the CPU. Specifically, the high-end Ultra 9 will be bundled with 32GB of memory, while the Ultra 5 and Ultra 7 will have 16GB and 32GB versions. Per Microsoft’s recommendations, AI PCs need at least 16GB of memory. While Intel’s approach meets this requirement, it limits the ability of brands to adjust specifications and leaves memory manufacturers out of the loop.

In simpler terms, there is still a demand for 8GB memory in lower-end notebooks, and high-end laptops can require more than 64GB of memory. However, Intel’s Lunar Lake constraints make it difficult to plan both high-end and entry-level versions. Industry sources cited in the same report from Economic Daily News indicate that Intel’s next-generation Arrow Lake will not be bundled with memory.

Reportedly, industry sources also state that procurement contracts with memory suppliers have traditionally been long-term, accounting for annual memory requirements. Now, Intel’s bundling of memory with its single platform changes the industry’s ecosystem. Previously, PC brands would develop various combinations (CPU + memory + SSD capacity) for their product lines. However, with Intel defining five laptop CPU + memory specifications, it limits the customization capabilities of PC brands.

With Intel launching Lunar Lake early, AMD is set to counter with its next-generation AI processor Ryzen series named Strix Point in the fourth quarter. The Strix Point processor will feature AI processing power exceeding 50 TOPS, and there will also be an APU, Strix Halo, expected to launch around the end of the year with performance exceeding 60 TOPS, making it a significant player in AI computing power.

CEO Pat Gelsinger recently demonstrated the performance of the Lunar Lake processor, emphasizing that its total AI workload exceeds 100 TOPS, with the NPU contributing 45 TOPS. The CPU features Lion Cove architecture P-cores and Skymont architecture E-cores, while the GPU and CPU together provide over 60 TOPS of computing power. This means Intel’s chip AI performance will be more than three times that of current products, with a total combined performance exceeding 100 TOPS.

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(Photo credit: Intel)

Just as generative AI is revolutionizing industries worldwide today by creating new opportunities, the concept of the Metaverse in 2021 was similarly embraced by technology giants as a strategic goal and vision for the future of the entire tech sector.

Microsoft, for instance, targeted the corporate segment of the Metaverse, showcasing the use of its mixed reality (MR) device, HoloLens 2, in manufacturing operations. NVIDIA introduced the Omniverse platform for image simulation, thereby facilitating the development of virtual environments within the Metaverse. There were also rumors about Google and Apple launching new virtual reality (VR) head-mounted devices. Perhaps most notably, Facebook’s name change to Meta was a clear indication of its commitment to this emerging field.

As Hype Fades, More Hardware and Content Are Needed to Strengthen the Foundation of the Metavers

Despite initial market optimism, the reality was that wearable technology had not reached maturity, and the quality of virtual content experiences fell short of expectations. As a result, there was insufficient momentum to drive the Metaverse forward in subsequent market developments. Many tech companies established departments dedicated to the Metaverse, but due to lackluster results and issues with resource allocation, these departments often faced workforce reductions, downsizing, or even complete dissolution.

Declining enthusiasm for the Metaverse primarily stems not from a flaw in the idea of blending virtual and real worlds, but from the grandiosity of its concept. The essence of Industry 4.0, after all, revolves around enhancing production efficiency through the data-driven integration of physical and digital realms.

This is a proven approach. Nevertheless, the challenge with the Metaverse lies in its ambitious scale. Without adequate software and hardware support, efforts to expand and implement it often fall short, yielding minimal benefits and, thus, diminishing its commercial appeal.

Essentially, the widespread adoption of technologies like head-mounted devices and a rich content library are vital for industry growth. In response, companies that develop VR and augment reality (AR) in recent years have pivoted their focus from the broader environmental framework towards improving wearable devices and creating engaging content. In doing so, they aim to boost the practical value of adopting VR and AR.

From Virtual Interaction to Spatial Computing, the Scope of Applications for Head-mounted Devices Continues to Expand

In 2023, according to TrendForce’s analysis, Meta’s Quest series dominated the global VR and MR device market, securing nearly 70% of total device shipments. This significant market share places Meta at the forefront, with Sony’s PS VR series ranking second, followed by other manufacturers like PICO and HTC. Entering the fray in 2024, Apple introduced its Vision Pro, which is expected to claim a 6% share of the global market.

Meta’s latest offering, the Quest 3, has adopted pancake lenses that enhance image clarity while slimming down the device’s profile. It is powered by the Qualcomm Snapdragon XR2 Gen 2, a (SoC) tailored for head-mounted devices that significantly boosts GPU and AI processing capabilities.

The Quest 3 marks a pivotal shift for Meta from VR to MR. Equipped with dual front-facing RGB cameras and advanced features like depth projection and room mapping, the Quest 3, alongside the higher-end Quest Pro, supports a range of MR applications. Additionally, the tracking capabilities of the Quest 3 are augmented by computer vision and machine learning technologies. With Meta’s ongoing collaboration with LG on new product development, the focus is now on extended reality (XR) applications linked with the television ecosystem.

Apple’s Vision Pro, which was launched in February 2024, has reignited market interest in VR.

This device fills a previously unaddressed gap in Apple’s portfolio by offering a VR head-mounted device that integrates seamlessly with iPhones, iPads, and other devices within Apple’s ecosystem, thereby enabling functions like image and video projection onto larger screens. The introduction of the Vision Pro brought the concept of spatial computing into the limelight, enabling users to interact with virtual objects in a natural and intuitive way and thus infusing fresh perspectives into the industry.

Moreover, at CES 2024, Sony unveiled an XR head-mounted device dubbed a “spatial content creation system.” Like the Apple Vision Pro, this device leverages the advantages of spatial computing. It’s designed as a commercial tool for developing 3D content, offering users precise and intuitive control over virtual objects, thereby simplifying the process of creating 3D models.

From Taiwan, ASUS has recently introduced its first AR glasses, the AirVision M1. These glasses are designed to function as a secondary screen, ideal for use outdoors or in situations where extra screens are necessary at home.

Taiwan-based Companies Expand into the Supply Chain for Headsets, Focusing on Optics, Chips, and Assembly

TrendForce analyst P. K. Tseng said that a critical aspect of the transformation for VR head-mounted devices is the increasing need for key components that are lighter and more compact, particularly pancake lenses, which are gaining importance due to their contribution to volume reduction.

However, the technological complexity and higher cost of manufacturing these advanced optical components mean that suppliers, such as GSEO and Young Optics, are relatively limited. This presents a blue ocean market opportunity, likely attracting more manufacturers to develop pancake lens components.

Furthermore, the trend is expected to drive demand for smaller-sized panels. While mainstream LCD panels continue to be widely used, the advent of devices like the Apple Vision Pro is anticipated to increase the adoption rate of Micro OLED panels.

Additionally, as standalone virtual devices become more mainstream in product design, and as the need for processing large volumes of image and sensor data independently by SoCs grows, demand will rise for dedicated chips used in VR and AR devices. For instance, MediaTek is rumored to be developing an exclusive AR chip for Meta.

System or device assembly is a key area of focus for Taiwan-based companies, particularly evident in the efforts of major ODMs like Quanta and Foxconn. These companies are enhancing their VR and AR hardware manufacturing through various strategies, including partnerships, mergers and acquisitions, and investment initiatives.

In the VR device supply chain, the strength of system assemblers lies in their ability to offer comprehensive product solutions, which expands the options available to prospective clients. The assembly of VR and AR devices presents unique challenges due to the necessity for high-quality image rendering and real-time motion capture. Numerous components are involved in the process.

Not all VR and AR device brands can develop head-mounted devices completely in-house, as demonstrated by companies like Meta and Sony. For newer market entrants, securing a comprehensive product solution that allows for future customization is a more desirable strategy. This demands that system assemblers have significant expertise in relevant technologies and ODM capabilities. As such, as opportunities in the VR and AR market continue to emerge, these assemblers are well-prepared to offer solutions for head-mounted devices.

Generative AI and Added-Value from Applications Will Sustain Future Growth Momentum

Beyond hardware, the focus on creating more content and valuable applications will be a major topic in the next phase of VR industry’s development, with generative AI poised to play a pivotal role.

Taking gaming as an example, VR game development is known to be exceedingly time-consuming, requiring developers to dedicate substantial amounts of time to coding. As a result, the games often lack diversity, customization, and meaningful game mechanics.

However, leveraging generative AI can expedite the game development process without sacrificing quality or increasing costs. Recent market analyses suggest that the adoption of generative AI could significantly reduce the time required to create XR learning modules from the 5-10 days typically seen in 2021 to less than 30 minutes today.

Consequently, major game engine providers like Unity are seizing this business opportunity. In mid-2023, Unity introduced a suite of generative AI development solutions tailored for VR game production. These solutions can be employed to create characters, objects, assets, and sound effects, thus significantly reducing development costs.

According to TrendForce’s research, global shipments of VR head-mounted devices are projected to register a slight year-on-year drop of 1.8%, but the annual total is still expected to surpass 9.3 million units.

Furthermore, with the releases of many new products ranging from chips and peripherals to complete systems, many of which were showcased at this year’s CES and MWC, there is strong bullish sentiment regarding the development of the VR industry. The strategies of major manufacturers for VR and AR devices also demonstrate intense efforts to explore new use cases beyond existing applications, or to expand into other commercial sectors such as remote assistance, virtual learning, and simulation training.

Additionally, in many countries, VR and AR are now being incorporated into medical treatments, such as psychological therapy and physical rehabilitation. Although the progress in promoting VR and AR technologies still depends on factors like pricing, specifications, and user experience, the expansion into new application markets is a positive development, particularly given the current shortage of content.

Therefore, the added-value provided by new applications will be a key determinant of the VR market’s growth momentum. Furthermore, the efficiency of using generative AI in content production holds the potential to propel device manufacturers into the next technological generation.

Join the AI grand event at Computex 2024, alongside CEOs from AMD, Intel, Qualcomm, and ARM. Discover more about this expo! https://bit.ly/44Gm0pK

(Photo credit: Apple)

As the era of AI advances, following NVIDIA’s application to the Ministry of Economic Affairs (MOEA) for the “A+ Industrial Innovative R&D Program,”  which led to the establishment of the first R&D center in Asia and the creation of Taiwan’s largest AI supercomputer, “Taipei-1”, American AI chip giant AMD is set to follow suit.

According to a report from UDN, AMD plans to invest NTD 5 billion (roughly USD 155 million) to establish an R&D center in Taiwan and intends to apply for the A+ Industrial Innovative R&D Program from the MOEA, highlighting Taiwan’s critical role in AI chip design and manufacturing.

The MOEA has confirmed that AMD applied for the A+ Industrial Innovative R&D Program subsidy at the end of 2023. However, the funding for the program has already been exhausted. Therefore, funds must be allocated in the fifth phase of the A+ Industrial Innovative R&D Program, with the science and technology budget to be set for 2025.

This budget allocation must be approved by the new government administration. Additionally, MOEA officials stated that AMD must submit a concrete plan and gain approval from a review committee established by the Industrial Technology Department of the MOEA.

Previously, the MOEA’s substantial subsidies to global companies under the A+ Industrial Innovative R&D Program sparked mixed reactions within the industry. Some prominent local IC design companies criticized the MOEA, arguing that supporting global companies leads to competition against local businesses and drains valuable local R&D talent.

To avoid controversy, the MOEA has set forth four specific requirements for AMD.

First, they hope AMD will collaborate with Taiwanese IC design companies. Second, any AI servers developed should be manufactured in Taiwan. Third, at least 20% of the R&D workforce should be sourced from abroad, and high-level executives should be stationed in Taiwan. Fourth, AMD should partner with Taiwanese universities to cultivate talent jointly. The MOEA reports that AMD’s response has been very positive, and a thorough review of the application will take place in the second half of the year.

To date, the MOEA’s A+ Industrial Innovative R&D Program has approved subsidies only for two global companies, Micron and NVIDIA, providing them with NTD 4.722 billion (USD 146.48 million) and NTD 6.7 billion (USD 207.8 million), respectively. The MOEA believes this strategy helps solidify Taiwan’s competitive edge in the global semiconductor and AI sectors.

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(Photo credit: AMD)

As Apple keeps advancing in AI as well as developing its own in-house processors, industry sources indicated that the tech giant’s Chief Operating Officer (COO) Jeff Williams recently made a visit to TSMC, and was personally received by TSMC’s President, C.C. Wei, according a report by Economic Daily News.

The low-profile visit was made to secure TSMC’s advanced manufacturing capacity, potentially 2nm process, booked for Apple’s in-house AI-chips, according to the report.

Apple has been collaborating with TSMC for many years on the A-series processors used in iPhones. In recent years, Apple initiated the long-term Apple Silicon project, creating the M-series processors for MacBook and iPad, with Williams playing a key role. Thus, his recent visit to Taiwan has garnered significant industry attention.

Apple did not respond to the rumor. TSMC, on the other hand, has maintained its usual stance, not commenting on market speculations related to specific customers.

According to an earlier report from The Wallstreet Journal, Apple has been working closely with TSMC to design and produce its own AI chips tailored for data centers in the primary stage. It is suggested that Apple’s server chips may focus on executing AI models, particularly in AI inference, rather than AI training, where NVIDIA’s chips currently dominate.

Also, in a bid to seize the AI PC market opportunity, Apple’s new iPad Pro launched in early May has featured its in-house M4 chip. In an earlier report by Wccftech, Apple’s M4 chip adopts TSMC’s N3E process, aligning with Apple’s plans for a major performance upgrade for Mac.

In addition to Apple, with the flourishing of AI applications, TSMC has also reportedly beening working closely with the other two major AI giants, NVIDIA and AMD. It’s reported by the Economic Daily News that they have secured TSMC’s advanced packaging capacity for CoWoS and SoIC packaging through this year and the next, bolstering TSMC’s AI-related business orders.

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(Photo credit: TSMC)

Previously, the U.S. Department of Commerce revoked Intel and Qualcomm’s export licenses to Huawei, leading to speculation that they are now prohibited from collaborating with Huawei. According to a report from TechNews, Qualcomm anticipates that after 2024, it will no longer receive product revenue from Huawei but will continue to collect patent royalties.

As per a report from global media outlet tom’s Hardware, on May 7, 2024, the U.S. Department of Commerce informed Qualcomm that it was revoking the company’s license to export 4G and certain other integrated circuit products, including Wi-Fi products, to Huawei. a nd its affiliates and subsidiaries, effective immediately.Consequently, Qualcomm expects no product revenue from Huawei after this year.

According to TechNews, while Qualcomm used to provide processors to Huawei for use in its smartphones, Huawei’s HiSilicon division has developed its own chipsets, Kirin 9000 and 9010, therefore barely needing the support from Snapdragon processors.

Qualcomm reportedly noted in another statement that Huawei has recently launched new 5G-supported devices using its own IC products. Although Qualcomm can still sell IC products to Huawei under the current license, it does not expect to receive any product revenue from Huawei after this year.

Despite having its own processors, Huawei lacks the alternative for Intel’s Core or Xeon CPUs from PCs and servers, and will likely continue using them for the foreseeable future, according to tom’s Hardware. Meanwhile, Qualcomm may continue to collect patent royalties from Huawei and other Chinese smartphone manufacturers.

Qualcomm also mentioned that it has recently extended, renewed, or signed licensing agreements with several major OEMs. Negotiations are ongoing with key OEMs, including Huawei, for agreements set to expire at the beginning of fiscal year 2025.

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(Photo credit: Qualcomm)