According to a report from Commercial Times, SK Hynix, Samsung, and Micron, the world's top three memory manufacturers, are actively investing in high-bandwidth memory (HBM) capacity expansion plans. Industry sources cited by the same report estimate that by 2025, the additional production will r...

As the demand for AI chips surges, orders for thermal compression (TC) bonders, which play a critical role in HBM (high-bandwidth memory) manufacturing, are also heating up. To further gain market momentum, South Korean chip packaging equipment manufacturer Hanmi Semiconductor plans to launch 2.5...

Unlike other major semiconductor manufacturers, including Intel and TSMC, memory giant Micron is not in a hurry to adopt EUV (extreme ultraviolet) lithography for its DRAM production. However, according to a latest report from Technews, in 2024, Micron plans to begin trial production using EUV on it...

Thanks to the rebound in memory chip demand amid accelerated global AI development, Samsung Electronics reported its strongest sales and profit growth in years. According to its financial guidance announced on July 5th, the semiconductor giant projects its operating profit to grow more than 15-fold ...

In order to address the growing demand for high-performance memory solutions fueled by the expansion of the artificial intelligence (AI) market, Samsung Electronics has formed a new "HBM Development Team" within its Device Solutions (DS) Division to enhance its competitive edge in high-bandwidth mem...