China’s GPU company Lisuan Technology, based in Shanghai, has averted the crisis of bankruptcy, as it secures around 328 million yuan (nearly USD 46 billion) in financing from domestic NAND/ DRAM manufacturer Dosilicon and others, according to a report by Chinese media outlet Sina.

On August 20^th, Dosilicon made an announcement, stating that it plans to invest 200 million yuan of its own funds to increase the stake in Lisuan Tech. By subscribing to an additional 5 million yuan of Lisuan’s newly registered capital, the memory company will hold approximately 37.88% of Lisuan’s equity.

On the other hand, the report notes that other investors plan to inject a total of 128 million yuan to Lisuan, subscribing to a total of 3.2 million yuan in its newly added registered capital. In total, Lisuan Tech has received 328 million yuan in financing from Dosilicon and others.

Regarding the reasons behind the investment, the report indicates that there is a certain level of synergy between Dosilicon and its target company, Lisuan Tech. As Dosilicon has already established a portfolio of both standard and niche DRAM products, its R&D team can further engage in technical collaboration with the graphics rendering chip design team at Lisuan to enhance the design capabilities of both parties.

The report, citing public information, states that Lisuan Tech, with 20 years of experience in GPU development and design, is one of the few domestic companies in China capable of providing customized high-performance GPU solutions.

The firm’s first 6nm GPU, based on its self-developed ‘Pangu’ architecture, is ready for tape-out, the report suggests. The product even boasts to offer performance on par with NVIDIA’s high-end graphics cards.

However, due to delays in securing financing, the company has fallen into difficulties, with rumors circulating that it was facing bankruptcy.

According to the data cited by the report, in 2023, Lisuan had no revenue and a net loss of 145 million yuan. In the first half of 2024, it reported no revenue and a net loss of 97.9 million yuan. The bulk of the losses was said to stem from R&D investments.

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• [News] ASML Claims the World Counts on China for Legacy Chips; So Do Chip Equipment Giants
• [News] China Makes Progress in Chip Tool Self-Sufficiency, Yet Lithography Remains a Key Bottleneck

(Photo credit: Lisuan Tech)

As semiconductor giants, including Intel, TSMC and Samsung, have been competing fiercely in the Angstrom era for advanced nodes, the progress on their adoption of ASML’s High-NA EUV (high-numerical aperture extreme ultraviolet) equipment has been brought back into spotlight lately. However, the semiconductor market, which seems to get more polarized in the meantime, may rely more on China than most people have imagined.

ASML: China is Ten Years behind the U.S. regarding Cutting-edge Chips

In May, without the assistance for extreme ultraviolet (EUV) lithography machines manufactured by ASML, China’s largest foundry, SMIC, is rumored to produce 5nm chips for Huawei this year. However, ASML’s CEO has denied the possibility that China would be able to replicate EUV technology.

According to an interview by Germany media Handelsblatt in July, ASML CEO Christophe Fouquet stated that the EUV technology, which the Dutch semiconductor heavyweight boasts of, is highly complex. Wccftech, citing Fouquet’s remarks in the interview, noted that it would be extremely difficult for China to replicate because the country lacks the know-how.

Citing Fouquet, the reports noted that regarding the development of cutting-edge chips, China is about ten years behind the U.S.

The World in Dire Need of the Legacy Chips Produced by China

However, Fouquet argued that chip buyers, including those in the German automotive industry, are in need of older generation computer chips, an area in which Chinese chipmakers are currently increasing their investments.

His remarks highlight the importance of China’s semiconductor production for global markets, which may still thrive under U.S. export restrictions.

According to the reports, Fouquet stated that though global demand for the legacy chips have been soaring dramatically, Europe cannot even meet half of its own needs. As manufacturing these chips is not very profitable, Western firms are not investing enough in the sector, Fouquet said.

Therefore, neither did he agree with the extensive, tightening chip controls recently. Fouquet noted that it doesn’t make sense to prevent someone from producing something you need.

Peter Wennink, former CEO of ASML, stated in July that the chip war between China and the US lacks factual basis and is entirely driven by ideology. Wennink also anticipated that this chip war will not be resolved anytime soon and could potentially persist for decades.

China Contributes up to 50% Revenue of the World’s Top 5 Chip Equipment Makers

Take a look at the latest financial results of the world’s top semiconductor equipment manufacturers, and we may find where the strong momentum of China has led to.

ASML, as the world’s exclusive EUV provider, reported second-quarter earnings and sales (USD 6.8 billion) that beat forecasts, as AI chips drives up demand for the Dutch firm’s critical semiconductor making equipment.

More importantly, regarding ASML’s sales in lithography units in the second quarter of 2024, China emerged as the largest market, as it contributed 49% of the revenue, higher than South Korea’s 28% and Taiwan’s 11%.

It is worth noting that a year ago, in the second quarter of 2023, China only accounted for 24% of ASML’s sales in lithography units, while Taiwan and South Korea contributed 34% and 27%, respectively. The results, in a way, have reflected China’s ambition and importance in chip making, as Fouquet noted.

Despite export controls, China has also become the largest market by region for U.S. semiconductor equipment giant, Applied Materials. In the second quarter, China accounted for 43% of its total sales of Applied Materials, a 22 percentage point increase YoY, while Taiwan and South Korea contributed 15% and 15%, respectively.

The dominance of the Chinese market is also evident with other major semiconductor equipment makers. China contributed 39% of Lam Research’s revenue in the June quarter, 2024, much higher than 26% a year ago.

Tokyo Electron, on the other hand, attributed as high as 49.9% revenue to China for the first quarter of its 2025 fiscal year, compared with 39.3% a year ago. China accounted for 44% of KLA’s revenue in the June quarter, 2024.

As DUV systems, which have not been extensively regulated, can still be applied to nodes down to 7nm, or even 5nm, Chinese chipmakers, with the support of government, may continue to hold a significant position in the global semiconductor ecosystem.

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• [News] ASML Former CEO Predicts Chip War Between China and the US May Persist for Decades
• [News] US to Lobby Netherlands and Japan to Contain China’s Chip Development, Focusing on HBM

As global competition heats up in the AI sector, an emerging power has now joining the battlefield. Ola, an automotive manufacturer in India, plans to launch the country’s first in-house AI chip by 2026, which is based on ARM architecture, according to a report by Wccftech.

Though there are more details yet to be revealed, the report notes that Ola did highlight its key chip offerings, featuring the Bodhi series, which would be the nation’s first self-developed AI chips. The company’s product lineup also reportedly includes the Sarv-1 cloud-native CPUs and the Ojas edge AI chip.

When asked about the potential foundry partners in the future, Ola’s CEO Bhavish Aggarwal mentioned that the company plans to collaborate with a global tier I or II foundry, likely TSMC or Samsung, according to the report.

Ola’s AI lineup is expected to start with the Bodhi-1 AI chip, which is specifically designed for large-scale LLMs, with a focus on inferencing workloads, Wccftech suggests. Positioned as a low-to-mid-tier offering from Ola, the chip is said to be launched by 2026, followed by a more potent successor, the Bodhi-2, slated to be released in 2028.

According to Wccftech, it is worth noting that Ola also introduced an edge AI chip named Ojas, which is likely to be integrated into Ola’s next-generation electric vehicles. In addition, the Sarv-1, specifically designed for cloud computing, is expected to feature ARM Neoverse N3 cores, though this hasn’t been confirmed yet, the report states.

As the world’s fifth largest economy, India seems to be relatively slow in developing its own AI chips. China, the world’s largest developing country, has quite a long history in developing in-house AI chips.

Chinese tech giant Huawei is said to be testing its latest processor, the “Ascend 910C,” with internet companies and telecom operators recently. Reportedly, the company has informed potential customers that this new chip is comparable to NVIDIA’s H100 GPU, which cannot be directly sold in China.

On the other hand, Baidu’s foray into AI chips can be traced back to as early as 2011. After seven years of development, Baidu officially unveiled its self-developed AI chip, Kunlun 1, in 2018. T-Head, owned by Alibaba, introduced its first high-performance AI inference chip, the HanGuang 800, in September 2019.

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• [News] Huawei Rumored to Launch New High-End AI Chip, Potentially Rivaling NVIDIA’s H100
• [News] Global Semiconductor Giants Eyeing India, Anticipating Three New Fabs Valued at USD 8-12 Billion

(Photo credit: Krutrim)

In early August, Taiwanese IC design giant MediaTek revealed its plan to unveil the Dimensity 9400 flagship series in October, designed to support most large language models on the market. Now more details regarding MediaTek’s ambition in AI have surfaced, as reports from Wccftech and Chinese media MyDrivers note that the company teams up with NVIDIA, targeting to launch their AI PC chip in the first half of 2025.

The reports indicate that the chip is currently in the design phase, with verification and sampling anticipated next quarter.

TrendForce projects that the Arm chip co-developed by MediaTek and NVIDIA, with adoption of Wi-Fi 7 and 5G, is slated to occupy a spot in the AI NB market since 2Q25, and initiate a new wave of technical innovation after 2025.

According to Wccftech, rumors about a custom chip from MediaTek for the AI PC market have been circulating for a while, and the excitement of the market skyrocketed when NVIDIA is reportedly joining the development.

The AI PC SoC is said to confront Qualcomm’s Snapdragon X Elite series. Wccftech suggests that the chip will be manufactured using TSMC’s 3nm node, based on ARM architecture.

With AI giant NVIDIA involved, the SoC is also likely to achieve breakthroughs in the integrated graphics arena, the report says. In addition, the report also notes that given MediaTek’s expertise in creating power-efficient mobile chips like the Dimensity 9400, the company may be well-equipped to develop a chip for the AI PC segment that delivers both strong performance and impressive efficiency.

MediaTek and NVIDIA are also collaborating on automotive chips, with plans to launch their first chip in early 2025. MediaTek CEO Rick Tsai mentioned earlier that though details are yet to be disclosed, significant advancements in the automotive sector are expected between 2027 and 2028.

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• [News] MediaTek Ventures into AI Accelerators, Aiming to Release Dimensity 9400 in October
• Penetration Rate of AI NBs to Arrive at 20% by 2025 as AI Applications Steadily Refine and Actuate Consumer Demand, Says TrendForce 

(Photo credit: MediaTek)

On August 8, 2024, Black Sesame Technologies, a company specializing in AI chip for smart vehicles, was listed on the Hong Kong Stock Exchange.

Founded in 2016, Black Sesame is a provider of automotive-grade intelligent vehicle computing chips and chip-based solutions. The company has established research and sales centers in Wuhan, Silicon Valley, Shanghai, Chengdu, Shenzhen, Chongqing, and Singapore.

Currently, Black Sesame has launched two major product lines: the Huashan series designed for autonomous driving and the Wudang series focused on cross-domain computing.

The SoCs of Huashan A1000 family is designed for autonomous driving and supports BEV fusion algorithms for L3 and below application scenarios.

The Huashan® A1000 automotive-grade high-performance autonomous driving chip applies to L2+ and L3 level autonomous driving, which is currently the most widely used autonomous driving chip in Chinese mass-produced car companies and the only local chip platform capable of backing integrated domain controllers with a single chip.

It’s reported that Huashan A1000 chip has been in full mass production and adopted by several leading Chinese car manufacturers, including FAW Group, Dongfeng Group, Geely Group, and JAC Group, and has been used in mass-produced models including Lynk & Co 08, Hycan V09, Dongfeng eπ007, and its first pure electric SUV Dongfeng eπ008. The next-generation SoC, Huashan A2000, is currently under development and is expected to be launched in 2024.

The Wudang C1200 family of intelligent vehicle cross-domain computing chips was rolled out in April 2023. It has completed full testing after tape-out, with successful functional and performance verification, and sample chips are now available to customers.

As an “All in one” chip, the C1200 family targets multi-domain integration and cross-domain computing, covering core scenarios of intelligent vehicles with a single chip and thus empowering smart vehicles as a whole. Black Sesame expects to generate revenue from C1200 in 2024 and achieve mass production before 2025.

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• [News] China Reportedly Demands Automakers Increase Local Chip Procurement to 25%
• [News] Chip to be the Game Changer in EV Market, Battery Becomes the Past

(Photo credit: Black Sesame Technologies)