DRAM


2023-12-06

[News] Memory Market Gradually Recovering, Samsung and SK Hynix Raise Q4 Financial Outlook

According to South Korean media Chosun Biz’s report, the prices of all memory products, encompassing servers, mobile devices, and PCs, are on the rise. This trend, combined with the thriving development of the AI market, is expected to result in even higher profitability for High-Bandwidth Memory (HBM) than initially anticipated.

Major memory manufacturers Samsung and SK Hynix are beginning to emerge from a business downturn, leading to upward revisions in their financial outlook for the fourth quarter of 2023.

The report notes that the adjustments in Q4 financial outlook by Samsung and SK Hynix indicate a rapid increase in demand for HBM due to the thriving AI market. Additionally, the recovery of the largest sales item, DRAM, is contributing to better operational performance for both companies in the fourth quarter.

Market experts reveal that Samsung’s projected operating profit for Q4 is expected to be KRW 3.487 trillion, showing slight growth compared to the estimate from a week ago. As for SK Hynix, the expected loss in Q4 is KRW 294.4 billion, reflecting a convergence from the market estimate of KRW 335.3 billion a week earlier, despite remaining in a deficit.

In addition, Micron, the American company considered one of the three major global DRAM manufacturers along with South Korean companies Samsung and SK Hynix, has also revised its financial forecast for the first quarter of the 2024 fiscal year.

The initial estimate in November of USD 4.4 billion has been adjusted to USD 4.7 billion , while the expected Earnings per Share has been raised from USD -1.07 to USD -1.

Regarding trends in the memory industry, TrendForce indicated in a recent report that a key turning point in the third quarter for the NAND Flash market was Samsung’s decision to actively reduce production.

Previously, buyers maintained a low inventory and slow procurement strategy due to concerns about low visibility of end demand and worries about a lackluster market peak season. With the leading supply-side companies significantly reducing production, buyers, anticipating a significant reduction in supply, have shifted to a more positive procurement attitude. By the end of the third quarter, contract pricing for NAND Flash had shifted toward stabilization and even price increases.

TrendForce predicts that NAND Flash products will experience both increased volume and prices in the fourth quarter. The average selling price for all products is estimated to increase by 13%, and the overall revenue growth for the NAND Flash industry in the quarter is expected to exceed 20%.

Contrarily, in the case of DRAM, prices have been on a downward trend since 2023, but they started to rise from October. TrendForce believes that the three major global DRAM manufacturers have begun intensive production cuts, and as market demand begins to recover, the pricing power of memory manufacturers is gradually increasing.

In terms of DRAM supply in the fourth quarter, memory manufacturers have a clear upward pricing attitude, as TrendForce projects a noticeable increase of approximately 13-18% in contract prices during this period. However, the recovery in demand is not as strong as in previous peak seasons.

Overall, while there is demand for stocking up, in the current scenario, the server sector remains passive in terms of procurement due to high inventory levels. The shipment growth in the DRAM industry for the fourth quarter is expected to be limited.

Please note that this article cites information from Chosun Biz

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(Photo credit: Samsung)

2023-12-05

[News] Sino-US Memory Joint Venture, Longsys and Kingston Unite for High-End Embedded Solutions

On November 27, Kingston, the global leader in memory modules, and Longsys, acclaimed as key memory module maker in China, jointly announced the establishment of a new joint venture company in China. This strategic move aligns with the resurgence in the memory market, with Kingston taking the lead to step into the Chinese market, reported by UDN News.

As per the collaborative plans between Kingston and Longsys, the joint venture will be established in China, with Kingston holding a 51% stake and Longsys holding 49%. The focus is on expanding the Chinese market together. According to Longsys’ press release, the newly formed joint venture will operate independently, specializing in supplying embedded memory products to the Chinese market. Longsys will oversee product development and technical support, while Kingston will manage procurement and brand-related needs. The capital amount of the new company has not been disclosed by either Kingston or Longsys.

Founded in 1987 and headquartered in California, USA, Kingston is a globally renowned memory module product manufacturer. In 2022, it secured the top position in global memory module and solid-state drive module suppliers. Besides, it leads in the embedded storage market share and holds a dominant position as a key supplier to China’s Tier 1 OEM.

On the other hand, Longsys, established in 1999 and headquartered in Shenzhen, China, has emerged as a key player in the industry. In recent years, it acquired competitors such as Lexar in the United States and Smart Modular in Brazil. Longsys primarily focuses on NAND-related applications and is currently listed on the ChiNext board of the Shenzhen Stock Exchange.

In previous press release, TrendForce once mentioned that facing a volatile market in recent years, Chinese homegrown SSD channels are also actively advancing supply chain configurations. Aiming to step beyond China and into international waters, Chinese companies like Longsys is leading the charge by acquiring shares in Licheng Suzhou and Smart Modular to strengthen downstream module production capacity.

Regarding this joint venture, industry source anticipate that the partnership between Kingston and Longsys, with a focus on embedded storage products and NAND-related applications, will drive substantial demand for NAND chip control ICs.

Please note that this article cites information from UDN News

(Image: Longsys)

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2023-12-01

[News] CXMT’s LPDDR5 Release Fuels in Chinese Memory Market, Spotlight Progress of Global Memory Giants

On November 28, CXMT made a highlight in the Chinese market by unveiling its latest DRAM LPDDR5. It becomes the first company in China to self-develop and manufacture such DRAMs. CXMT said it has already received validation from major Chinese smartphone brands like Xiaomi and Transsion, signaling plans for swift market commercialization.

This launch not only improves the quality and cost-effectiveness of applications in personal and business sectors but also accelerates the industrialization of the Chinese DRAM industry, positioning CXMT at the forefront of the LPDDR5 era.

Latest Developments in CXMT’s LPDDR5 Strategy

The “LP” in LPDDR stands for Low Power, representing a type of Synchronous Dynamic Random Access Memory (SDRAM) product with lower power consumption compared to DDR. The JEDEC(Solid State Technology Association) categorizes DRAM into three kinds based on different application needs: Standard DDR, LPDDR, and GDDR. DDR is primarily used in servers and PCs, LPDDR in mobile phones and consumer electronics, and GDDR in image processing.

LPDDR5, the fifth generation of low-power double data rate synchronous dynamic random access memory, is the latest focus for CXMT. The company officially launched its LPDDR5 series, including 12Gb LPDDR5 chips, 12GB LPDDR5 chips with package on package (PoP) packaging, and 6GB LPDDR5 chips with die stacking chip (DSC) packaging.

CXMT’s LPDDR5 chips incorporate robust RAS (Reliability, Availability, and Serviceability) features, utilizing on-die error correction code (ECC) technology for real-time error correction, minimizing system failures, ensuring data security, and enhancing stability.

International Memory Giants Vying for Market Share

In September 2023, Samsung announced the development of a series of Low-Power Compressed Additional Memory Modules (LPCAMM), utilizing LPDDR5X memory. During the “2023 Investor Forum” held in Hong Kong in November, Samsung revealed plans to prepare new memory solutions for the automotive sector, including the new LPDDR5X.

SK Hynix officially supplied customers with 16GB capacity LPDDR5T (Low Power Double Data Rate 5 Turbo) products in November, marking the fastest mobile DRAM product with a transmission speed of up to 9.6Gbps.

Micron introduced LPDDR5X DRAM in 2022, with its LPDDR5X-9600 utilizing the latest 1β process technology. With a maximum capacity of 16GB, its speed is 12% higher than the previously fastest LPDDR5X-8533.

Promising Future for LPDDR5 Market

From the current DRAM market share perspective, TrendForce’s statistics on industry revenue from the second quarter show that Samsung has a market share of 39.6%, SK Hynix has 30.1%, and Micron (25.8%), together accounting for over 95% of the market share. Including Nanya Technology (2%) and Winbond Electronics (0.9%), the top five companies account for 98.4%.

Although industry points out that, compared to global giants, China-produced LPDDR5 currently has certain gaps in terms of capacity, speed, and other aspects, it is essential to note that LPDDR5 is trending towards becoming the mainstream in smartphone products. CXMT’s entry into this field coincides with the boom in LPDDR5 development.

TrendForce’s recent research on LPDDR indicates that LPDDR4X remains predominant in the mainstream market, with LPDDR5(X) focus on the high-end market for smartphones. However, with the introduction of Intel’s new Alder lake platform, LPDDR5(X) is gaining prominence in the laptop sector. It is estimated that the market share of LPDDR5(X) will exceed 25% in 2023.

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2023-11-29

[Insights] Weekly Price Update: DRAM Swang and NAND Remained Strong

Following the Singles’ Day Sale in China, demands are relatively cooled down. While for DRAM spot prices, market experiences fluctuations due to subdued demand and increased supply of used chips. In contrast, NAND spot price remains relatively strong under the ongoing reduction in supply.

DRAM Spot Market

Following the Singles’ Day promotional events in China, demand has cooled down compared with the previous few weeks. Looking at DRAM spot prices, prices for chips from suppliers have remained steady, but there has been an influx of used chips stripped from decommissioned modules. Spot prices of used DDR4 chips have now fallen to US$1.05, significantly lower than the spot price of around US$1.75 for new chips from suppliers. Spot prices of DDR5 chips, on the other hand, have remained relatively stable. However, Kingston has not raised module prices, making it difficult to sustain the upward momentum. The average spot price of mainstream chips (DDR4 1Gx8 2666MT/s) rose by 1.54% from US$1.683 last week to US$1.709 this week.

NAND Flash Spot Market

Demand from the spot market has become even more enervated after China’s Double 11 shopping festival when compared to that of several weeks ago. In terms of spot prices, the mainstream 512Gb wafer is supported by suppliers’ ongoing diminishment of wafer provision, and continues to march towards US$2.7-US$2.9 at a relatively robust tendency in comparison with DRAM spots, despite poor demand. 512Gb TLC wafer spots have risen by 11.54% this week, arriving at US$2.862.

2023-11-29

[News] CXMT Launches First Domestic LPDDR5, Collaborating with Industry Partners for Market Expansion

On November 28, CXMT revealed its latest DRAM product, LPDDR5. As the first Chinese brand to independently develop and manufacture LPDDR5 products, CXMT marks a breakthrough in the Chinese market and broadens its product reach in the mobile terminal market, reported by MooreNews.

CXMT’s LPDDR5, the fifth generation of low-power double data rate synchronous dynamic random access memory, boasts a 50% increase in single-die density and speed compared to LPDDR4X, respectively reaching 12Gb and 6400Mbps. Notably, power consumption is reduced by 30%. Featuring robust RAS features, including on-die error correction code (ECC) for real-time error correction, LPDDR5 enable data security and system stability. The 12GB LPDDR5 chip from CXMT is the first product adopting Package on Package (PoP) stacking for the company.

The launch of LPDDR5 by CXMT enhances the quality and reduces costs for personal and business applications, further expanding its footprint in the mobile market. As the first company in launching independently developed and manufactured LPDDR5 products in China, CXMT accelerates the industrialization of the DRAM industry, spearheading the Chinese DRAM industry into the LPDDR5 era.

LPDDR5 chips bring faster speeds and lower power consumption to mobile electronic devices, significantly improving overall product performance. According to CXMT’s website, LPDDR5 products have already received validation from major Chinese smartphone brands such as Xiaomi and Transsion, with plans to expedite overall market commercialization.

In its product lineup, CXMT specializes in DRAM design, with DDR4, LPDDR4X, and DDR4 modules catering to diverse storage needs in terms of performance, capacity, and usage. Collaborating through joint research and development with leading customer companies, CXMT delivers highly customized integrated solutions, effectively meeting the varied demands of the market. The introduction of LPDDR5 further solidifies CXMT’s position in the mobile market.
(Image: CXMT)

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