Non-Apple IC manufacturers are reporting positive business performance this quarter. Chinese brands are experiencing a revival driven by the release of new Huawei smartphones, and a resolution in inventory clearance in emerging markets. This has led to an increase in orders. Additionally, Samsung’s success in foldable phones is contributing to the upsurge. This overall trend is benefiting companies like MediaTek and Novatek in the smartphone-related IC manufacturing sector.

As reported by CTEE, China holds about 25% of the global smartphone market, with industry analysts predicting sales of 260 million units in China for 2023. Huawei’s re-entry into the smartphone market will significantly impact the smartphone SoC market share in 2024. This development will challenge Apple’s market share in China, and Huawei’s upcoming Nova mid-range smartphones will also affect brands like Honor, OPPO, Vivo, Xiaomi, and others, as they vie for market share.

Key drivers of the smartphone industry’s recovery

According to Economic Daily News, many Chinese smartphone brands are optimistic about the local market’s improvement following the launch of Huawei’s new smartphones. Beyond flagship models like the Mate 60, mid-range series like Nova are also showing increased activity. Leading non-Apple smartphone manufacturers are gearing up for a surge in demand and are actively stocking up on top-tier flagship chips, thus stimulating the supply chain’s demand for additional orders.

At the same time, Taiwanese manufacturers mention that Chinese smartphone brands that primarily target emerging markets have already digested their accumulated inventory and are now starting to replenish their stocks. Some smartphone-related chip manufacturers have also pointed out that Samsung and other Korean smartphone giants are enjoying good sales of foldable phones and have recently conveyed messages about increasing orders.

TrendForce notes that the current revival on demand side in the global smartphone market is primarily driven by inventory restocking. The potential for sustained orders remains uncertain due to the prevailing economic challenges.

(Image: MediaTek)

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As reported by Jiwei, Beijing Xuanjie Technology Co., Ltd. has recently been established, and its legal representative is Xuezhong Zeng, who holds the position of Senior Vice President at Xiaomi Corporation. The company has registered capital amounting to 3 billion Yuan and is involved in activities related to IC design services and product sales, among other areas.

This marks the second “Xuanjie Technology” venture within the Xiaomi family. Back in December 2021, Shanghai Xuanjie Technology Co., Ltd. was established, also under the legal representation of Zeng. The company’s scope of operations encompasses technological services in the semiconductor field, integration of information systems, IC design and service related, and product sales. All of these are fully owned by X-Ring Limited.

Xiaomi, alongside OPPO and VIVO, among other Chinese smartphone brands, often find it challenging to independently develop advanced system on a chip (SoC) due to constraints in technical expertise and financial resources. Consequently, their primary focus on developing specialized chips like power management integrated circuits (PMICs) and Image Signal Processor (ISP), based on their collective experience in chip development.

Xiaomi stands out as the sole Chinese brand among these peers, having successfully launched its self-developed SoC in 2017, known as the “Surge S1,” which was integrated into the mid-range Xiaomi 5C. Nevertheless, the Xiaomi 5C fell short of expectations, mainly due to the absence of distinguishing features in the “Surge S1.” Many reviews highlighted subpar real-world performance of Xiaomi phones equipped with the S1 chip.

Subsequently, Xiaomi did not introduce a successor chip. In 2021, they introduced the ISP chip “Surge C1” and the charging chip “Surge P1.” In 2022, they rolled out the PMIC G1, emphasizing its significant potential in enhancing battery health, accurate battery life predictions, and overall smartphone battery performance.

Xiaomi’s President, Weibing Lu, has previously reaffirmed the company’s unwavering commitment to developing in-house chips. They fully acknowledge the long-term and intricate nature of chip development, respect the established development patterns in the industry, and remain prepared for a long-term strategy, all with the ultimate goal of enhancing the competitiveness and user experience of their end products.
(Image: Xiaomi)

According to CTEE, NVIDIA’s forthcoming AI server, the GB200 (B100), slated for a 2024 release, has entered the certification phase in the supply chain. Recent market rumors suggest that Foxconn, originally intended to secure orders for the B100 board, faced certification challenges. As a result, Wistron has maintained its initial order share.

Additionally, it is worth noting that Ingrasys, a subsidiary of Foxconn, is actively manufacturing the H100 product and is a strong contender to secure orders.

Unofficial sources indicate that NVIDIA initially considered making Foxconn the second supplier for AI-GPU server baseboard in the upcoming B100 series. However, due to yield concerns and other factors, Wistron is still expected to receive 100% of the orders. Wistron has also capitalized on the opportunity to secure orders for the front-end AI-GPU module, which appears to be a successful move.

The rapid evolution of AI has intensified competition among assembly plants. Wistron and Foxconn play crucial roles as suppliers for NVIDIA’s current mainstream H100 series GPU modules and baseboards.

Wistron, as the exclusive supplier for H100 baseboards in the NVIDIA DGX and HGX architectures, also holds the exclusive role of providing mainboards and assembling AI servers for DGX. As shipments of the H100 series AI servers, built on the NVIDIA DGX and HGX frameworks, steadily increase in the latter half of the year, Wistron’s AI server-related product business shows consistent growth.

It’s worth noting that Ingrasys is responsible for manufacturing the H100. NVIDIA’s founder, Jensen Huang, and Foxconn’s Chairman, Young Liu, jointly attended a technology event, highlighted the close collaboration in between, underscoring Foxconn’s determination to secure B100 orders.

(Image: Wistron)

In recent developments, Samsung Foundry, a subsidiary of Samsung Electronics, has disclosed that it has initiated discussions with major chip clients, gearing up to provide services utilizing 1.4nm and 2nm processes.

It’s been said that Samsung being ahead in the production of 3nm GAA (gate-all-around) process, yet not as favored by major clients as TSMC. In response to the comment, Ki-tae Jeong, the CTO of Samsung Foundry, had share his insights at Semiconductor Expo 2023 in South Korea.

According to the Chosun Ilboon’s report, Jeong pointed out that in the semiconductor foundry industry, it typically takes approximately 3 years for major clients to make their final purchasing decisions. Samsung is actively engaging with prominent clients, and results may become evident in the coming years. Also, the company is currently discussing future processes such as 2nm and 1.4nm with major clients.

How are advanced semiconductor processes progressing?

Compared to mature processes, advanced processes are better suited for applications that demand high performance and low power consumption. With emerging technologies like AI and high-performance computing driving the industry, the demand for advanced processes continues to rise. Leading semiconductor companies are committed to developing new technologies, with chip advanced processes evolving from 5nm to 4nm and now down to 3nm, while looking ahead to the possibility of reaching 2nm and 1.4nm.

Current progress from major players:

Samsung
Samsung has already commenced mass production of its second-generation 3nm chips and aims to introduce the 2nm process by the end of 2025, with the 1.4nm process expected by the end of 2027.

TSMC
TSMC is planning to start production for N3P in the latter half of 2024, with N3X and the 2nm process set to enter mass production in 2025. TSMC will introduce Gate-all-around FETs (GAAFET) transistors for the first time at the 2nm process node, offering a 15% speed increase at the same power consumption and up to a 30% reduction in power consumption at the same speed, all while increasing chip density by more than 15%.

Intel
Intel is diligently pursuing its “Four Years, Five Nodes” plan. Presently, Intel 7 and Intel 4 are in mass production, and the Intel 3 process is expected to enter the readiness for production stage in the latter half of this year. Subsequently, Intel 20A and 18A processes are planned to enter the readiness for production stage in the first and second halves of 2024, respectively.

Moreover, industry experts believe that in the near term, Intel will focus on the Intel 3 process as its flagship offering in the advanced process semiconductor foundry sector to compete with TSMC, Samsung, and other players.

In recent updates from Shanghai Industrial μTechnology Research Institute (SITRI), Dr. Xing Wei’s research team has achieved a groundbreaking milestone in 300mm SOI wafer manufacturing technology. They have successfully created China’s inaugural 300mm Radio Frequency Silicon-on-insulator (RF-SOI) wafer.

The team harnessed the resources of the China Key Laboratory for Integrated Circuit Materials’ 300mm SOI research platform, systematically resolving critical technical challenges required for 300mm RF-SOI wafers. This involved low-oxygen high-resistance crystal production, deposition of low-stress high-resistivity polycrystalline silicon films, and non-contact planarization.

This achievement not only marks the inception of China’s 300mm SOI manufacturing technology but is also anticipated to drive the entire RF-SOI chip design, manufacturing, and packaging industry chain within China. It will also ensure a stable supply of SOI wafers in the country.

SOI technology boasts a wide range of applications, encompassing RF-SOI for communication RF front-ends, high-power Power-SOI components, and Photonics-SOI technology for optical communications. SOI technology, which positions silicon wafers on insulating material, has emerged as a game-changing innovation with unique advantages, break limitations associated with traditional silicon materials and integrated circuits.

(Image: SITRI)