DRAM Spot Market
Compared with last week, transaction prices in the spot market have generally stopped falling, but there is no sustained upward momentum. Although suppliers and other spot sellers have been firm on prices and are unwilling to make further concessions, the overall transaction volume has continued to shrink because there has been no turnaround in the demand for end products. Further observations are needed to determine the trajectory of spot prices in the future. Nevertheless, TrendForce believes that suppliers will need to further expand the scale of their production cuts in 4Q23 in order to effectively reduce their existing inventories. The average spot price of mainstream chips (i.e., DDR4 1Gx8 2666MT/s) dropped by 0.07% from US$1.451 last week to US$1.450 this week.

NAND Flash Spot Market
Concluded prices have largely leveled to that of last week without dynamics for ongoing increment. Buyers, despite active stocking behaviors seen recently, are no longer following up on prices aggressively under the yet-to-be-improved level of actual end demand. Subsequent spot price trends will require further observation, though TrendForce believes that NAND Flash suppliers would be forced to expand production cuts during 4Q23 so as to further abate their existing inventory. 512Gb TLC wafer spots have risen by 0.63% this week, arriving at US$1.588.

According to Taiwan’s TechNews report, Lu Donghui, Chairman of Micron Technology Taiwan, stated that in response to the growing demand in the AI market, Micron Technology Taiwan will continue to invest in advanced processes and packaging technologies to produce High Bandwidth Memory (HBM) products. Micron Technology Taiwan is the only Micron facility globally with advanced packaging capabilities.

Lu Donghui, speaking at a media event, mentioned that Micron had previously introduced the industry’s first 8-layer stack (8-High) 24GB HBM3 Gen 2 product, which is now in the sampling phase. This product boasts a bandwidth exceeding 1.2TB/s and a transmission rate exceeding 9.2Gb/s, which is 50% higher than other HBM3 solutions on the market. Micron’s HBM3 Gen 2 product offers 2.5 times better energy efficiency per watt compared to previous generations, making it ideal for high-performance AI applications.

Micron’s HBM3 Gen 2 memory products are manufactured using the most advanced 1-beta process technology in Taiwan and Japan. Compared to the previous 1-alpha process, the 1-beta process reduces power consumption by approximately 15% and increases bit density by over 35%, with each chip offering a capacity of up to 16Gb. Through Micron’s advanced packaging technology, the 1-beta process memory chips are stacked in 8 layers, and the complete HBM3 Gen 2 chips are packaged and sent to customers’ specified semiconductor foundries like TSMC, Intel, Samsung, or third-party packaging and testing facilities for GPUs, CPUs.

Lu Donghui highlighted that Taiwan’s robust semiconductor manufacturing ecosystem makes it the exclusive hub for Micron’s advanced packaging development worldwide. By combining this ecosystem with Micron’s offerings, they can provide customers with comprehensive solutions to meet market demands. While HBM products represent a relatively small portion of the overall memory market, their future growth potential is significant, with expectations to capture around 10% of the entire memory market in the short term.

(Photo credit: Micron)

DRAM Spot Market
Spot prices of DRAM products have risen slightly lately due to Samsung’s earlier attempt to raise prices of 3D NAND Flash wafers as well as the temporary halt in the flow of rebelled used chips into the market. DDR4 products have experienced a more noticeable price increase compared with DDR5 products. However, there is still insufficient actual demand to sustain the rise in spot prices. Furthermore, most spot traders already have sufficient inventory. Therefore, prices have stopped falling, but the overall transaction volume is not expanding. TrendForce believes spot prices are near the trough for this downturn phase of the price cycle. Nevertheless, there is some time before the overall average spot will rebound because demand visibility is limited. The average spot price of the mainstream chips (i.e., DDR4 1Gx8 2666MT/s) fell by 0.34% from US$1.456 last week to US$1.451 this week.

NAND Flash Spot Market
The intermittent price increases of packaged dies at various capacities are reflecting persistently sluggish market demand, while wafer prices, after several consecutive weeks of elevation in prices, are now gradually subsiding in differences to that of the contract market. 512Gb TLC wafer spots have risen by 3.88% this week, arriving at US$1.578.

DRAM Spot Market
TrendForce has found that in the past week, the supply of used DDR4 chips (that were stripped from decommissioned server DRAM modules) has started to tighten. Therefore, products in the lower price range have also experienced small price hikes. However, the biggest issue still lies with the demand situation. The spot trading of chips and modules will remain tepid as long as buyers lack the willingness to make significant procurements. The average price of the mainstream chips (DDR4 1Gx8 2666MT/s) fell by 0.21% from US$1.460 last week to US$1.457 this week.

NAND Flash Spot Market
The spot market is seen with fluctuations of prices among packaged dies at different capacities, though the tendency has not continued regardless. With suppliers constantly increasing their quotations, buyers are still at the wait-and-see end and have yet to fully turn aggressive in the stocking. Wafer prices, after several consecutive weeks of slow increment, are now drawing near the low market price interval. 512Gb TLC wafer spots have risen by 5.49% this week, arriving at US$1.519.

DRAM Spot Market:

The spot market has shown no demand turnaround this week, so prices there are stagnant. Unlike the situation in the contract market, suppliers are not collectively attempting to moderate the price decline in the spot market due to the lack of a notable rebound in the sales of consumer electronics. Also, high inventories held by module houses are keeping spot prices on a downward trajectory. On the whole, spot prices of DDR4 and DDR5 products continue to show daily drops. The average spot price of the mainstream chips (i.e., DDR4 1Gx8 2666MT/s) fell by 0.07% from US$1.461 last week to US$1.460 this week.

NAND Flash Spot Market:

The spot market is seen with a recovery of purchase willingness this week due to the power outage at SK hynix, though TrendForce’s survey confirms that the particular incident has not yielded any impact towards market supply. Low-priced transactions no longer exist among spot prices of NAND Flash after suppliers’ significant drop of production in 2H23, and the declination that lasted for several consecutive weeks is now halted. 512Gb TLC wafer spots have risen by 0.28% this week, arriving at US$1.440.