Is the winter really coming for the memory sector? Despite an earlier report by Morgan Stanley warning of an AI bubble, U.S. memory giant Micron reveals a financial guidance that beats market expectations, projecting its fiscal first-quarter revenue to reach USD 8.7 billion, higher than an average a...

SK Hynix announced today that it has commenced mass production of the world’s first 12-layer HBM3E product with 36GB of capacity, the largest for any HBM currently available, according to the company. SK Hynix stated that it plans to deliver these mass-produced units to customers by year-end, m...

While South Korean memory giants Samsung Electronics and SK hynix saw their sales in China double in the first half of this year, the country as a whole seems to heavily rely on China for essential semiconductor raw materials as well, with silicon, germanium, gallium and indium seeing the largest in...

According to TrendForce's latest memory spot price trend report, regarding DRAM, reball DDR4 and DDR5 chips stripped from modules continue to flow into the spot market, adversely affecting the market outlook. As for NAND flash, contract prices for 3Q24 have exhibited signs of loosening. Some module ...

Taiwan’s Commercial Times, citing industry sources, reports that Samsung’s memory and smartphone divisions are considering outsourcing orders to Taiwanese firms, including TSMC and MediaTek. Competition in the global semiconductor industry remains fierce. In the foundry sector, TrendForce dat...