The global laptop and PC market is experiencing a gradual recovery, driven by the growing trend of AI-powered PCs (AIPC). Consequently, as per a report from TechNews, the competition to enhance AI chip computing power has emerged as a key global focus. 

One of the competitors, Intel, during its Vision 2024 event, showcased its next-generation laptop chip, Lunar Lake. Intel CEO Pat Gelsinger stated that this chip will deliver over 100 TOPS (trillion operations per second) of AI performance, with the NPU alone contributing 45 TOPS. This marks a threefold increase in AI performance compared to Intel’s current generation of chips and meets the 45 TOPS NPU performance threshold previously set by Intel for the next generation of AI PCs.

Currently, Intel’s Meteor Lake processor NPU can only deliver 10 TOPS, which falls short of the standard required for the next generation of AI PCs. However, the NPU performance of Lunar Lake precisely meets the 45 TOPS standard.

Pat Gelsinger did not provide detailed breakdowns of the remaining 55+ TOPS performance between the CPU and GPU, but it can be reasonably speculated that the GPU contributes around 50 TOPS, while the CPU cores contribute 5-10 TOPS.

As for Intel’s competitors, AMD’s current-generation Ryzen Hawk Point platform offers NPU performance of 16 TOPS, which is also below Intel’s envisioned standard for the next generation of AI PCs.

However, AMD has recently indicated that their next-generation products will make significant breakthroughs to meet the demands of AI computing, incorporating a robust architecture with powerful CPU, GPU, and NPU components. This design philosophy has been consistent for AMD from the Ryzen 7040 series to the current 8040 series.

At an AI event in December last year, AMD unveiled the next-generation Ryzen Strix Point mobile processor featuring the XDNA 2 architecture, boasting a threefold increase in AI performance compared to the previous generation.

Yet, AMD has not provided detailed performance allocations for each component. Nonetheless, a simple calculation suggests that if the NPU performance triples, then the NPU performance of Ryzen Strix Point would reach 48 TOPS.

Qualcomm’s Snapdragon X Elite platform represents another competitor in the escalating competition, with chips based on ARM-based architecture scheduled to launch in mid-2024. Qualcomm has stated that its NPU performance will reach 45 TOPS, further heightening the competition among Intel, AMD, and Qualcomm for dominance in the next generation of AI computing.

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(Photo credit: Intel)

Earlier, Reuters reported that contract manufacturer Pegatron was in talks to sell its sole iPhone assembly plant in India to Tata Group, and discussions were in advanced stages. Regarding this matter, Pegatron told CNA reporters that this report was speculative and lacked evidence, declining to comment further.

According to a Reuters report on April 8, Pegatron was said to be considering selling its iPhone assembly plant located in Chennai, a major city in southern India, to Tata Group, India’s largest private enterprise. The negotiations were rumored to conclude within six months. If an agreement is reached, the two parties will establish a joint venture, with Tata Group holding a 65% stake to operate the plant, while Pegatron will retain a 35% stake and provide technical support.

Sources cited by Reuters also mentioned that Pegatron is building another iPhone assembly plant in the Chennai area, and discussions with Tata include acquiring control of this new facility. The negotiations between Tata and Pegatron are expected to conclude within six months, after which all Pegatron India plant employees will transition to the joint venture.

Amid rising geopolitical risks, tech giants are diversifying production away from China. Pegatron reduced its stake in its Kunshan plant to 37.5% in December, with Chinese Luxshare now leading. However, Pegatron emphasizes it won’t withdraw from China and plans to establish new facilities this year.

In recent years, Pegatron has been consistently expanding its global footprint, with expansions ongoing in Taiwan, Mexico, Indonesia, India, Vietnam, and other locations.

Currently, approximately 10% of Apple’s iPhone production capacity in India comes from Pegatron, with the vast majority of capacity originating from Foxconn’s iPhone assembly plant located in Karnataka.

Furthermore, Foxconn has the highest share in Apple’s current new iPhone assembly. Among the four iPhone 15 series models, only certain models like iPhone15 and iPhone15 plus are produced by Tata Group in India.

In January, Pegatron announced a USD 12 million investment to form a Malaysian subsidiary for consumer electronics. It’s also expanding its Mexican plant capacity, investing USD 75 million to boost its electric vehicle business.

(Photo credit: Apple)

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Currently, the global foldable phone market is dominated by non-Apple players, with Samsung and Huawei acting as the key players, continuously expanding their related product lines. Although Apple has yet to debut any foldable hardware, rumors cited by a report from Economic Daily News suggest they are actively working to catch up by accelerating product development.

Sources cited by the same report suggest that Apple is highly likely to launch its first foldable hardware product either this year or next year, potentially signaling a shift to a three-way competition in the foldable phone market.

Currently, Samsung and Huawei collectively hold over 80% of the global foldable phone market share, making them highly influential in the market. Industry sources cited by the report believe that with Apple entering the foldable phone market, a reshuffle is inevitable, offering consumers not only more product choices but also potentially lower prices compared to the current landscape.

It is reported that in the past, most foldable phones were priced starting at USD 1,000, with some flagship models even priced at USD 1,500. With Samsung and Huawei potentially introducing more affordable foldable phones this year, it is expected that foldable phones priced below USD 1,000 will become increasingly common in the future.

Industry sources cited by the same report point out that the battleground for mobile phone brands will still be in flagship models, as the specifications and features of flagship phones determine the technological prowess of the brand. Therefore, whether it’s Samsung, Huawei, or even Apple, they will all compete vigorously in this market.

The market for budget-friendly phones is currently not well-defined and is primarily in the early stages of development, focused on testing the waters. It is estimated that it will take another two to three years for this market segment to become more stable.

Same sources cited by the report suggest that with Samsung and Huawei continuously investing in the foldable phone market, Apple is pressured to launch a foldable phone to keep up and not fall behind. However, the biggest challenge lies in how Apple can launch a foldable phone later but still seize the initiative, potentially attracting loyal Apple fans without affecting the sales of existing iPhone models.

According to the analysis released by TrendForce in the second half of last year, Apple’s development in the folding field still requires time. Apple’s foray into foldables has been tepid, to say the least.

Yet, Apple’s unwavering obsession with user experience could be the culprit. Furthermore, persistent challenges with foldable tech—think panel evenness and hinge design—might be holding them back.

But here’s the kicker: Achieving perfection with larger foldable panels is somewhat simpler than their smaller counterparts. Could this mean Apple might leapfrog right into medium-sized foldable products—like laptops or tablets? Only time will tell.

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(Photo credit: Apple)

UMC has reportedly received a contract to manufacture crucial chips for Apple’s upcoming iPhone antenna modules. According to a report from Economic Daily News, the production volume is said to be in the tens of thousands.

Regarding this, UMC does not respond to specific customer and market rumors. It is reported that the orders from UMC this time come from Qorvo, a supplier for Apple’s power amplifier (PA).

Qorvo designs new iPhone antenna components for Apple, integrating new chips and supplying them with Qorvo power amplifiers. These new chips adopt UMC’s 3DIC technology and are manufactured by UMC.

Per the report citing industry sources, it has revealed that the chips Qorvo outsourced UMC this time are products of Anokiwave, a wireless communication chip factory that Qorvo recently merged with early this year. They will be integrated into the design of new iPhone antenna modules and are currently gradually increasing in volume.

As smartphones gradually integrate AI functionality, the sources cited in the same report also reveal that Apple is enhancing efficiency by adopting a new design for the next generation iPhone antenna module. They are incorporating products from Anokiwave, which was acquired by Qorvo earlier this year, to enhance iPhone reception capabilities.

With Qorvo leveraging Anokiwave’s products and partnering with UMC for manufacturing, UMC secures critical component chip orders for the iPhone once again. Previously, UMC also manufactured driver IC chips for Apple through NovaTek.

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(Photo credit: Apple)

With the rapid advancement of AI-powered PC chips, industry giants like Intel, AMD, and Qualcomm, alongside various brands, are optimistic about the inaugural year of AI PCs entering the market.

According to a report from Commercial Times, chip manufacturers are showcasing their AI PC chip solutions, with newcomer Qualcomm partnering with Google to launch Snapdragon X expected mid-year, while Intel leveraging both hardware and software resources.

Per the same report citing sources, laptop brands are beginning to plan AI PC-related products for the second half of the year. Recently, companies like Dell, Lenovo, and HP have held internal meetings with the Taiwan supply chain. In addition to contract manufacturers, IC design is also a key focus, with companies like MediaTek and Realtek being actively engaged.

Reportedly, each company currently has its own perspective on AI PC, with many opting to integrate AI accelerator chips. However, Microsoft and Intel have jointly defined AI PC as requiring NPU, CPU, and GPU, along with support for Microsoft’s Copilot. They are also incorporating a physical Copilot key directly on the keyboard and become the standard setters.

To adapt to significant changes in software and hardware, Intel is expanding its ecosystem. In addition to AI application software, they are incorporating Independent Hardware Vendors (IHVs) into their AI PC acceleration program.

This collaboration assists IHV partners in preparing, optimizing, and leveraging hardware opportunities in AI PC applications. Support is provided from the early stages of hardware solutions and platform development, offering numerous opportunities for IC design companies in Taiwan to enter Intel’s supply chain during the nascent stage of AI PC.

Reportedly, Qualcomm is rumored to maintain its partnership with Google as it ventures into the AI PC market this year with Snapdragon X Elite. Qualcomm and Google have previously collaborated closely in the realm of Android smartphones, with many devices equipped with Snapdragon chipsets already using Google software.

Intel estimates that by the end of this year, the market will introduce over 300 AI acceleration applications, further advancing its AI software framework and enhancing the developer ecosystem. Intel further predicts that by the end of 2025, there will be over 100 million PCs shipped with AI accelerators, indicating immense opportunities in the AI PC market. However, competition is fierce, and success in this market requires innovative products that are differentiated and meet user needs. With both Intel and Qualcomm unveiling unique strategies, the AI PC market is poised for significant developments.

For AI PC, TrendForce believes that due to the high costs of upgrading both software and hardware, early development will be focused on high-end business users and content creators. This targeted group has a strong demand for leveraging AI processing capabilities to improve productivity efficiency and can also benefit immediately from related applications, making them the first-generation primary users.

The emergence of AI PCs is not expected to necessarily stimulate additional PC purchase demand. Instead, most upgrades to AI PC devices will occur naturally as part of the business equipment replacement cycle projected for 2024.

Nevertheless, looking to the long term, the potential development of more diverse AI tools—along with a price reduction—may still lead to a higher adoption rate of consumer AI PCs.

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(Photo credit: Intel)