News
Samsung and SK hynix, which have been rapidly advancing in the High-Bandwidth Memory (HBM) arena, now confirm their intention to incorporate hybrid bonding in the upcoming 3D DRAM technology, according to the latest report by The Elec. While the current technology uses micro bump to connect DRAM...
Insights
According to TrendForce's latest memory spot price trend report, neither the spot price of DRAM nor that of NAND flash shows much sign of a turnaround in the short term. It is also worth noting that the Chinese government has been cracking down on smuggling activities since the end of May, putting m...
News
According to Chinese media ChinaFund, there are reports that TSMC is increasing prices for its advanced 3nm and 5nm process nodes and advanced packaging. The report also cites a Morgan Stanley Securities prediction that Hua Hong Semiconductor may raise prices by 10% in the second half of the year. ...
News
South Korean patent management company Mimir IP, which acquired approximately 1,500 chip-related patents from SK hynix in May, has filed a complaint against Micron, accusing the US memory giant of infringing on its chip-related patents, the Korea Economic Daily reported. Sources suggested that if Mi...
News
Recently, Korean SSD controller manufacturer FADU announced a partnership with Western Digital to co-develop the next-generation enterprise SSD technology called "FDP (Flexible Data Placement)." FDP is a standard technology proposed by the Open Compute Project (OCP) and is a newly approved NVMe s...