According to the Korea Economic Daily. Samsung Electronics' HBM3 and packaging services have passed AMD's quality tests. The upcoming Instinct MI300 series AI chips from AMD are planned to incorporate Samsung's HBM3 and packaging services. These chips, which combine central processing units (CPUs), ...

According to Taiwan's Economic Daily, the consumer market is experiencing starkly low demand, causing IC design firms primarily relying on mature processes, such as those in driver ICs, power management ICs, CMOS image sensors (CIS), and microcontrollers (MCUs), to adopt a notably cautious approach ...

According to a report by Taiwan's Economic Daily, the revival of the smartphone market has fallen short of expectations. Industry sources have indicated that in order to stimulate customer demand and expedite inventory clearance, Qualcomm has recently initiated a price war, targeting mid- to- low-ra...

According to the latest report from TrendForce, the primary factors influencing the global market share of notebook CPUs in 2024 can be categorized into "Architectural Design" and "Economic Factors." "Architectural Design" as a long-term factor affecting market share: (1) Both AMD (AMD 3D V-Ca...

Recently, there has been news of collaboration between NVIDIA and MediaTek. Speculation suggests that the future collaboration may extend to smartphone SoCs, allowing MediaTek to enhance the graphical computing and AI performance of Dimensity smartphone SoCs through NVIDIA's GPU technology licensing...