“Foldable Phones” have emerged as the new epitome of high-end flagship smartphones. However, whether it’s in the form of vertical or horizontal folding, it may no longer meet the needs of some users.

Recently, industry sources cited by TechNews has suggested that Chinese smartphone brand Huawei is planning to launch a triple-fold foldable phone this year. This move is expected to make smartphones unfolded more akin to the size and functionality of tablet computers.

As for the folding form, it might be in a Z-shaped (or S-shaped) manner. The screen size after folding would be similar to that of a regular smartphone, approximately 6.4 inches. It is rumored that Huawei’s Z-fold phone’s panel supplier could be BOE.

However, the design of the triple-fold phone may not be limited to just the Z-fold type; it could also be designed in a G-fold manner.

What is the G-fold type? It means both hinges fold inward. Nonetheless, such a design would necessitate adding a cover screen, which would increase the overall weight and thickness. Additionally, to cover the folded panel, the folding radius of the other side’s hinge must be enlarged.

As for the Z-fold (or S-fold) design, while it allows for the use of the outer folded panel as a cover screen, thus saving weight, the simultaneous presence of both inward and outward folding poses significant challenges to the panel’s layer stacking design and the mechanism’s design.

However, some people may wonder, “Are foldable phones really selling well?” In fact, according to TrendForce’s data,  for the shipment numbers last year, the existing shipment volume of foldable phones still falls short of expectations, reaching only 15.7 million units, failing to surpass the 16 million mark.

The sales performance of the leading brand in foldable phones, Samsung Electronics, was also not as good as expected, remaining at around 10.5 million units. The sales situation of other Chinese brands also did not meet expectations.

While foldable phones have indeed become the new symbol of high-end flagship smartphones, the fact is that the design patterns have become quite fixed. For consumers who are always looking for something new, these phones have lost their novelty and breakthrough points.

Therefore, brands have begun to contemplate the future of foldable phones with new designs and are considering abandoning certain design patterns to achieve better profitability.

For instance, OPPO and vivo are expected to abandon upright foldable phone models within this year, opting to retain only the left-right folding models (Fold).

The main reason behind this decision is that the pricing of upright foldable phones is lower, and although there might be a chance of higher shipment volumes compared to the Fold models, the profit margins are not significant.

Now that the demand for foldable phones has started to plateau, it is anticipated that the demand for foldable phones this year will only reach 17.7 million units, a 12.3% year-on-year increase.

In the face of sluggish end-user demand, why are smartphone brands still considering launching new types of foldable phones? This relates to the notion of “technological showcase.” Huawei’s triple-fold phone design takes into account technological capabilities, yield rates, and other factors.

Initially, the scale may not be too large, but the technological demonstration aspect remains potent. Huawei is anticipated to position itself as a technological leader, exerting pressure on other smartphone brands to a certain extent.

However, brands are not only contemplating “folding” smartphone designs. Some brands have also begun considering rollable and pull-up designs, aiming to inject new vitality into the smartphone market.

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• [News] Huawei Issues Rush Orders for Crucial Components, Focusing on CIS for Foldable Phones

(Photo credit: Huawei)

Since the release of the Huawei Mate 60 series smartphones, the Huawei Kirin chipset has been making a comeback with various iterations, including the Kirin 9000s and Kirin 9000E featured in the Mate 60 series. The latest update has revealed the confirmation of a new Kirin chipset named Kirin 9000W, making its debut in the Huawei MatePad Pro 13.2-inch.

According to the WeChat account ic211ic, the Huawei MatePad Pro 13.2-inch device was already available in the Chinese market last year, equipped with the Kirin 9000S chipset. However, the newly discovered Kirin 9000W is featured in the international version of the MatePad Pro 13.2” which has been launched in markets such as Malaysia, Italy, and Saudi Arabia.

The official website displays that the MatePad Pro 13.2-inch is equipped with the Kirin 9000W processor.

In other words, , the Huawei MatePad Pro 13.2-inch employs different processors in different countries, indicating that Huawei’s Kirin chipset family has added new members.

Currently, there are six different versions of the Kirin 9000 chipset available in the market, namely Kirin 9000, Kirin 9000E, Kirin 9000L, Kirin 9000S, Kirin 9000SL, and Kirin 9000W.

However, Huawei’s official websites in the mentioned markets only mention the “Kirin 9000W” without providing further details. Apart from mentioning the model, they only introduce it as an octa-core CPU. Based solely on this information, it’s challenging to determine the performance difference between Kirin 9000W and Kirin 9000S.

As per TechNews citing from sources, it has been suggested that the Kirin 9000W is likely similar to the Kirin 9000S but may offer slightly improved performance. Additionally, due to the larger size of the MatePad Pro, better temperature control might be necessary.

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• [News] Kirin 9010 Shortage Rumors: Huawei P70 May Use Kirin 9000S in Some Models

(Photo credit: Huawei)

Previously, TSMC has indicated that TSMC’s 2nm process will be deployed as scheduled in the second half of 2025, indicating that before that, the most advanced chips in the market will be produced using TSMC’s 3nm process. Apple, which has consistently been the first to adopt TSMC’s latest process, is set to be the first to adopt TSMC’s latest 2nm process.

▲ TSMC’s Layout of Global Production Capacity Edited by TrendForce, November, 2023

According to a report from the media outlet wccftech, Apple’s iPhone, Mac, iPad, and other devices will be the first users of TSMC’s 2nm process. Apple will leverage TSMC’s 2nm process technology to enhance chip performance and reduce power consumption. This advancement is expected to result in longer battery life for future Apple products, such as the iPhone and MacBook.

Currently, Apple’s chips designed for products like MacBook, iPad, and iPad Pro are produced using TSMC’s 3nm process technology. In 2023, the company announced the inclusion of the M3 Pro and M3 Max chips in the new MacBook Pro models. 

Additionally, TSMC will utilize new technology based on the GAAFET (Gate-All-Around Field-Effect Transistor) transistors instead of the traditional FinFET. While this new architecture makes the manufacturing process more complex, it also brings advantages such as smaller transistor sizes and lower power consumption.

In terms of performance analysis, Apple’s current chips are transitioning from the 5nm process to the 3nm process. This transition has resulted in a 10% increase in CPU performance and a 20% increase in GPU performance.

For now, TSMC is actively planning the capacity for future 2nm process technology through the construction of two new factories. Additionally, TSMC will utilize new technology based on the GAAFET (Gate-All-Around Field-Effect Transistor) architecture instead of the traditional FinFET architecture.

While this new architecture makes the manufacturing process more complex, it also brings advantages such as smaller transistor sizes and lower power consumption.

The report further indicates that Apple is expected to adopt the 2nm process for chip production in the iPhone 17 by 2025. Additionally, the same technology will also be applicable to the production of Mac’s M-series chips. 

Furthermore, as TSMC is quietly developing 1.4nm process, it is expected to be unveiled in 2027. This development means that, like the 2nm process technology, Apple could potentially be the first company to receive the latest process technology from TSMC for chip production, whether it’s 1.4nm or 2nm.

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• [News] Samsung’s Discount Strategy Challenges TSMC as the Battle for 2nm Orders Heats Up
• [News] TSMC Responds to Rumors of New 1.4nm Fab

(Photo credit: NVIDIA)

Apple’s upcoming iPad Pro, featuring an OLED screen for the first time, is scheduled to be released in March or April. However, recent market reports suggest a potential 30% reduction in the estimated order volume, indicating Apple’s cautious outlook on the new product. It’s anticipated that suppliers in the supply chain such as LG Display (LGD), TSMC, Foxconn, and Novatek will also be affected.

Aju Korea Daily, citing industry sources, reported that Apple has reduced the OLED screen orders for its new iPad Pro. The initial order of 10 million units has been adjusted to a range of 7 million to 8 million units. LGD is expected to be the most impacted, with the supply scale decreasing from 6 million units to a minimum of 3 million units, while Samsung maintains a supply of 4 million units.

Industry speculation suggests that the reduction in the initial order may be due to a cautious outlook on the demand in the early stages of the product launch. The pricing of the new iPad Pro has not been determined, but it is likely to be higher than the current iPad with an LCD screen.

Historically, all iPad models from Apple have utilized LCD panels. However, this year’s release of the 11-inch and 12.9-inch iPad Pro models marks the first time Apple is incorporating OLED panels.

On another note, in addition to applying OLED screens to the iPad Pro this year, Apple reportedly plans to use them in future laptop products such as the MacBook. Therefore, the performance of the OLED iPad in terms of sales will serve as a significant market indicator for Apple’s future ventures into OLED technology.

Additionally, the adoption of OLED screens will result in an increase in the price of the iPad Pro. The loyalty of iPad consumers has traditionally been lower than that of iPhone users, posing a challenge for Apple in achieving strong performance this year.

The estimated order volume reduction is expected to have an impact on the iPad Pro supply chain, affecting key manufacturers such as TSMC, Foxconn, and Novatek.

According to sources cited by the Economic Daily News, TSMC is the exclusive supplier of Apple’s chips, while Foxconn is the main assembly plant for the iPad Pro. Novatek is a supplier of OLED screen driver ICs for the Korean market. However, the mentioned companies have refrained from commenting on specific clients and products.

TSMC has been the primary manufacturer of main chips for various Apple devices. Last year, there were reports in the market that Apple secured TSMC’s 3-nanometer production capacity for at least a year.

Despite current market uncertainties, TSMC estimates that the semiconductor market will see a growth of over 10% this year, with the foundry industry expected to grow by 20%. TSMC’s financial performance is projected to outpace industry standards, demonstrating quarterly growth.

Novatek previously indicated that there might be competition in the OLED driver IC sector this year. Nevertheless, the company plans to continue its strategic focus on advanced products such as applications for foldable devices, OLED touch, and integrated touch and display driver ICs (TDDI).

As for Foxconn, the company is gradually entering the traditional off-season. Seasonal performance is expected to be similar to the past three years. In the first quarter of 2023, higher shipment volume resulting from the resumption of normal production in Chinese factories post-pandemic is anticipated to lead to a year-on-year decline in performance for the first quarter of this year.

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• [News] Leak Reveals LGD as the Largest Supplier of Apple’s OLED iPad Pro Screen
• [News] TSMC Reportedly Attracts Influx of 3nm Customers, Predicts Production Capacity Utilization to Surge to 80% by Year-End

(Photo credit: Apple)

According to recent reports, Huawei is expected to unveil its flagship P70 series later this year, alongside the introduction of the new Kirin 9010 chipset. However, there are indications that the older Kirin 9000S might be utilized in a specific model.

Wccftech suggests that the P70 series will include the P70, P70 Pro, and P70 Art, followed by the Mate 70 series. Notably, not all P70 models will feature the new Kirin 9010.

As per insights from the Weibo account Smart Pikachu, the P70 series will boast a custom curved display that is easy on the eyes and power-efficient but lacks a 2K resolution, and the standard version of the P70 is tested with the Kirin 9000S. This may potentially impact the motivation for users who have already purchased the Mate 60 and might not find sufficient reasons to upgrade to the P70.

Wccftech suggests that the adoption of the 9000S in some models could be attributed to the limited supply of the Kirin 9010. The Kirin 9000S, produced by SMIC using a 7nm process, faces production challenges due to the use of older-generation DUV equipment, resulting in a time-consuming and costly manufacturing process with lower yields.

Despite this, there is a glimmer of hope for Huawei’s pricing competitiveness, as the production cost of the Kirin 9000S is expected to be lower than that of the Kirin 9010. This cost advantage could potentially contribute to Huawei’s goal of reaching an estimated shipment volume of 100 million smartphones in 2024, especially considering the company’s historical strength in offering competitive pricing for its base models.

(Image: Huawei)