Insights
TrendForce's investigation into the supply chain reveals that Apple plans to upgrade the PCB materials in its new iPhone models in 2024. The current copper-clad laminate (CCL) will be partially replaced with resin-coated copper (RCC), aiming to reduce the size and thickness of the mainboard. This up...
Insights
The ongoing global economic downturn continues to impact consumer confidence in the market. TrendForce reports that the global production volume of smartphones in 1Q23 was only 250 million units—marking a 19.5% YoY decrease. This represents not only the greatest annual decrease but also a histor...
In-Depth Analyses
Recently, there has been news of collaboration between NVIDIA and MediaTek. Speculation suggests that the future collaboration may extend to smartphone SoCs, allowing MediaTek to enhance the graphical computing and AI performance of Dimensity smartphone SoCs through NVIDIA's GPU technology licensing...
In-Depth Analyses
The excitement surrounding ChatGPT has sparked a new era in generative AI. This fresh technological whirlwind is revolutionizing everything, from cloud-based AI servers all the way down to edge-computing in smartphones. Given that generative AI has enormous potential to foster new applications an...
In-Depth Analyses
Due to geopolitical and pandemic, Apple has been accelerating the diversification of its supply sources, with India being the most well-known case for such transfer. According to TrendForce, India's Tata Group is expected to become the fourth iPhone assembler for Apple. Following Apple's pattern, ne...