AI Chips and High-Performance Computing (HPC) have been continuously shaking up the entire supply chain, with CoWoS packaging technology being the latest area to experience the tremors. In the previous piece, "HBM and 2.5D Packaging: the Essential Backbone Behind AI Server," we discovered that th...

According to TrendForce's "2023 GaN Power Semiconductor Market Analysis Report - Part 1," the global GaN power device market is projected to grow from $180 million in 2022 to $1.33 billion in 2026, with a compound annual growth rate of 65%. The development of the GaN power device market is primar...

Toyota announced during a technical conference on June 13, 2023, that Toyota has identified suitable materials to commercialize solid-state battery technology around 2027-2028, intending to introduce new energy vehicles powered by these batteries to the market. Out of the 2.17 million electric ve...

The global automotive industry is pouring billions of dollars into SiC semiconductors, hoping that they could be key to transforming vehicle power systems. This shift is rapidly changing the supply chain at all levels, from components to modules. In the previous piece "SiC vs. Silicon Debate: Wil...

With the advancements in AIGC models such as ChatGPT and Midjourney, we are witnessing the rise of more super-sized language models, opening up new possibilities for High-Performance Computing (HPC) platforms. According to TrendForce, by 2025, the global demand for computational resources in the ...