After obtaining approval from Chinese regulatory authorities at the end of November, Broadcom, a leading IC design company, has officially completed the acquisition of VMware, a prominent player in cloud computing. This strategic move propels Broadcom into the competitive cloud market, with software becoming a substantial part of its revenue. This trend of IC design companies, including AMD, Qualcomm, and Nvidia, venturing into software acquisitions continues to reshape the industry landscape.

Broadcom announced the acquisition of VMware on May 26, 2022, through a cash and stock transaction valued at USD 61 billion. After obtaining approvals from global regulatory authorities, including the EU, UK, South Korea, and Japan, the final conditional clearance from Chinese authorities was secured. This clearance involved ensuring compatibility between VMware server software and Broadcom hardware competitors’ products. The official announcement of completion came on November 22, 2023, following approval from Chinese authority. The final total transaction value came to USD 69 billion.

VMware, known for its expertise in cloud computing and virtualization software, separated from Dell in late 2021. With a customer base exceeding 400,000, it competes with Nutanix and Cloud Software Group. VMware’s core service lies in multi-cloud management, streamlining the integration of cloud resources from various vendors. It enables customers to manage multiple public clouds on a unified platform. The VMware platform significantly reduces the time needed for data migration to different public clouds, from 45 months to approximately 2.5 months.

Broadcom’s Software Business Soars to 40-45% Share after Acquisition, Ventures into Cloud and AI Markets

In 2023, VMware is expected to dominate the server virtualization market with a market share exceeding 70%. VMware’s strategic plan involves increasing the sales share of subscription services and cloud services from 25% in 2021 to 40% by 2025. With Q2 2023 revenue of USD 3.41 billion, almost double the size of Broadcom’s software business, the merger positions Broadcom’s software business to account for 40-45% of the total revenue.

This May, Broadcom CEO Tan Hock Eeng publicity stated that his company is committed to an annual investment of USD 2 billion in VMware’s R&D. Following the acquisition, Broadcom’s software division will be rebranded as VMware, and a shift from perpetual software licenses to subscription and SaaS models is planned. Broadcom aims to increase VMware’s EBITDA from USD4.7 billion in the 2022 fiscal year to USD 8.5 billion within three years.

Besides Broadcom’s entry into the cloud market through VMware, TrendForce also highlights VMware’s significance as a key partner for NVIDIA. The expanded strategic partnership, announced in August 2023, resulted in the establishment of Private AI Foundation with NVIDIA. Built on the VMware Cloud Foundation, the Private AI Foundation is a platform that allows enterprises to customize models and deploy Generative AI applications. The acquisition positions Broadcom to tap into NVIDIA’s AI ecosystem, providing an opportunity to join the NVIDIA AI server supply chain and explore the immense potential brought by AI.

Tech Giants Embrace Ecosystem Competition as IC Design Firms Dive into the Software Industry

To enhance customer loyalty, major companies including Apple, Microsoft, Google, have progressively taken part in ecosystem competition in recent years. These companies have successfully established robust ecosystems. At the same time, IC design companies are gradually venturing into the software industry, shifting the focus from mergers within the IC design sector to mergers in the software industry. In addition to Broadcom acquiring VMware, notable instances in 2022 include AMD’s acquisition of data center platform provider Pensando, Qualcomm’s purchase of automotive software companies Veoneer and Arriver, and NVIDIA’s takeover of software-defined storage(SDS) company Excelero.

For Broadcom, strategic acquisitions have been a recurring theme since the failed attempt to acquire Qualcomm in 2018, after former U.S. President Donald Trump blocked it with national security concerns. Notable acquisitions include the USD18.9 billion purchase of mainframe service company CA Technologies in 2018, the USD 10.7 billion acquisition of the security division of Symantec in 2019, and the unsuccessful attempt to acquire statistical analysis software company SAS Institute for USD15-20 billion in 2021.

Buying software companies provides Broadcom with the advantage of leveraging cross-selling. This enables the promotion of its products, such as compute offload business, server storage connectivity, fiber optics, Jericho routers, and Tomahawk switches, to enterprise customers adopting solutions from these software companies.

(Image: Broadcom)

Honda, the Japanese automotive giant, is set to lay off around 900 employees from its Chinese joint venture, GAC Honda. This move comes as the company adjusts to the shifting market focus towards electric vehicles (EVs). Notably, this marks the first instance of job cuts in the 25-year collaboration between Honda and Guangzhou Automobile Group Co., Ltd. (GAC).

TrendForce’s Insights:

1. Independent Brands in China Ascend but Japanese and Chinese Joint Ventures Decline

As per GAC Honda’s released data, the cumulative production and sales figures for the first ten months of 2023 witnessed a significant drop of 20.52% and 21.55%, totaling 520,500 and 499,400 vehicles, respectively. Apart from GAC Honda, both GAC Toyota and FAW Toyota have embarked on plans to scale back production or streamline personnel. Mitsubishi Motors announced officially to exit the Chinese market in October 2023, with GAC Aion taking over its factory.

Despite efforts by Japanese automakers to catch up EV revolution, the competition from independent brands remains formidable. GAC Honda and Dongfeng Honda introduced pure electric models like e:NP1 and e:NS1 in the Chinese market. GAC Toyota and FAW Toyota also entered the EV market with models like bZ3 and bZ4X.

However, facing intense competition from independent brands, joint ventures struggle to maintain market share. According to the China Passenger Car Association (CPCA) data, independent brands claimed 60% of the market share in October 2023, while joint venture brands dropped below 40%. This is a stark contrast to two years ago when independent brands held only 41.2% of the market.

Constrained by the cautious approach of Japanese automakers to vehicle electrification, joint ventures lack a robust lineup of pure electric models, relying mainly on hybrid models. Despite the hybrid technology’s strength in Japanese automakers, they are gradually losing ground to independent brands like Geely and BYD, resulting in a steady decline in joint venture brands’ market share.

2. Japanese Automakers Urged to Collaborate Openly with Chinese Counterparts

The hybrid models and brand strength of Japanese automakers continue to command a presence in the market, due to current challenges such as EV high prices and range anxiety. However, in the mature Chinese market for pure electric vehicles, Japanese automakers must cede more control over the development of joint venture models to Chinese manufacturers. An example of successful collaboration is Dongfeng Nissan’s Venucia, which is based on Dongfeng Motor’s technology, blending Chinese manufacturers’ expertise with Japanese automakers’ brand strength.

Japanese joint venture brands face challenges, highlighting the necessity for innovative advancements in model technology amid the new energy vehicle era. Faced with the trend towards higher intelligence and electrification in new energy vehicles, Japanese automakers must recognize that their current priority is not to surpass Chinese manufacturers but to navigate the electrification wave successfully. Joint venture brands act as a crucial lifeline, and Japanese automakers can bridge the technological gap by leveraging joint venture platforms, utilizing resources from Chinese manufacturers, and fostering collaboration. The key lies in Japanese automakers transitioning from market development leaders to active learners.

TrendForce has released its latest report, “Analysis of EEA Architecture and ADAS Domain Controllers in New Energy Vehicles,” providing a detailed analysis of the evolution of electronic and electrical architectures in new energy vehicles and the current status of ADAS domain controllers. Excerpts from the report are as follows.

TrendForce’s Insights:

1. BEV Platform: the Ideal Carrier for High Integration EEA Development

In recent years, various automakers have been investing resources to enhance the competitiveness of their new energy vehicles, particularly Battery Electric Vehicles (BEVs), by developing BEV platforms.

With the complete elimination of internal combustion engines, BEVs exhibit a higher degree of electrification compared to other powertrain modes, facilitating the design of high-computing power and highly integrated Electrical/Electronic Architecture (EEA).

Furthermore, startup automakers unburdened by traditional internal combustion engine constraints currently lead in the integration of EEA architectures compared to traditional automakers.

2. Domain Controllers are Parts of the Key Components for the Development of Highly Integrated EEA

Currently, domain controllers with varying computational power are widely distributed in the market.

However, electric vehicles equipped with high-performance domain controllers still have prices significantly higher than the average, and given the limited economic scale of new entrants, sustained cost reduction requires continuous investment from more manufacturers and improvement in usage environment.

3. The Economic Scale of BEVs Will be the Main Hurdle for EEA Development

While BEVs are considered the optimal platform for developing highly integrated EEAs, the challenges of range anxiety and high vehicle prices continue to be significant barriers affecting the sustained growth of the market.

This has led to a recent slowdown in BEV demand, prompting automakers to redirect some of their development resources to PHEV and even HEV models. These vehicle types may not necessarily require or be suitable for high-performance chips.

Therefore, if PHEVs and HEVs continue to grow, they could become key factors affecting the economies of scale and widespread adoption of high-performance chips.

In November 2023, Quanta, a Taiwanese electronics manufacturer, has announced a collaboration with the U.S. AR glasses technology provider Vuzix. Through the adoption of Vuzix’s waveguide technology and optical display components, Quanta is set to engage in mass production for smart glasses, with shipments expected to commence in 2024.

The contract manufacturer like Quanta has been strengthening its technical capabilities in the VR and AR domains in recent years, aiming to possess the capacity to provide comprehensive product solutions and seize opportunities in the flourishing virtual market.

TrendForce’s Insights:

1. Quanta Continues to Explore AR Glasses, Collaboration with Vuzix Aims for Expanded Applications

In recent years, Quanta has actively invested in the AR glasses sector, including collaborative efforts with STMicroelectronics in late 2020 to develop a reference design for AR glasses and a $20 million investment in the Israeli AR startup Lumus in 2021.

The ongoing partnership with Vuzix, planning for complete device shipments, underscores Quanta’s optimistic outlook on the application development and future business opportunities for AR glasses.

Given Quanta’s key product and service areas spanning mobile computing, home entertainment, IoT, and smart manufacturing, the current trend of the metaverse positions VR and AR devices as crucial gateways to enter and add value to these domains.

With Quanta transitioning from a device supplier to a platform service provider and implementing a comprehensive development strategy of hardware-software integration, the continued focus on AR glasses holds the potential to expand profit margins for Quanta.

Vuzix, in collaboration with Quanta, has secured a prominent position in the VR and AR device market through its wearable display technology. Notably, Vuzix has developed the world’s first Micro LED AR glasses and consistently received CES Innovation Awards from 2020 to the present year.

Their product highlights encompass AR technology for swim goggles, the establishment of a comprehensive smart glasses platform featuring microLED and waveguide technologies. The recently unveiled Ultralite S, focused on sports and fitness scenarios, seamlessly integrates with smartphones or smartwatches to display real-time activity data and information on the glasses, earning it the CES 2024 Innovation Award.

With Vuzix possessing critical optical technology and components across a broad product range, the collaboration aligns well with Quanta’s AR transformation, particularly enhancing Quanta’s QOCA telemedicine cloud platform in the medical field. The synergy between the two marks a harmonious and mutually beneficial partnership.

2. Contract Manufacturer Actively Strengthen VR and AR Tech Capabilities Through Collaboration and Investment to Seize Virtual Opportunities

In addition to Quanta, various contract manufacturers have been actively enhancing their technological capabilities in the VR and AR industry through collaborations, mergers, and investments. Notably, Foxconn has been investing in and collaborating with key players in the VR and AR device market since 2022, including XRSPACE, Varjo, and the early part of 2023 with Jorjin.

Looking at other contract manufacturers, GoerTek works with major clients like Meta, Sony, and PICO, Luxshare has Apple Vision Pro assembly orders, and Pegatron has handled products for Microsoft HoloLens and Oculus, while Quanta has been involved with Microsoft Mixed Reality Headset.

Therefore, for Foxconn and other companies aiming to enter this field, adopting more investment and collaboration strategies, or even directly acquiring key tech firms, will be the fastest way to rapidly strengthen their competitive position in the VR and AR market.

Looking at the overall supply chain of the VR and AR virtual device industry, the efforts of assembly plants to strengthen their technical capabilities go beyond providing assembly outsourcing. To a certain extent, this is also aimed at developing the ability to offer complete product solutions, catering to a broader customer base.

Given that these devices prioritize image precision and real-time capture, high-end products require more components and sensors. Moreover, the non-uniform design of head-mounted devices adds complexity to the assembly of VR and AR devices.

Additionally, not all companies have the resources and industry competitiveness, as in the case of Meta and Sony, to independently develop head-mounted devices from scratch. For many, obtaining a more comprehensive product solution and then making adjustments is a more practical approach. This necessitates contract manufacturers to have enhanced VR and AR technology and ODM capabilities. This way, amidst the flourishing opportunities in the virtual market, they can offer complete head-mounted device solutions.

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According to the South Korean media The Korea Economic Daily’s report, Samsung Electronics has established a new business unit dedicated to developing next-generation chip processing technology. The aim is to secure a leading position in the field of AI chips and foundry services.

The report indicates that the recently formed research team at Samsung will be led by Hyun Sang-jin, who was promoted to the position of general manager on November 29. He has been assigned the responsibility of ensuring a competitive advantage against competitors like TSMC in the technology landscape.

The team will be placed under Samsung’s chip research center within its Device Solutions (DS) division, which oversees its semiconductor business, as mentioned in the report.

Reportedly, insiders claim that Samsung aims for the latest technology developed by the team to lead the industry for the next decade or two, similar to the gate-all-around (GAA) transistor technology introduced by Samsung last year.

Samsung has previously stated that compared to the previous generation process, the 3-nanometer GAA process can deliver a 30% improvement in performance, a 50% reduction in power consumption, and a 45% reduction in chip size. In the report, Samsung also claimed that it is more energy-efficient compared to FinFET technology, which is utilized by the TSMC’s 3-nanometer process.

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(Photo credit: Samsung)