Global DRAM revenue reached US$17.65 billion, a 1.1% increase YoY, in 4Q20, according to TrendForce’s latest investigations. For the most part, this growth took place because Chinese smartphone brands, including Oppo, Vivo, and Xiaomi, expanded their procurement activities for components in order to seize the market shares made available after Huawei was added to the Entity List by the U.S. Department of Commerce. These procurement activities in turn provided upward momentum for DRAM suppliers’ bit shipment. However, clients in the server segment were still in the middle of inventory adjustments during this period, thereby placing downward pressure on DRAM prices. As a result, revenues of most DRAM suppliers, except for Micron, remained somewhat unchanged in 4Q20 compared to 3Q20. Micron underwent a noticeable QoQ decline in 4Q20 (which Micron counts as its fiscal 1Q21), since Micron had fewer work weeks during this period compared to the previous quarter.

Demand for PC, mobile, graphics, and consumer DRAM remains stable throughout 1Q21. As for clients in the server segment, they have now reinitiated a new round of procurement for server DRAM after adjusting their inventories during the two previous quarters (3Q20 and 4Q20). These aforementioned factors, in addition to Micron’s power outage at the start of December last year, resulted in a price hike across all DRAM product categories in 1Q21. TrendForce expects DRAM bit supply to remain unchanged and prices to enter an upturn compared with 4Q20. However, as 1Q21 is the first quarter of the upturn in the DRAM market, and demand is yet to emerge out of the off-season, any growth in bit shipment and prices is expected to be modest, with only a slight QoQ increase in global DRAM revenue compared to 4Q20.

Suppliers’ profits were constrained by persistent declines in DRAM prices in 4Q20

With regards to revenue, the performances of Korean DRAM suppliers and that of Micron once again diverged from each other in 4Q20. This difference can mostly be attributed to the fact that, as previously mentioned, Micron had 13 work weeks in 4Q20 (which it refers to as its fiscal 1Q21) compared to the previous quarter, which contained 14 work weeks and therefore was a higher base for QoQ comparison. As such, Micron’s 4Q20 DRAM bit shipment and ASP both fell short of 3Q20 figures. Conversely, although Korean suppliers likewise experienced a QoQ decline in DRAM ASP, they were able to increase their bit shipment, indicating that their client demand was recovering during this period. Samsung and SK Hynix both increased their bit shipment by a wider margin than previously expected. This was enough to offset the downward pressure on revenue caused by the decline in the two companies’ DRAM quotes. In 4Q20, Samsung and SK Hynix each recorded a 3.1% and 5.6% QoQ increase in revenue, while Micron’s revenue declined by 7.2% due to the corresponding decline in its quarterly bit shipment. Micron’s market share also subsequently fell to 23% in 4Q20. Moving to 1Q21, however, Micron is likely to catch up to its Korean competitors in terms of market share, owing to Micron’s pricing strategies, which are the most aggressive among DRAM suppliers, as well as to a general upturn in DRAM quotes.

With regards to profits, all suppliers experienced a decline in 4Q20 as a result of the 5-10% QoQ decline in DRAM ASP. In particular, Samsung’s operating profit margin fell from 41% in 3Q20 to 36% in 4Q20, while SK Hynix likewise showed a decline from 29% in 3Q20 to 26% in 4Q20. For the September-November fiscal quarter (Micron’s own fiscal 1Q21), Micron posted a similar decline in DRAM ASP compared to that of its Korean competitors, as well as a decline in operating profit margin from 25% in 3Q20 to 21% in 4Q20. Taken as a whole, DRAM suppliers were unable to make up for the drop in DRAM quotes with cost-optimization measures. Looking ahead to 1Q21, on the other hand, TrendForce expects DRAM quotes to rebound from rock bottom, in turn generating some upward momentum for suppliers’ profitability to rebound from rock bottom as well. These events will officially mark the cyclical upturn in DRAM prices. It should also be pointed out that, for instance, leading supplier Samsung still retains at least a 30% profit margin even at the lowest level of quotes, while this figure is closer to 10% for Nanya Tech, which is comparatively smaller in scale as a company. These margins suggest that the DRAM industry will be able to maintain its profitability due to its oligopolistic nature, at least prior to the entrance of emergent suppliers from China.

With regards to Taiwanese suppliers, Nanya Tech also increased its bit shipment while its quotes fell compared to 3Q20, resulting in a slight QoQ decline of 0.7% in revenue in 4Q20. Along with falling quotes, Nanya Tech’s operating profit margins narrowed from 13.5% in 3Q20 to 8.8% in 4Q20. As for Winbond, NOR Flash products accounted for an increasing percentage of its total revenue, mostly at the expense of its NAND Flash business, in 4Q20. However, its DRAM revenue underwent a slight QoQ growth of 0.8% during this period due to an early upturn of the specialty DRAM market. This growth was relatively limited due to Winbond’s limited DRAM bit supply rather than low client demand. PSMC’s DRAM revenue includes only its in-house PC DRAM products. The company’s DRAM revenue declined by about 1.7% QoQ in 4Q20 because its production capacity for DRAM was crowded out by other logic ICs in relatively high demand, including PMICs (power management IC), driver ICs, and CIS.

TrendForce indicates that, going forward, the three Taiwanese suppliers are still placing a heavy emphasis on their strongest products while furthering their own respective competitive advantages in the industry. For instance, Nanya Tech has been actively developing its 1A/1Bnm process technologies, with the goal of submitting samples to its partners by the end of 2021. Winbond, on the other hand, is continuing to improve the yield rate of its new 25nm DRAM process technology and expand its production capacity to meet the high demand for NOR Flash memories. Finally, PSMC will continue to maintain fully loaded wafer capacity for logic ICs, which are products with relatively higher gross margins, given the high demand for such products at the moment.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com

Since 3Q20, memory suppliers’ production capacities allocated to server DRAM have dropped to about 30% of the total DRAM production capacity, according to TrendForce’s latest investigations.

While this decrease took place as suppliers sought to increase the supply of other DRAM products in higher demand, it also represented an attempt for them to adjust the ASP of various DRAM products. Furthermore, since the persistent demand for consumer electronics has shown no signs of slowing down in 1Q21, as of now suppliers have also been maintaining the same capacity allocation as last year.

However, given that second quarters have traditionally marked the cyclical upturn in server shipment, server DRAM demand is thus expected to ramp up in 2Q21, in turn prompting suppliers to raise their quotes for server DRAM. TrendForce is therefore revising up the QoQ increase in server DRAM contract prices for 2Q21 from the original forecast of 8-13% to the adjusted forecast of 10-15%, with certain transactions potentially involving as much as a 20% price hike.

Server DRAM contract prices are likely to increase by more than 40% throughout the year as demand is likely to persist through 3Q21

With regards to demand, after DRAM prices reached rock bottom at the end of last year, the oversupply situation in the market and the pressure on buyers to destock their inventory have both gradually stabilized by now. As prices closed in on historically low levels, buyers became more and more active in their procurement activities. In addition, data center demand for server DRAM is set to increase after 1Q21, driven by the increasing cloud migration needs of the post-pandemic “new normal”. This demand will likely persist through 2H21, thereby injecting additional growth momentum into the overall server market.

With regards to supply, on the other hand, DRAM suppliers will be relatively conservative in their capacity expansion efforts this year, with most suppliers having no plans to expand their capacities. Also, the oligopolistic nature of the DRAM industry means suppliers generally prioritize profitability over other factors when allocating their production capacities. Case in point, the rising popularity of WFH and distance education led suppliers to reallocate their production capacities last year. More specifically, suppliers allocated their capacities to first fulfill the high demand from the smartphone and notebook computer markets in 3Q20. As a result, capacities allocated to server DRAM underwent a corresponding decline during this period.

On the whole, TrendForce expects server DRAM contract prices to increase by about 8% QoQ in 1Q21 and by 3-4% MoM on average within the quarter. Moreover, TrendForce also does not rule out the possibility that server DRAM contract prices may experience additional slight MoM increases past this period given that contract prices are negotiated on a quarterly basis. Looking ahead, TrendForce indicates that server DRAM will remain in high demand through 3Q21, as geopolitical uncertainties and the shift of work life towards WFH continue to generate upward momentum for server shipment. Therefore, server DRAM contract prices are expected to rise by more than 40% cumulatively from late 2020 to late 2021.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com

Driven by such factors as the continued development of autonomous driving technologies and the build-out of 5G infrastructure, the demand for automotive memories will undergo a rapid growth going forward, according to TrendForce’s latest investigations.

Take Tesla, which is the automotive industry leader in the application of autonomous vehicle technologies, as an example. Tesla has adopted GDDR5 DRAM products from the Model S and X onward because it has also adopted Nvidia’s solutions for CPU and GPU. The GDDR5 series had the highest bandwidth at the time to complement these processors. The DRAM content has therefore reached at least 8GB for vehicles across all model series under Tesla.

The Model 3 is further equipped with 14GB of DRAM, and the next-generation of Tesla vehicles will have 20GB. If content per box is used as a reference for comparison, then Tesla far surpasses manufacturers of PCs and smartphones in DRAM consumption. TrendForce forecasts that the average DRAM content of cars will continue to grow in the next three years, with a CAGR of more than 30% for the period.

Based on the existing vehicle models circulating in the global car market, TrendForce estimates that the average DRAM content of cars will reach around 4GB in 2021. The growth in the average DRAM content of cars is expected to be much higher this year than in the past few years. However, car sales are not as great in scale when compared with sales of consumer electronics such as notebook (laptop) computers and smartphones. In 2019 before the COVID-19 pandemic, the annual global car sales totaled around 94 million vehicle units. Also, cars have less DRAM content compared with servers. Looking at the 2019 data, the distribution of the annual global DRAM consumption shows that the automotive memory segment accounted for less than 2% of the total.

Despite high barrier to entry, memory suppliers have been scrambling for automotive market share due to high profit margins

Compared with other application segments, automotive memory has a much higher standard for durability and reliability over the long term. The operating lifecycle of a car starts at 10 years, so DRAM suppliers basically have to guarantee that their automotive memory solutions have a product lifecycle of at least 7-10 years in order to satisfy the needs related to vehicle maintenance and replacements of parts. From the perspective of suppliers, the selection of process technology for product development and manufacturing is a key decision point when it comes to formulating a strategy for the automotive memory segment. Even as suppliers continuously migrate to the more advanced process technology, they have to ensure product longevity and long-term support for their automotive offerings.

Another issue, which is associated with durability, is operating temperature. Given that countries around the world have their own climates and extreme weather events, automotive DRAM products must have a much wider temperature range with a higher threshold and a lower threshold when compared with other categories of DRAM products, in order to ensure that cars do not break down on the road.

Finally, with density and other specifications being the same, prices of automotive DRAM products are at least 30% higher than prices of conventional commercial DRAM products. For the automotive DRAM products that have met some of the most stringent standards set by the industry, their prices can even be several times higher than prices of conventional commercial DRAM products. In sum, although automotive DRAM products are more difficult and costly to manufacture than other kinds of DRAM products, their high profit margins and large potential market have been attracting DRAM suppliers to now scramble for a piece of the automotive memory segment.

Taiwanese manufacturers show great potential as Winbond thrives in automotive OEM market with its comprehensive product portfolio

Currently, Micron is the leader in automotive memory products with a market share of nearly 50%. The supplier first has the geographical advantage. Moreover, its collaborative relationships with tier-1 automotive suppliers based in Europe and the U.S. are longer in duration compared with its competitors. Micron also has a more comprehensive product lineup for automotive applications, ranging from traditional solutions (e.g., DDR2 to DDR4) to LPDDR solutions (e.g., LPDDR2 to LPDDR5) to GDDR6 solutions. Additionally, Micron provides automakers with other types of memory technologies such as NAND Flash, NOR Flash, and MCP.

Apart from the three dominant DRAM manufacturers, Taiwan-based Nanya Tech and Winbond are continuing to release a wide variety of memory products in response to the growing demand of the automotive industry. In addition to possessing a comprehensive product mix ranging from traditional DDR solutions (e.g., up to DDR4) to low-power solutions (e.g., LPSDR to LPDDR4X), Nanya Tech has also adopted the 20nm node for a significant portion of its manufacturing processes, which are relatively stable in terms of yield rate. On the whole, automotive applications account for nearly 15% of Nanya Tech’s specialty DRAM revenue, while specialty DRAMs account for more than 60% of the company’s total revenue.

Winbond, on the other hand, has been cultivating its presence in the automotive market for more than 10 years. Although the three dominant DRAM manufacturers are ahead of Winbond in terms of process technologies, Winbond’s extensive product portfolio, which includes specialty DRAM, mobile DRAM, NOR Flash, SLC NAND, and MCP, represents a competitive advantage over the vast majority of other manufacturers. Given that the automotive OEM market is both relatively stable and profitable, Winbond has been placing a long-term focus on this market; automotive applications now comprise more than 10% of the company’s total memory revenue, and Winbond’s automotive business will likely continue to expand going forward.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com