Google’s Tensor G4 could mark Samsung’s last mass-produced SoC, as earlier in May, Tensor G5 is reportedly adopting TSMC’s advanced 3nm process. Now here’s the latest development. According to a report by Wccftech, the chip, to be used in Google’s upcoming Pixel 10 lineup, has already reached tape-out, with mass production expected in 2025.

Google’s Tensor G5 would be its first fully self-designed smartphone SoC. Previous Tensor chips, somehow, were modifications from Samsung’s Exynos series, with Samsung being its foundry partner.

The report stated that Google’s decision to collaborate with TSMC is influenced by the Taiwanese semiconductor company’s established reliability in mass-producing wafers using its next-generation nodes.

Before Google, the foundry behemoth has already secured several major clients for its 3nm node. Both Qualcomm and Taiwanese smartphone fabless company MediaTek have reportedly adopted TSMC’s N3E node for their first 3nm chipsets. Apple’s upcoming A18 chips for iPhone 16 models, are said to be manufactured with TSMC’s N3E node as well, according to a report by Commercial Times.

On the other hand, regarding the progress of 3nm, Samsung is still struggling with the low yield rate for its latest Exynos 2500 processors. The company targets to increase the yield rate to over 60% before the product enters mass production, according to a previous report by Korean media outlet ZDNet Korea.

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• [News] Google Reportedly Shifts Orders from Samsung to TSMC for Its Upcoming Tensor G5 in the Pixel 10 Series

(Photo credit: Google)

According to a report from Notebookcheck citing market rumors, it’s suggested that the AMD Zen 6 architecture, codenamed Morpheus, will utilize 2nm and 3nm processes. The Zen 6 series includes three versions: Standard, Dense Classic, and Client Dense. Later rumors also indicate the architecture will feature three core configurations: 8-core (Zen 6), 16-core (Zen 6c), and 32-core (Zen 6c Extended).

The same report further indicates that, in the consumer market, the Zen 6 series will include high-end laptop versions like Medusa Point, platform versions for AM5 like Medusa Ridge, and versions suitable for both gaming laptops and desktops like Medusa Halo. AMD plans to launch the Zen 6 architecture in the second quarter of 2025, with production starting by the end of 2025, though mass production might be delayed to 2026.

AMD unveiled Strix Point at COMPUTEX 2024, featuring a combination of the Zen 5 series and RDNA 3.5 architecture. Strix Point’s launch was delayed by two quarters due to issues related to AMD’s plans for 3nm production, which were eventually canceled.

AMD also had plans for Strix Halo, rumored to use TSMC’s N3E process for producing IOD (input/output die) chips similar to Medusa Halo. Strix Halo’s launch was also delayed, possibly due to issues with the IOD chip.

Compared to the Zen 5 series architecture, the Zen 6 series is expected to feature a nearly redesigned memory controller and a new scheduling program. The Zen 6 architecture represents a significant overhaul similar to the Zen 2 architecture, with substantial changes. AMD is said to be looking to finalize the Zen 6 series design by the third quarter and commence production in 2025.

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• [News] A Quick Overview at TSMC’s Latest Collaboration with Intel, NVIDIA and AMD at COMPUTEX 2024
• [News] TSMC’s Advanced Packaging Capacity Fully Booked by NVIDIA and AMD Through Next Year

(Photo credit: AMD)

MediaTek and Xiaomi Group have deepened their collaboration. On July 2, Xiaomi China’s Vice President of Marketing and General Manager of the Redmi brand, Wang Teng, announced on Weibo that the joint laboratory between Xiaomi and MediaTek has officially opened at Xiaomi’s Shenzhen R&D Center, with the new “Redmi K70 Supreme Edition” being the first product from the joint lab.

According to a report by etnet, the joint laboratory between Xiaomi and MediaTek covers five core capabilities, focusing on three major technological parts: performance, communication, and AI.

MediaTek, a global leader in smartphone chip shipment, maintains close cooperation with its brand clients.

Wang noted that following the Post-Performance Era Launch event last year, the cooperation between Xiaomi and MediaTek has reached another notch with a  goal of creating the strongest product performance experience and realizing the pre-research and implementation of the latest technologies.

A report from ithome revealed that Xiaomi and MediaTek have already entered into several collaborative agreements in the past, in which Xiaomi was often the first to launch new Dimensity processors. The two companies have also co-developed several Ultra versions of Dimensity processors.

Wang described the K70 Supreme Edition as the “performance demon” and the most sincere value-for-money product, offering a more comprehensive flagship experience. It is a gold standard for Dimensity performance jointly created by Redmi and MediaTek, aiming for three number ones: highest performance scores, best game frame rate/energy efficiency, and longest concurrent operation of super frame rate and super resolution.

Wang also mentioned that especially for the third goal, MediaTek, based on Dimensity 9300+ chip, has equipped the K70 Supreme Edition with the new-generation gaming discrete GPU and its self-developed dual-chip scheduling technology. “Not only to achieve super frame rate and super resolution in original/iron mode but also to realize the longest concurrent operation time, allowing users to enjoy games for longer periods.”

MediaTek Dimensity 9300+ is part of the Dimensity 9300 series of chips, launched in May this year. It is built using TSMC’s 4nm process and features an eight-core CPU with four Cortex-X4 super cores, reaching a maximum frequency of 3.4GHz, surpassing the level of Dimensity 9300.

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• [News] China’s Xiaomi and Unisoc Claim Domestic 4nm Mobile Processors Coming Soon
  

(Photo credit: MediaTek)

While NVIDIA is likely to face accusations from the French antitrust regulators, the Non-NVIDIA Alliance like the UALink (Ultra Accelerator Link) Alliance and the UXL Foundation are reportedly launching a counterattack, significantly increasing their efforts in developing specialized ASICs.

According to a report from Commercial Times, relevant semiconductor intellectual property (IP) is expected to be widely adopted. The sources cited by the report point out that Taiwanese manufacturers, benefiting from their leading position in wafer foundry and comprehensive ASIC and IP layout, are poised to capitalize on the rise of the Non-NVIDIA Alliance.

The report further cites sources, indicating that major Taiwanese ASIC manufacturers such as Global Unichip, Faraday Technology, and Progate Group Corporation (PGC), along with silicon IP companies M31 Technology Corporation, eMemory, and the Egis Technology Group, are actively expanding in this field.

In order to challenge NVIDIA’s dominance in the market, UALink (Ultra Accelerator Link) Alliance, led by tech giants such Intel and AMD, was formed in May. The alliance aims to establish a new standard for AI accelerator links, aiming to challenge NVIDIA’s  NVLink.

Furthermore, the UXL Foundation’s Open Source Software Project, supported by tech giants Qualcomm, Google, and Intel, is said to be looking to rival NVIDIA’s CUDA software. By providing alternative software solutions, it aims to diminsh NVIDIA’s dominance in the AI field.

Semiconductor industry sources cited in the same report also note that CSPs are accelerating the development of their own chips, with Taiwanese manufacturers actively entering the market.

Although Broadcom and Marvell currently offer diversified design services, Taiwanese manufacturers have an advantage due to the tightly-knit semiconductor supply chain. This enables complete solutions for both chip manufacturing and packaging within Taiwan, giving them a strategic edge over competitors by being close to both the market and factories, thereby enhancing their position in the ASIC sector.

Global Unichip and PGC leverage TSMC as a strong ally. Reportedly, Global Unichip holds AI-related ASIC orders from Microsoft and is gradually finalizing collaborations with major South Korean companies, with business operations expected to improve in the second half of the year.

On the other hand, Faraday Technology closely collaborates with Intel, developing SoCs using Intel’s A18 process. Meanwhile, industry sources cited by the report suggest that Intel’s Gaudi series AI chips might seek collaboration opportunities beyond just working with Alchip.

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• [News] Novatek, a Major Driver IC Manufacturer, Reportedly Eyes Entry into ASIC and Silicon IP Battlefields

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According to a report from Commercial Times, Arthur Chiao, Chairman of Winbond, stated that this upward market cycle for the memory sector has arrived on time. Reportedly, customers are not worried about shortages, and all products made by Winbond will sell well all year round, boosting the momentum in 2025.

Looking at Winbond’s recent revenue trend, the company’s performance has risen in the second quarter, further hinting that the upward market cycle has arrived on time. Chao anticipates that this upward cycle could last for two years, making 2025 a good year throughout, with a possible downturn in 2026.

Considering Winbond’s NOR Flash, which has held the largest global market share since 2020, Chiao noted that this product is widely used in automotive, communication, telecommunications, wearable devices, and other technological applications. Overall, its sales recovery also represents a revival of the electronics market.

Regarding individual industries, as per the same report, Winbond expects the PC end market to grow by 5% to 10% in 2024. The mobile phone market, which has been in decline for three years, is also rebounding from its trough, with an estimated single-digit percentage growth. Consumer products, the first sector to undergo inventory adjustments, are also the fastest to recover. Networking and communications, driven by the growing application of Wi-Fi 7, is also optimistic in the second half of the year.

Winbond is also implementing the NCNT (Non-Taiwan, Non-China) strategy. Arthur Chiao emphasized that global trends are irreversible, and the company is starting to make early preparations in response to customer demands. Winbond’s General Manager, Pei-Ming Chen, added that the company will outsource packaging and testing to a partner factory in Malaysia and will first conduct product verification work. Although costs will rise, customers have indicated that it is acceptable.

Chiao further stated that in response to the AI trend, Winbond has adjusted its strategy and business organization. The company is transitioning from a component supplier to a service-oriented manufacturer and have established a dedicated business unit for customized memory solutions (CMS).

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• [News] DDR3 Price Rebound Expected in the Upcoming Quarters, Benefiting Taiwanese Manufacturers
• [News] From Technical Prowess to Integration Capability, TSMC and Intel Target Advanced Packaging to Seize Ecosystem Opportunities

(Photo credit: Winbond)