Recently, Reuters reported that NATO (North Atlantic Treaty Organization) has confirmed the first companies to receive Innovation Fund of EUR 1 billion (USD 1.1 billion). The companies are four European tech startups namely London-based AI chip manufacturer Fractile and Germany-based robotics company ARX Robotics, as well as UK manufacturers ICOMAT and Space Forge.

It’s reported that NATO has allocated funds to Fractile and ARX Robotics. Fractile aims to enable faster operation of large language model (LLM) like the one supporting ChatGPT, while ARX Robotics designs unmanned robots capable of performing tasks, from weight lifting to surveillance. ICOMAT specializes in producing lightweight materials for the automotive industry, and Space Forge has been committed to manufacturing semiconductors in orbit by leveraging space conditions such as microgravity and vacuum.

The NATO Innovation Fund was launched in summer 2022, promising investment in technologies that can enhance its defense capabilities. The fund is supported by 24 of NATO’s 32 member countries, including Finland and Sweden, which joined NATO earlier this year.

Moreover, the fund also reportedly collaborates with venture capital firms Alpine Space Ventures, OTB Ventures, Join Capital, and Vsquared Ventures to uphold further investment in deep tech on African continent.

According to Chinese media ChinaFund, there are reports that TSMC is increasing prices for its advanced 3nm and 5nm process nodes and advanced packaging. The report also cites a Morgan Stanley Securities prediction that Hua Hong Semiconductor may raise prices by 10% in the second half of the year.

Notably, China’s wafer foundries are showing signs of reducing domestic competition. While foundry price increases are not yet confirmed, utilization rates at major foundries have significantly improved, with many operating at full capacity or even exceeding 100%.

Industry sources cited by ChinaFund believe that the sustained increase in utilization rates and full capacity at some foundries could lead to potential price hikes in the future.

TSMC was the first to signal a price hike in the wafer foundry sector. Reports indicate that the global leader in foundry will increase prices for its advanced 3nm and 5nm nodes, with a potential 5% increase for 3nm and a 10%-20% rise for advanced packaging next year.

TSMC’s 5nm node continues to receive AI semiconductor orders, maintaining high capacity utilization.

At the same time, a recent Morgan Stanley report stated that Hua Hong Semiconductor, one of China’s leading foundries, is currently operating at over 100% capacity and may raise wafer prices by 10% in the second half of this year.

In an interview with ChinaFund, United Nova Technology CEO Michael Zhao stated that the semiconductor industry’s basic pattern of change starts with memory, then digital, and finally analog ICs. “Whether it’s a downturn or recovery, this is the sequence,” he emphasized.

“We are experiencing the same trend in the power semiconductor sector. We were at full capacity in Q4 last year and saw a significant recovery in Q1 this year.”

According to tracked data cited by ChinaFund, power semiconductor manufacturers have collectively raised prices this year. Sanliansheng increased prices by 10%-20%, Bluecolor by 10%-18%, Gaoge Microchip by 10%-20%, and Jiejie Microelectronics raised prices for its Trench MOS by 5%-10%.

For the memory sector, TrendForce forecasts that Q2 DRAM contract prices will rise by 13%-18%, and NAND Flash contract prices by 15%-20%.

Huafu Securities projects that, given the gradual increase in foundry utilization rates and rising inventory levels in consumer electronics and other fields, end-market demand will clearly drive growth across the semiconductor supply chain.

ChinaFund reports that several chip companies have recently announced price increases, with some as high as 20%. For instance, Yaxin Microelectronics, Chiplink, and iCM have all issued price hike notices.

(Photo credit: SMIC)

As the market demand for AI chips keeps booming, two South Korean AI chip companies, Sapeon and Rebellions, are pursuing a merger to enhance their competitiveness. According to a report by the Korea Economic Daily, if everything proceeds as planned, the merger will result in the formation of Korea’s first semiconductor unicorn, with the new company’s corporate value amounting to 2 trillion won (USD 1.5 billion).

According to a report by Korean media outlet TheElec, the merger will be finalized within this year, following the signing of the deal in the third quarter.

TheElec stated that Sapeon Inc, headquartered in the US and the sole owner of Sapeon Korea, will be the largest shareholder of the merged entity. Post-merger, Sapeon Inc is expected to hold about 30% of the shares, with Rebellions’ CEO, Sunghyun Park, leading the new company.

Based on the reports, the alliance has been formed in order to win in the global AI chip market, while the two companies identify the next two to three years as a crucial window of opportunity.

Sources cited by TheElec indicated that Sapeon Korea is valued at 500 billion won, while Rebellion is valued at 880 billion won. Regarding details of the merger, during its Series A funding round, Sapeon issued convertible bonds to its investors instead of equity. Afterwards, these investors will receive shares in the merged entity.

It is worth noting that both Sapeon and Rebellion have been backed up by tech heavyweights. According to The Elec, South Korean telco SK Telecom, as Sapeon Inc’s largest shareholder, holds 62.5% of the company. On the other hand, memory giant SK hynix owns 25%, while SK Square holds 12.5%.

Meanwhile, according to the Korea Economic Daily, Rebellions is part of the telecom giant KT Corp.-led Korean “AI full stack” service providers, offering AI infrastructure including AI chips, cloud computing, and various applications.

The report by TheElec, citing industry sources, noted that since SK Group will be the majority shareholder of the merged entity, it may prefer TSMC over Samsung Foundry, given that SK hynix and Samsung are rivals in memory chips. For now, Sapeon uses TSMC as its foundry, whereas Rebellions collaborates with Samsung Foundry.

(Photo credit: Rebellions)

Novatek, a major driver IC manufacturer in Taiwan, has made a significant breakthrough by securing a spot in the iPhone supply chain. According to a report from Economic Daily News, Novatek’s OLED driver IC is reportedly set to be used in Apple’s upcoming iPhone 16 series, which would be the first time a Taiwanese IC design company has secured a key chip order for the iPhone. Reportedly, the order is expected to boost NovaTek’s OLED driver IC shipments in the second half of the year by 50% compared to the first half.

As the new iPhone 16 series will debut in September, reports indicate that the model will feature the latest A18 processor, produced using TSMC’s N3P process, with mass shipments expected in the third quarter.

The iPhone 16 series will continue to equip OLED panels, but with expected pixel upgrades, which will also enhance the specifications of the OLED driver IC. Novatek will supply the OLED driver IC for the new iPhone, marking its first entry into the iPhone supply chain and the first time a Taiwanese IC design company has secured a key chip order for the iPhone, the report noted.

Novatek typically does not comment on orders or customers.

Previously, Novatek’s driver ICs have been adopted by Apple’s iPad for several years, but unable to secure an iPhone order. This breakthrough comes as Novatek penetrates the iPhone 16 supply chain via the collaboration with LG Display (LGD) of South Korea, combining with LGD’s OLED panels for shipment.

According to the industry sources cited by the same report, Novatek will begin delivering the OLED driver ICs to LGD in July. These ICs will be assembled into panel modules in the third quarter and then sent to OEMs for new device production, aligning with the AI iPhone launch.

Read more

• [News] NVIDIA CEO Jensen Huang Announces the Latest Rubin Architecture – Rubin Ultra GPU to Feature 12 HBM4
• [News] AMD Unveils MI325X, Claiming 30% Faster Computing Power than NVIDIA’s H200

(Photo credit: Novatek)

The US government’s CHIPS and Science Act is reportedly injecting funds into chip manufacturing at an unprecedented rate. According to a recent report by the U.S. Census Bureau, the growth rate of construction funding for computer and electrical manufacturing is remarkably high. The amount of money the government is pouring into this industry in 2024 alone is equivalent to the total of the previous 27 years combined.

Due to the substantial funding provided by the U.S. CHIPS Act, the construction industry in the United States is experiencing explosive growth. Companies such as TSMC, Intel, Samsung, and Micron have received billions of dollars to build new plants in the U.S.

Research by the Semiconductor Industry Association indicates that the U.S. will triple its domestic semiconductor manufacturing capacity by 2032. It is also projected that by the same year, the U.S. will produce 28% of the world’s advanced logic (below 10nm) manufacturing, surpassing the goal of producing 20% of the world’s advanced chips announced by U.S. Commerce Secretary Gina Raimondo. 

Currently, new plant constructions are underway. Despite the enormous expenditures, there have been delays in construction across the United States, affecting plants of Samsung, TSMC, and Intel.

Notably, a previous report from South Korean media BusinessKorea revealed Samsung has postponed the mass production timeline of the fab in Taylor, Texas, US from late 2024 to 2026. Similarly, a report from TechNews, which cited a research report from the Center for Security and Emerging Technology (CSET), noted the postponement of the production of two plants in Arizona, US. Additionally, Intel, as per a previous report from the Wall Street Journal (WSJ), was also said to be delaying the construction timetable for its chip-manufacturing project in Ohio.

Read more

• [News] A Subsidy Wave Sweeping in the US, Europe and Japan amid the Cut-Throat Chip Competition
• [News] US Allocates USD 39 Billion Subsidy to Semiconductor Industry for Establishing Plants

(Photo credit: TSMC)