Huawei’s Mate XT, being the world’s first tri-fold smartphone, has created a buzz as it got over 4 million preorders even before the formal launch. However, the tech giant might not enjoy the monopoly for long. Citing a recent patent filing published by China’s State Intellectual Property Office, a report by Gizmochina notes that Xiaomi is also working on the technology.

Earlier In August, Weibo tipster “Smart Pikachu” also brought up Xiaomi’s progress on this new design, while rumors suggest that Xiaomi could release the tri-fold phone as early as 2025.

Gizmochina suggests that though the patent itself does not disclose the model name, it does reveal a design featuring a Z-shaped fold, which is similar to that of Huawei Mate XT.

To elaborate, the report notes that the model is equipped with a horizontally positioned rear camera island, which is narrower than that of the Xiaomi Mix Fold 4. The image shown in the patent application also suggests that the tri-fold phone will feature three rear cameras, compared to the four found on the Mix Fold 4 model.

According to Gizmochina, Xiaomi’s tri-fold device may be slightly thicker than the Huawei Mate XT, which has a 12.8mm thickness when folded. However, there’s still time for Xiaomi to refine the design, the report notes.

It is interesting to note that this isn’t the first time the market heard about Xiaomi’s ambition on a tri-fold phone, as related patents could be dated back to 2019, the report indicates. However, the latest patent features a completely new design with a dual inward folding mechanism, suggesting that Xiaomi has been exploring various possibilities and folding techniques for some time.

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(Photo credit: Huawei)

According to Money DJ, citing the latest data from Japanese gaming media Famitsu, overall console sales in Japan (including Switch, PS5, and Xbox Series X/S) dropped 19% to 79,962 units during the week of September 2-8, compared to the previous week (August 26-September 1), driven by a sharp decline in PS5 sales.

Famitsu reports that sales of Nintendo’s Switch series (standard Switch, Switch Lite, and OLED Switch) rose 6% week-over-week to 67,473 units. The standard Switch saw a 14% drop to 5,723 units, while Switch Lite sales jumped 12% to 15,271 units, and OLED Switch sales increased 7% to 46,479 units.

Sony’s PS5 series (standard disc version and digital edition) saw Japanese sales plunge nearly 70% during the same week, hitting a new low for 2024. Total PS5 sales slumped 67% to 11,007 units. The standard PS5 dropped 66% to 9,097 units, and the digital edition saw a 73% decline to 1,910 units.

Meanwhile, Microsoft’s Xbox Series X/S sales in Japan surged 90% week-over-week to 1,482 units, with Xbox Series X sales jumping 87% to 759 units and Xbox Series S up 94% to 723 units.

Sony Interactive Entertainment (SIE), Sony’s gaming subsidiary, announced on August 27 that it would raise PS5 prices in Japan starting September 2. The standard PS5 price was hiked 19% (an increase of ¥13,000) to ¥79,980, while the digital edition saw a 21% increase (also ¥13,000) to ¥72,980.

Meanwhile, rumors of a new Nintendo console have been making the rounds. According to Notebookcheck, leaked details regarding the price and launch date of the anticipated Nintendo Switch 2 have surfaced, fueling speculation that Nintendo could be gearing up for another blockbuster release.

(Photo credit: Sony)

Ahead of AMD’s October launch of Instinct MI325X, the U.S. chip giant is said to have several issues with its laptop OEMs, which results in poor execution, a report by Tom’s Hardware notes. Citing remarks from analysts, the report describes the two parties’ relation now as a “Cold War ice age,” hurting their mutual trust.

The report, citing AC Analysis, says that the main contradiction arises from AMD’s current strategy of prioritizing enterprise chips over consumer products, with laptop OEMs complaining about the “miscommunication, unfulfilled promises, and generally poor treatment.” The situation, according to them, is similar to Intel’s behavior during its peak years.

It is interesting to note that the situation seems to coincide with AMD CEO Lisa Su’s recent exclamation that AMD is a “data center-first company,” as data center contributed to over 50% of the company’s revenue last quarter.

Another report by German media outlet ComputerBase also reports that AMD is still suffering from the same challenges it has had in the past. For instance, problems with supply and related issues have delayed the release of new Strix Point laptops. According to ComputerBase, one source even accused AMD of probably leaving billions of US dollars on the table with its partners over the years.

Tom’s Hardware observes that due to the aforementioned reasons, the reaction of AMD’s Strix Point chips among OEMs has been somewhat tepid, despite consumer interest.

The report notes that currently, BestBuy offers only three brands with AMD’s latest chips—Asus, HP, and MSI. HP and MSI each have one model, while Asus has 13 models featuring the AMD Ryzen AI 300 series chip.

This is in sharp contrast with Qualcomm, the report notes. Even the company is a latecomer in the laptop market, the smartphone chip giant’s launch of the Snapdragon X processor generated significant excitement among both the public and laptop manufacturers, as seven brands have already released 12 different models featuring the new Arm chip.

AMD is also lagging behind its rival Intel, which still dominates the laptop market despite its recent slump. According to Intel, its Lunar Lake, manufactured with TSMC’s 3nm, is expected to power more than 80 new laptop designs across more than 20 original equipment manufacturers, delivering AI performance at a global scale for Copilot+ PCs.

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(Photo credit: AMD)

On September 10, two major smartphone manufacturers, Apple and Huawei, held new product launch events simultaneously. Apple’s iPhone 16 is powered by the A18 series Bionic chip, which is said to make it the first truly native AI smartphone.

Meanwhile, Huawei’s Mate XT, the world’s first triple-foldable phone, redefines the future standard for foldable devices.

• iPhone 16 Hit the Market, Backed by a Powerful Chip

On September 9, Apple held its product launch event, introducing the iPhone 16 series, including the iPhone 16, iPhone 16 Plus, iPhone 16 Pro, and iPhone 16 Pro Max. All models in the new series are equipped with the new 3nm A18 series processor, with the standard iPhone 16 featuring A18 chip, and the flagship iPhone 16 Pro and Pro Max powered by A18 Pro chip.

Compared to A16 Bionic chip used in the iPhone 15, iPhone 16’s processor makes a leap forward by two generations, offering a gaming experience on par with console-level performance.

The A18 and A18 Pro chips in the iPhone 16 series use the world’s first second-generation 3nm process and the latest Armv9 instruction set architecture. They have a built-in 16-core neural engine, with smaller transistors that increase speed and efficiency.

The memory subsystem has been uniformly upgraded, increasing total system memory bandwidth by 17%.

The A18 chip in the standard iPhone 16 features a 6-core CPU (2 performance cores + 4 efficiency cores), which is 30% faster than the A16 Bionic in the iPhone 15 and 60% faster than the A14 chip in the iPhone 12.

Its GPU is more efficient, consuming 35% less power for the same performance. A18 chip adopts Apple’s latest desktop-class GPU architecture, with a 5-core GPU that supports key functions like Apple Intelligence, photography, and graphically intensive games. It’s 40% faster than the A16’s GPU and twice as fast as the A14’s GPU.

The A18 Pro chip, debuting in the iPhone 16 Pro series, delivers up to 15% faster performance and 20% less power consumption compared to the A17 Pro when running the same workloads.

Additionally, Apple Intelligence’s running speed improves by 15%. Fitted with brand new 6-core GPU, A18 Pro optimizes graphics performance, features a GPU speed of up to 20% at the fastest and supports hardware ray tracing.

A18 Pro also supports faster USB 3 and ProRes video recording, along with a new video encoder and image signal processor, which double data throughput, boosting encoding speed and video processing efficiency.

Apple emphasized that the iPhone 16 series will introduce new generative AI features centered around Apple Intelligence for the first time. Apple Intelligence is set to launch in beta this fall as part of the iOS 18 update on all iPhone 16 models, as well as the iPhone 15 Pro and iPhone 15 Pro Max, with Siri and the device language initially set to U.S. English. Some functions and additional languages will be rolled out next year.

TrendForce previously noted that Apple Intelligence is a major highlight of the iPhone 16 series this year. While the LLM parameters on Apple’s devices are not as extensive as those on Android phones, Apple is expected to achieve superior system integration thanks to its closed ecosystem, self-developed processors, and strong control over app development.

The company is also focusing on improving Siri’s accuracy and has partnered with ChatGPT to boost AI performance. TrendForce points out that Apple Intelligence will gradually roll out more features and support for additional languages.

However, its functionality in China remains unclear, and the lack of significant AI-centric applications could potentially impact sales of the iPhone 16 series this year. 

From a production perspective, TrendForce’s research on September 6 pointed out that the excitement around Apple Intelligence has been building since WWDC24, and with a relatively low base in 2023, Apple’s four new models are expected to have a combined production volume of 86.7 million units in the second half of 2024, marking an 8% year-on-year increase.

Looking at total production for 2024, Apple is currently close to Samsung, the market leader, and could potentially surpass Samsung by the end of the year to become the top smartphone manufacturer by market share for the first time.

• Huawei’s World-First Triple-Fold Design Sets a New Standard

At the Huawei Extraordinary Brand Event and HarmonyOS Product Launch, Huawei officially unveiled the world’s first mass-produced triple-fold smartphone, the Mate XT. Prior to Huawei, companies like Samsung, TCL, and even Africa’s smartphone leader Transsion had already showcased triple-fold “concept phones.”

According to official reports, Huawei Mate XT measures 156.7mm in length. When unfolded, its width is 73.5mm in single-screen mode, 143mm in dual-screen mode, and 219mm in triple-screen mode.

When folded, the device is just 12.8mm thick and weighs approximately 298g. Mate XT boasts the world’s largest foldable screen at 10.2 inches, with a high resolution of 2200 x 2480. With a thickness of just 3.6mm, the Mate XT offers a user experience rivaling that of a small tablet, while still being compact enough to fit in a pocket when folded.

TrendForce reports that shipments of foldable phones are expected to reach 17.8 million units in 2024, making up only 1.5% of the smartphone market. Despite high repair rates and costs, market penetration is projected to climb to 4.8% by 2028.  

Samsung, which held a dominant 60% market share in foldable phones between 2023 and 2024, is facing more intensive competition from multiple smartphone brands, pushing its market share down to 50%, and Huawei has become its fiercest competitor.

The launch of Huawei’s 4G foldable Pocket S in 2023 performed exceptionally well in the market, driving Huawei to break into double digits for the first time in foldable phone market share, reaching 12%.

In 2023, Huawei also introduced upgraded 5G foldable phones, including the Mate X5 and Pocket 2. With the recent release of the Mate XT, Huawei’s foldable phone market share is expected to approach 30% by the end of this year.

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(Photo credit: Apple)

Less than 12 hours after Apple’s fall product launch, Huawei held its own event on the other side of the Pacific. As expected, they unveiled the world’s first tri-fold phone, the Mate XT. Its release date is also set to coincide with Apple’s, launching on September 20. As per a report from CNBC, after the launch event, the number of Mate XT pre-orders has already exceeded 4 million.

According to a report from Economic Daily News citing Richard Yu, Chairman of Huawei Consumer Business Group, the biggest breakthrough in Huawei’s tri-fold phone is its solution to screen and hinge technology, which enables both inward and outward folding simultaneously. This design enhances the screen’s resistance impact.

The phone’s thickness is only 0.36 cm, and the battery, at 0.19 cm, is considered the thinnest in the world. Meanwhile, the new model is said to support multiple AI applications, and offers satellite communication.

Huawei revealed that the price of the Mate XT ranges from CNY 19,999 to CNY 23,999, aligning with market expectations. Sources cited by Economic Daily News are optimistic about the potential of Huawei’s tri-fold phone, and Taiwanese company Fositek will benefit as the exclusive supplier of hinges, one of the most critical bearing components, for the Mate XT.

Yu emphasized that the production cost of this tri-fold device is extremely high, though it may decrease as manufacturing yield rates improve. He highlighted three key breakthroughs with this new phone: the tri-fold design, cutting-edge technology, and its alignment with future trends.

The timing of Huawei’s product launch coincided with Apple’s fall event, and the announcement of the tri-fold device drew attention once again as its release date, like Apple’s iPhone 16 series, is set for September 20. Huawei also chose the specific time of 10:08 AM to start sales.

Richard Yu introduced the Mate XT as the world’s first mass-produced tri-fold smartphone, featuring a 10.2-inch screen. The product took the R&D team five years to develop and is described as bringing sci-fi into reality.

Reportedly, it supports multiple uses, allowing users to switch between single, double, and triple fold for large-screen viewing. Along with the phone, Huawei also launched a foldable touch keyboard, embodying the concept of putting both a computer and a keyboard in your pocket.

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(Photo credit: Huawei)