On November 6, 2023, MediaTek unveiled its latest flagship smartphone SoC, the Dimensity 9300. Benchmark data reveals that the Dimensity 9300 outperforms Qualcomm’s flagship chips in both CPU (multi-core) and GPU performance.

However, Qualcomm enjoys a strong brand reputation and recognition in the consumer market, making it a challenging task for MediaTek to capture the top market position for high-end SoCs in the Android camp with this chip.

TrendForce’s Insights:

1. Brand New Design Boosts Dimensity 9300 Benchmark Performance

Diverging from the conventional “big core + small core” architecture, MediaTek introduces a groundbreaking “4+4” design in the Dimensity 9300. This chip comprises 4 Cortex-X4 cores (clocking up to 3.25GHz) and 4 Cortex-A720 cores (running at 2.0GHz).

According to MediaTek’s official data, this new architecture delivers a 40% increase in multi-core peak performance compared to the previous-generation Dimensity 9200. Additionally, it achieves a 33% reduction in power consumption while maintaining the same level of performance.

In addition to its outstanding chip performance and energy efficiency, the Dimensity 9300 achieves a significant breakthrough in the field of AI. According to official data, powered by the seventh-generation AI processor APU790, the Dimensity 9300 achieves AI edge computing processing speeds up to 8 times faster than the previous generation. In practical terms, this means it can generate image content from text in less than 1 second.

Furthermore, through MediaTek’s exclusive memory compression technology, known as NeuroPilot Compression, it significantly reduces the memory footprint of AI Large Language Models (LLMs) on end-user devices. This enables smooth operation of LLMs with up to 1 billion, 7 billion, 13 billion, and even a maximum of 33 billion parameters on terminal devices.

2. Dimensity 9300 Outperforms, but Qualcomm Remains a Strong Contender

While Dimensity 9300 exhibits superior performance in both CPU (multi-core) and GPU compared to Qualcomm’s concurrent flagship Snapdragon 8 Gen 3 SoC, a consumer survey conducted by a well-known international tech product comparison website tells a different story.

Out of 1,833 valid respondents, even after being informed about Dimensity 9300’s better benchmark results, 946 people (representing 51.6% of respondents) still chose the Qualcomm chip with lower scores.

This is likely because major smartphone manufacturers have historically favored Qualcomm over MediaTek for their flagship devices. Qualcomm has built a stronger brand image and enjoys higher recognition in the market. Therefore, MediaTek faces a formidable challenge in its quest to capture the top spot for Android high-end smartphone SoC market share with Dimensity 9300.

Furthermore, since the current benchmark results are derived from engineering samples, and the ultimate products from smartphone manufacturers have not been officially released, it remains to be seen whether Dimensity 9300 can deliver the expected performance efficiency. The final verdict on its performance will depend on the adjustments and optimizations made by these manufacturers.

Read more

• [News] MediaTek Unveils Dimensity 9300 AI Mobile Chip: Intensifying Competition in the Chinese Market

(Photo credit: MediaTek)

Samsung’s upcoming flagship Galaxy S24 series, reportedly set to be unveiled in mid-January 2024, will feature Qualcomm’s latest Snapdragon 8 Gen 3 processor. This new series will highlight Samsung’s first-ever generative AI smartphone, with a sales target expected to increase by over 10% compared to the previous S23 model, reaching more than 34 million units.

As reported by “The Korea Daily,” Samsung is planning to unveil the Galaxy S24 series of new smartphones in mid-January 2024, making it the first major Android flagship to be launched next year. To ensure the successful market debut of the new devices, Samsung is expected to initiate the procurement process from its supply chain in the very near future.

Industry sources have revealed that Samsung’s internal estimates project smartphone sales for next year to reach approximately 253 million units and this figure is expected to be adjusted upwards in the near future according to Economic Daily.

In comparison, Apple’s projected total iPhone sales for the next year, according to a market analyst, are expected to be around 250 million units, making the estimates of these two major smartphone giants quite close.

It is reported that Samsung’s recent flagship devices in the S series have delivered subpar performance. Both the S21 and S22 models achieved sales figures of fewer than 30 million units, while the estimated sales for the S23 series stand at around 31 million units.

Notably, Samsung is currently collaborating with major players such as Google and Microsoft, and there is a strong likelihood that they will incorporate generative AI features like Google Bard or ChatGPT into the Galaxy S24.

This move aims to make the Galaxy S24 their first generative AI smartphone, serving as a prominent selling point for the new device and enhancing the operating system, thereby narrowing the gap with Apple.

Industry experts point out that while smartphone brands tend to estimate sales figures for new products before their launch, the smartphone market has experienced weakened demand in recent years.

Many brands have adopted a conservative approach to sales estimates, even controlling production capacity and marketing budgets to reduce risks. In this context, Samsung’s decision to set clear growth targets stands as a demonstration of their high confidence in the new product.

As for the supply chain, Largan Precision is the primary supplier of main camera components for the Galaxy S24, while GIS is responsible for supplying the in-display fingerprint module, and TXC Corporation provides quartz components.

(Photo credit: Samsung)

The global smartphone market has seen a continuous decline for nine consecutive quarters, with only the foldable phone category remaining resilient and maintaining growth. Android smartphone manufacturers seem to view this category as a lifeline, having released a total of 13 new foldable phones in the past three months, setting a record for the number of new foldable phones introduced in half a year.

The intensified release of foldable phone models not only reflects the sense of urgency among smartphone manufacturers but also signifies a shift towards foldable technology in the mobile industry.

Currently, the foldable phone market is not as well-established as the traditional flat-screen market, presenting opportunities and variables. All Android manufacturers aim to leverage foldable phones to enhance their market positioning, achieve high-end differentiation, and engage in distinctive competition with Apple.

In fact, during the third quarter, there were subtle changes in the landscape of the foldable phone market in China according to IJIWEI’s report. Huawei, which once dominated the foldable phone market, has seen its market share decline. OPPO and Honor have managed to surpass Huawei in terms of sales volume in the flip-fold and single-product categories.

Next year, Huawei and Samsung plan to introduce more competitively priced foldable phones, and other Android manufacturers are expected to follow suit, driving accelerated expansion in the foldable phone market.

13 New Foldable Phones Launched in 3 Months

In the latter half of this year, smartphone manufacturers including Honor, OPPO, Xiaomi, Samsung, Huawei and Transsion, have been on a roll, releasing a remarkable 13 new foldable phones within just three months. This surge in foldable phone launches has almost doubled the number of foldable devices introduced in the first half of the year.

Each smartphone manufacturer has focused on different aspects of foldable phones. Honor has been particularly aggressive in the foldable phone market, introducing three new models in just four months, constantly pushing the boundaries of thinness. In July, Honor managed to reduce the thickness of foldable phones to the millimeter era with a body thickness of 9.9mm.

In September, the Honor V Purse, an outward folding phone, had a body thickness of 8.6mm in its folded state and weighed only 214g, once again setting a new record for slim foldable phones in the market. In October, the Honor Magic Vs2 weighed 229g, refreshing the record for slim large-sized inward folding phones.

On the other hand, OPPO and Xiaomi have emphasized the imaging performance of their foldable phones. In addition, Samsung, Huawei, Transsion, OnePlus, and other manufacturers have each introduced innovative models like the Galaxy Z Flip 5/Fold 5, Samsung W24/W24 Flip, OnePlus Open, Huawei Mate X5, and PHANTOM V Flip 5G, incorporating cutting-edge technology into foldable phones and significantly enhancing the foldable phone experience. This surge in foldable phone innovation has become one of the standout features in this year’s smartphone market.

Reasons for the Proliferation of Foldable Phones

Recent intense launches of new foldable phones by smartphone manufacturers reflect their strong sense of urgency in the Android market.

Global smartphone markets have been persistently sluggish, declining for nine consecutive quarters due to factors like inflation, market saturation, and longer upgrade cycles. Traditional flat smartphones are no longer able to drive sustained market growth, and the smartphone market is in need of new growth engines.

Foldable phones, with their differentiated form and innovative experiences, have the potential to stimulate consumer upgrades, and smartphone manufacturers have high hopes for them, leading to the frequent release of new foldable phone models.

Currently, foldable phones are considered high-end products, and the intense launch of new foldable phone models by Android smartphone manufacturers is aimed at achieving brand premiumization and establishing differentiation from Apple.

In an effort to break through the high-end market stronghold that Apple has established, Android smartphone manufacturers, led by Samsung, have not only upgraded their high-end flat smartphones but have also been actively promoting foldable phone innovations, different from the iPhone 15 series. They aim to stimulate consumer upgrades and attract more high-end users who value large-screen experiences.

Price Key to Boosting Foldable Smartphone Penetration

In recent months, Android smartphone manufacturers have been consistently releasing new foldable phone models, driving up foldable phone sales and contributing to increased market penetration in the high-end smartphone segment during the latter half of the year.

Supply chain sources have also revealed that Samsung is planning to bring foldable phones to the mid-range market next year, further reducing price barriers and making foldable phones more accessible to a broader range of consumers.

This year, the lowest price for foldable phones has already dropped to 3,659 yuan (RMB), setting a new record. In the upcoming year, more manufacturers will introduce higher-value foldable phone products, thus accelerating the broader adoption of foldable phones.

TrendForce believes that the driving force behind the foldable market’s expansion is the reduced costs and the expansion strategies of Chinese brands.

Looking at TrendForce’s estimated numbers , by 2023, shipments of foldable smartphones could skyrocket to an impressive 18.3 million units, marking a 43% YoY surge. However, this only captures a slim 1.6% of the year’s total smartphone market. Fast forward to 2024, a 38% growth is anticipated, translating to a hefty 25.2 million units and nudging the market share up to 2.2%.

Looking at the medium to long term, TrendForce believes the expansion of the foldable smartphone market is inevitable. By 2027, shipments could soar to a whopping 70 million units, seizing around 5% of the global smartphone market.

At the same time, foldable phone manufacturers are exploring new product forms and driving advancements in end-user applications. While there are certain limitations in terms of size for dual-foldable screen phones, many companies have already started working on triple-foldable screen products.

Recent reports from industry insiders suggest that Huawei’s development of a triple-foldable screen phone is progressing smoothly and may be ready for launch before March next year. It’s expected that two triple-foldable screen phones will be introduced in 2024.

On the other hand, Apple’s strategy for foldable devices differs from many Android phone manufacturers, as they are more focused on mature products and not in a hurry to release foldable phones.

According to TrendForce’s research, to date, Apple’s foray into foldables has been tepid due to Apple’s unwavering obsession with user experience.

Persistent challenges with foldable tech—think panel evenness and hinge design—might be holding them back. Still, achieving perfection with larger foldable panels is somewhat simpler than their smaller counterparts. The possibility for Apple to leapfrog right into medium-sized foldable products – like laptops or tablets – still remains.

(Photo credit: Phantom)

Following China’s Big Fund’s substantial $14.56 billion RMB investment in Changxin Xinqiao Storage Technology, a memory chip manufacturer, at the end of October, there are now reports of an additional $39 billion RMB injection.

China is actively building a domestic semiconductor supply chain, and according to Nikkei Asia, Changxin Xinqiao is set to utilize this funding to expedite the construction of its facility in Hefei, Anhui province, with the aim of achieving mass production within a span of three years.

Hefei is also the location of a production facility for ChangXin Memory Technologies (CXMT), a major semiconductor manufacturer specializing in DRAM production. Changxin Xinqiao shares some shareholders and its general manager with CXMT, according to Tianyancha.

Chinese media points out that Changxin Xinqiao has ambitious plans to produce DRAM chips in Hefei, destined for use in computers and a wide array of electronic devices. At present, Changxin Xinqiao has initiated the tendering process for new facility equipment and is poised to accelerate procurement and related procedures using the recently acquired funding.

With support from the Hefei City government, Changxin Xinqiao initiated the DRAM factory construction project in 2019 and laid out a policy to make use of domestically manufactured semiconductor production equipment.

(Image: CXMT)

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On November 6th, leading IC design company, MediaTek, introduced the Dimensity 9300, its latest flagship mobile System-on-Chip (SoC) featuring an innovative All Big Core design.

It incorporates groundbreaking technology to redefine flagship experiences in areas such as on-device AI, gaming, and imaging. The first smartphones to adopt MediaTek’s Dimensity 9300 chip are expected to hit the market by the end of 2023.

MediaTek’s next generation APU 790 AI processor is integrated into the Dimensity 9300 and designed to significantly improve generative AI performance and energy efficiency for faster and more secure edge computing. The APU 790 doubles the integer and floating-point operations performance, while reducing power consumption by 45%.

The APU 790 hardware includes a generative AI engine, enabling faster and more secure edge AI computations. It’s capable of accelerating operations on Transformer models, achieving processing speeds eight times faster than the previous generation and generating images within one second.

Moreover, in conjunction with large-scale language models, MediaTek has developed mixed-precision INT4 quantization technology, which when combined with the company’s NeuroPilot memory hardware compression, can more efficiently utilize memory bandwidth and significantly reduce memory requirements for large AI models.

The APU 790 provides support for NeuroPilot Fusion, which can continuously perform LoRA low-rank adaptation, and is capable of supporting large language models with 1B, 7B, and 13B parameters, with scalability up to 33B.

Additionally, MediaTek’s AI development platform, NeuroPilot, has built a rich AI ecosystem, supporting mainstream AI language models such as Meta LIama 2, Baidu ERNIE Bot, and Baichuan’s large language model, facilitating rapid and efficient deployment of multi-modal generative AI applications on edge devices, offering innovative user experiences in text, images, music, and more.

In terms of performance, MediaTek emphasizes that the Dimensity 9300 offers exceptional performance in terms of intelligence, efficiency, and low power consumption, all achieved through groundbreaking advanced technology. It sets the stage for a new flagship experience in generative AI, gaming, and imaging.

“The Dimensity 9300 is MediaTek’s most powerful flagship chip yet, bringing a huge boost in raw computing power to flagship smartphones with our groundbreaking All Big Core design,” said Joe Chen, President at MediaTek.

“This unique architecture, combined with our upgraded on-chip AI Processing Unit, will usher in a new era of generative AI applications as developers push the limits with edge AI and hybrid AI computing capabilities.”

MediaTek’s Over 40% Market Share in China Underscores the Vital Importance of the Chinese Market

Furthermore, MediaTek strategically chose China as the launch location for its latest flagship mobile chip. This decision reflects the long-standing partnerships with various Chinese smartphone brands and the fact that the Chinese market has consistently been a significant source of revenue for MediaTek.

For the third quarter of this year, mobile chips constituted 49% of the overall revenue, making a substantial contribution to the company’s earnings. Regarding geographical distribution, foreign securities firms have estimated that the Chinese market contributes to approximately 40% of MediaTek’s revenue, primarily driven by smartphone products.

Moreover, according to statements made by MediaTek’s Chairman Rick Tsai at the beginning of this year, following the introduction of the Dimensity 5G mobile chip series in 2019, MediaTek expanded its presence in the Chinese high-end smartphone chip market. Starting almost from scratch in 2021, it achieved a market share of 20% in 2022. The projection is that this trend will continue to rise this year.

In other words, the Chinese mobile chip market, particularly in the high-priced flagship mobile chip segment, remains a critical driving force for MediaTek. It presents a significant long-term competition challenge to Qualcomm, particularly as it enters the realm of generative AI business applications.

After Huawei’s breakthrough in 5G chipsets, enabling its return to the market with 5G smartphones, the sales of smartphones using Qualcomm’s 4G chipsets are bound to be affected, which, in turn, poses a challenge for Qualcomm. With the introduction of the 5G Generative AI mobile chipset Tianji 9300, the competition in the Chinese smartphone chipset market is expected to intensify.

(Photo credit: MediaTek)