TSMC's fan-out (InFO) packaging process will no longer be exclusively used by Apple. According to a report from Commercial Times, it's revealed that Google's self-developed Tensor chips for their phones will switch to TSMC's 3nm process next year and will also start using InFO packaging. TSMC...

Amid Apple's intention to reduce its dependence on China and promote India as another major iPhone production hub, Indian financial media outlet Moneycontrol has revealed in a report that Apple will manufacture the iPhone 16 Pro series in India, marking the company's first production of high-end mod...

The iPhone SE series is Apple's budget-friendly option, traditionally sourcing screens exclusively from the Chinese manufacturer BOE. However, a report from Korean media outlet The Elec indicated that Apple is expected to use LG Display (LGD) as the second supplier for the OLED screens of next year'...

Recently, it was reported that Huawei filed a patent infringement lawsuit against MediaTek in a Chinese local court. According to a report from TechNews, in response, MediaTek and its subsidiaries, HFI Innovation and MTK Wireless, have initiated countermeasures by filing a lawsuit against Huawei in ...

According to a report from UDN, China's largest semiconductor packaging and testing company, JCET, has completed the planning and verification work for the first phase of the "JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project." The project will soon be com...