Qualcomm is actively entering the AI PC market with a new processor unveiled on April 25th, reportedly featuring Arm architecture and produced on a 4nm process, igniting a new battle in non-x86 architecture AI PC processors.

Industry sources cited by the report from Economic Daily News have anticipated that TSMC is behind this new chip from Qualcomm. Following this trend, major players like Apple, NVIDIA, and MediaTek will continue to release Arm-based AI PC processors, all likely manufactured by TSMC.

Since 2018, Qualcomm has introduced a series of chips like Snapdragon 8cx, 7c, 8c platforms, 8cx Gen 2, and 8cx Gen 3, targeting always-connected and mobile PC domains. After years of preparation, they’re capitalizing on the AI wave, with last year’s launch of Snapdragon X Elite, produced on TSMC’s 4nm process. Yesterday, they further expanded with Snapdragon X Plus, aiming for a larger share of the AI PC market.

Qualcomm claims both Snapdragon X Elite and X Plus feature customized integrated Oryon CPUs, outperforming competitors with 37% higher CPU performance and a 54% reduction in power consumption. During last year’s Snapdragon Summit, Qualcomm introduced its in-house Oryon CPU, claiming that certain CPU performance metrics surpassed those of Intel and Apple chips.

Qualcomm previously mentioned that part of the Snapdragon X Elite’s GPU performance also surpasses competitors like AMD. Both Snapdragon X chips feature Hexagon neural network processors (NPU) capable of 45 trillion operations per second (TOPS), promising unprecedented performance, energy efficiency, and on-device AI capabilities for more Windows PCs.

Qualcomm emphasizes that the NPU’s performance supports new AI-optimized applications and features, including OBS Studio real-time captions, leveraging on-device Whisper functionality to instantly translate 100 spoken languages into 100 languages for live broadcasts.

According to Qualcomm’s official website, the Snapdragon X Elite features 12 cores with a maximum multi-thread frequency of 3.8 GHz, while the Snapdragon X Plus has 10 cores with a maximum frequency of 3.4 GHz.

Industry sources cited by the same report from Economic Daily News believe the Snapdragon X Plus will help Qualcomm capture the PC mainstream market. Qualcomm stated that OEMs are expected to launch PCs equipped with Snapdragon X Plus and Snapdragon X Elite starting from mid this year.

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(Photo credit: Qualcomm)

According to reports from global media outlets like MacRumors and Wccftech on April 23rd, Apple is said to be developing its first in-house AI processor for PCs, the M4 chip, and is also working on a self-developed AI server processor using TSMC’s 3-nanometer process, with plans for mass production expected in the second half of 2025.

As per Wccftech’s report, based on the production schedule, Apple’s AI server processor might utilize TSMC’s “N3E” process. It is rumored that the N3E process is also used for producing products like the A18 Pro, the upcoming Qualcomm Snapdragon 8 Gen 4, and the MediaTek Dimensity 9400, among other major clients’ products.

Regarding this matter, per a report from Economic Daily News citing sources, it has indicated that Apple’s development of AI server processors will bring new momentum to TSMC’s advanced process orders. Subsequently, assembly orders for related AI servers are expected to be undertaken by Foxconn, becoming two major benefactors of Apple’s aggressive push into AI among Taiwan’s manufacturers.

The source referenced previous reports suggesting that Apple has secured the initial capacity for TSMC’s 3-nanometer process for at least a year. According to TSMC’s financial reports, the revenue contribution from its largest customer exceeded NTD 500 billion in 2022 and is projected to reach NTD 546.5 billion in 2023, setting a new record. TSMC’s largest customer is, anticipated by the report from Economic Daily News, to be Apple.

The same report from Economic Daily News continues by quoting industry sources who revealed that Apple has conducted extensive AI functionality testing, which is highly confidential. Apple and Foxconn have reportedly been engaged in many projects and ongoing tests.

With Apple’s full-scale push into the AI field and plans to introduce AI features in this year’s new iPhone models, there are also rumors of Apple possibly launching its own developed AI chip.

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(Photo credit: Apple)

Samsung Display (SDC), a subsidiary of Samsung, has been developing its own OLEDoS (OLED on Silicon) technology. However, there are reports now indicating that Samsung’s smartphone division plans to adopt Sony’s OLEDoS technology for integration into Samsung’s XR devices.

According to the Korean media “The Elec,” Samsung’s MX division has decided to utilize the technology from Sony instead of the technology from the group’s SDC, reflecting Samsung’s need for a new technology manager to oversee new semiconductor devices (referring to electronic components, such as OLEDs and transistors).

This newly created position for device development must oversee the technological advancement of all of Samsung’s electronic businesses, including Samsung MX, DS (chip division), displays, and motors. If Samsung’s subsidiaries had collaborated closely from the outset, then Samsung’s MX division might have adopted SDC’s technology instead of Sony’s. A similar situation has also occurred with the glass substrate developed by Samsung Electronics.

“The Elec” believes it is strange that SDC has not collaborated with the group’s companies on OLEDoS technology, as SDC has expertise in glass processing. This highlights a lack of clear roles and responsibilities within Samsung, which is a significant waste of internal resources.

OLEDoS and glass substrate microdisplays require close cooperation between departments such as semiconductors, displays, circuit boards, and display glass processing technology. If these departments are well integrated, it could bring opportunities for Samsung, as the company has departments capable of handling all related technologies.

However, the current situation does not reflect this. SDC initiated the M project at the end of 2022, aimed at developing OLEDoS and LED on Silicon technology. But SDC losing to Sony now means the former will lose valuable production experience.

(Photo credit: Samsung)

TrendForce has released the latest panel quotations for late April. The upward trend in TV is beginning to stabilize due to the increased supply capacity; monitor (MNT) panel prices continue to rise in April as the demand remains strong; for notebook (NB) panel, amid challenges in forming a consensus for price increases, NB panel prices continue to hover at the bottom.

More details are as follows:

• TV

In April, signs of weakening demand for television panels have emerged, particularly evident in the weakening demand for TVs sized 55 inches and below. Only large-size TV panels of 65-inch and above continue to be supported by subsequent peak-season promotional stocking demands.

Meanwhile, panel manufacturers continue to operate at relatively high capacity levels. With increased supply capacity, the upward trend in panel prices is beginning to stabilize. In April, the expected price increases for TV panels include 1 USD for 32-inch, 43-inch and 50-inch; 2 USD for 55-inch; 4~5 USD for 65-inch and 75-inch.

• MNT

Driven by the price increases in TV panels, the MNT panel sector has seen panel manufacturers actively negotiating with customers in hopes of improving the profitability of MNT panels. Starting from March, they have successfully raised the prices of MNT panels.

Entering April, demand for consumer-grade models from some customers remains strong. The extended shipping times caused by the shipping crisis have forced some customers to increase inventory levels and stock up earlier. Additionally, the risk of capacity constraints due to the improved demand for TV panels still exists.

Therefore, it is expected that MNT panel prices will continue to rise in April, with the possibility of further expansion in price increases. For Open Cell panels, the prices for mainstream sizes like 23.8 inch and 27 inch are expected to rise by 0.7 USD. As for panel modules, the 21.5-inch and 23.8-inch are projected to increase by 0.5 USD, while the 27-inch is expected to increase by 0.4 USD.

• NB

After passing through the off-season in the first quarter, NB panel demand from brands remains weak entering April, without the expected strong rebound.

Due to this weak demand, there is a noticeable disparity among panel manufacturers regarding their stance on price increases. This disparity makes it challenging for panel manufacturers to create a rising price trend similar to that seen in TV and MNT panels. With a consensus on price increases difficult to form, NB panel prices continue to hover at a low point.

Looking at April, it is expected that only TN panel models, due to their lower prices, may see a slight increase of around 1 USD. IPS panel models are mostly expected to remain stable, while 16:10 panel models are anticipated to stay flat or decrease slightly by up to 0.2 USD.

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Apple has released its supply chain list for the 2023 fiscal year, with notable changes compared to the 2022 list. According to a report from CNA, Major IC substrate manufacturer Nan Ya PCB has returned to Apple’s supply chain list, while Nanya Technology, Lotes, Novatek are no longer included. TSMC, Foxconn, Advanced Semiconductor Engineering (ASE), Pegatron, Compal, Wistron, and YAGEO remain part of Apple’s supply chain.

Apple’s 2023 fiscal year supply chain list covers approximately 98% of the materials, manufacturing, and assembly related to Apple products globally.

Compared to the 2022 supply chain list, for Foxconn, the updated list shows manufacturing locations for Apple products in Guangdong, Henan, Jiangsu, Shaanxi, Sichuan, and Zhejiang provinces in China, with the addition of Jiangxi while Hubei continues to be excluded. In other global regions, locations in Amazonas and Sao Paulo in Brazil, as well as California in the United States, are not included in the current list. However, locations in Tamil Nadu, India, and Bac Giang province, Vietnam, remain on the list.

For ASE, related locations include Jiangsu and Shanghai in China, Yamagata Prefecture in Japan, Taiwan, and Hai Phong City in Vietnam, with Gyeonggi-do in South Korea and Singapore continuing to be excluded.

Notably, companies including FPGA designer Lattice Semiconductor’s facility in Taiwan, Nanya’s facilities in Jiangsu and Taiwan, Lotes Terminal’s facility in Guangdong, Novatek Microelectronics and Taiwanese company Triotek Technology Incorporated are no longer parts of Apple’s supply chain for the fiscal year 2023.

On the other hand, major IC substrate manufacturer Nan Ya PCB, with facilities in Jiangsu, China, and Taiwan, has returned to Apple’s supply chain list. Golden Arrow Printing Company, with locations in Jiangsu, China, and Henan Province, Vietnam, is a new addition to Apple’s supply chain list.

Regarding Taiwanese companies that were first included in Apple’s supply chain list in 2022, including Platinum Optics Technology Incorporated, Primax Electronics Limited with locations in Guangdong, Radiant Opto-Electronics Corporation with locations in Guangdong and Jiangsu, Trinseo in Taiwan, and Winbond Electronics Corporation, these companies remain on Apple’s supply chain list for the 2023 fiscal year.

Furthermore, major Taiwanese companies such as TSMC, Catcher, Foxlink, Compal, Compeq, Delta Electronics, Largan Precision, Lite-On Technology Corporation, Pegatron, Shin Zu Shing, TXC Corporation, Unimicron Technology Corporation, Unitech, Wistron, and YAGEO continue to be included in Apple’s supply chain list.

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(Photo credit: Apple)