According to a report from UDN, China’s largest semiconductor packaging and testing company, JCET, has completed the planning and verification work for the first phase of the “JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project.”

The project will soon be completed and put into production. Once operational, it will have an annual production capacity of 6 billion high-end advanced packaging chips, providing one-stop services from collaborative packaging design to chip production for 5G, artificial intelligence, and other applications.

As per WeChat account DRAMeXchange citing sources, the project is a major industrial initiative in Jiangsu Province, China, with a total investment of CNY 10 billion. Upon completion of the first phase, the project will have an annual production capacity of 6 billion high-end advanced packaging chips.

The project will focus on leading-edge high-performance packaging technologies, such as 2.5D/3D high-density wafer-level packaging. JCET Microelectronics commenced construction of its new plant in the eastern part of Jiangyin City on July 29, 2022, with the project expected to be completed and put into production between June and July 2024.

At the groundbreaking ceremony in 2022, JCET CEO Zheng Li stated that this project will represent the highest production technology level and largest single-investment smart manufacturing project in China’s integrated circuit packaging and testing and chip manufacturing industry. Thus, it will support end applications such as 5G, artificial intelligence, the Internet of Things, and automotive electronics, covering key strategic customers worldwide.

This project, per Li, will further enhance JCET’s global market competitiveness in the chip manufacturing sector, aiming to achieve a higher industrial position in the global integrated circuit industry.

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(Photo credit: JCET Group)

Chinese tech giant Huawei, which plans to launch its Mate 70 Series in the fourth quarter, is reportedly to feature the latest Kirin 9100 processor in these models. Though there were rumors indicating that the chip will be manufactured with SMIC’s 5nm node, according to a report by Wccftech, the next Kirin SoC for the Mate 70 Series will still be limited to SMIC’s 7nm process.

Kirin 9100’s predecessors, the Kirin 9000S and the Kirin 9010, have been mass-produced using SMIC’s 7nm (N+2) technology, the report notes. As market speculations previously indicated that Huawei might use 5nm in its next Kirin SoC, there seems to be a twist in Huawei’s plans.

According to Wccftech, the next Kirin SoC for the Mate 70 series will likely be mass-produced using SMIC’s N+3 process, which offers higher density compared to the N+2 variant. The move means that instead of transitioning to SMIC’s 5nm, Huawei’s latest Kirin SoC may choose to stay with 7nm.

It is worth noting that even under the U.S. export control, SMIC is said to successfully produce 5nm chips using DUV lithography instead of EUV, which is typically required for 5nm production. However, as the high cost and low yield of DUV make it a challenging feat for most manufacturers, Huawei’s decision may be practical.

As previously reported by the Financial Times, industry sources have indicated that SMIC’s prices for 5nm and 7nm processes are 40% to 50% higher than TSMC’s, while the yield less than one-third of TSMC’s. Later, it was estimated that SMIC’s 5nm chip prices would be up to 50 percent more expensive than TSMC’s on the same lithography, meaning that Huawei would face a tough time selling its Mate 70 series to consumers with a decent margin if it attempts to absorb a majority of those component costs.

Therefore, Wccftech now states that the Kirin 9100 might be fabricated using the 7nm process. By employing the N+3 node, it could achieve a higher density than the Kirin 9010 and the Kirin 9000S, which are manufactured by the N+2 node. This improvement means that the Kirin 9100 will have a higher transistor count, leading to better performance per watt and improved power efficiency.

Alongside the new chipset for the Mate 70 family, Huawei is rumored to be testing the same N+3 technology for its ARM-based hardware, the report notes.

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(Photo credit: Hisilison)

Earlier on July 10^th, in the Galaxy Unpack 2024 event in Paris, Samsung introduced its AI smartphone Galaxy Z Fold6 and Galaxy Z Flip6, along with the “Google Gemini” app installed in the models. However, according to the reports by Reuters and Business Korea, these two tech giants may be facing the investigation of the European Union (EU) antitrust regulators, on whether the collaboration might impede market access for other AI developers or limit competition.

It has been a while since the two tech heavyweight started to team up on AI. Samsung’s first AI phone, Galaxy S24, released earlier this year, has featured its self-developed AI, Gauss, as well as Google’s Gemini Nano.

The EU has ramped up its market monitoring efforts following the implementation of the Digital Markets Act (DMA) in March, focusing on major global tech companies. The DMA identifies seven companies—Google, Amazon, Apple, Meta, Microsoft, Booking and ByteDance —as ‘gatekeepers’ and imposes specific regulations on them to ensure fair competition in the digital market, Business Korea noted.

Now the spotlight has been shifted to the AI sector. According to Reuters, EU antitrust regulators are inquiring whether Google’s multi-year generative AI deal with Samsung hampers rival chatbots on Samsung smartphones. The report noted that last month, the European Commission announced it would send requests for information to understand the impact of the deal, which involves Samsung embedding Google’s Gemini Nano in its Galaxy S24 series smartphones.

According to the Reuters report, regulators are investigating if the pre-installation of Gemini Nano limits the functionality of other chatbots and applications on Samsung smartphones. The EU also asked companies whether they had attempted to enter into pre-installation agreements with Samsung for their chatbots and, if so, requested explanations for any failures. Respondents are required to complete the urvey by this week.

If anti-competitive practices are confirmed, an antitrust investigation against Google and Samsung could be initiated, Reuters stated.

According to Business Korea, after the Galaxy Unpacked 2024 event, TM Roh, President of Samsung Electronics (Head of MX Business Division), addressed regulatory risks during a press conference, saying the company is having various discussions internally and externally regarding EU regulations.

Roh also emphasized Samsung’s commitment to data security, stating that sensitive information is processed on-device (without connecting to external servers), making it inaccessible even to the company,” and highlighted the company’s approach to giving consumers the choice of using AI functions on-device or via the cloud.

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(Photo credit: Samsung)

Huawei’s Consumer Business CEO, Richard Yu, has publicly revealed plans for Huawei’s next-generation tri-folding phone for the first time. He stated that this product, widely considered challenging to achieve in the industry, is finally about to be launched after five years of development.

According to a report from the Chinese technology website ” Chinaz,” the tri-folding phone features an innovative inside-out folding mechanism and a dual-hinge design, with the screen size expected to reach approximately 10 inches.

Richard Yu pointed out that this new design will not only revolutionize the way phones are used but also broaden their use cases. When fully unfolded, the phone can rival a tablet, meeting basic office needs such as text and spreadsheet processing.

The latest industry news cited by the report further suggests that Huawei’s tri-folding phone will be unveiled in September, set to compete with Apple’s iPhone 16 series. Although the price of Huawei’s tri-folding phone is expected to be very high, potentially starting at nearly CNY 20,000, significantly surpassing the price of an iPhone, it showcases Huawei’s top-tier domestic technology and innovation in China.

However, despite the relatively noticeable growth in shipment volumes, the base number of foldable phones is very low, and the overall market size remains small.

Compared to the traditional smartphone market, which easily reaches sales volumes of over one billion units, TrendForce previously estimated that the shipments of foldable phones are expected to reach 17.8 million units in 2024, making up only 1.5% of the smartphone market. Despite high repair rates and costs, market penetration is projected to climb to 4.8% by 2028.

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(Photo credit: Huawei)

The Japanese Ministry of Economy, Trade, and Industry’s 2024 White Paper on International Economy and Trade reveals that in its examination of imported goods sources, over half of the import value for 1,406 product categories (accounting for over 30% of the total) comes from China. This figure is 1.5 times higher than that of the United States, which relies on China for only 567 product categories. Thus, Japanese media Nikkei’s report has highlighted that this data underscores Japan’s significant dependence on China within its supply chain.

According to Nikkei, Japan’s trade statistics for 2022 covered approximately 4,300 types of goods. The report indicates that nearly 40% of these products are highly dependent on a single import source, with China being the predominant supplier.

Specific data further hints that Japan’s highly dependent imports from China include laptops, air conditioners, organic chemicals, and rare-earth metals. Additionally, over 90% of Japan’s imported household appliances originate from China. Moreover, China serves as Japan’s primary supplier of phosphorus, a key raw material for fertilizer production.

The data also indicates that Japan imports 252 and 151 types of goods that are “highly dependent” on the United States and South Korea, respectively, ranking these countries second and third in terms of Japan’s import dependency. In contrast, other G7 members exhibit lower levels of dependency on single import sources compared to Japan.

Per Nikkei’s report, essential minerals, semiconductors, and fertilizers have been designated as critical goods by the Japanese government. The data in the latest White Paper indicates that Japan’s supply chain is significantly dependent on China, highlighting the importance of diversifying procurement sources and conducting risk assessments. Japan has already started implementing measures to reduce reliance on China in cooperation with the United States and Europe.

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(Photo credit: Lenovo)